MC145010P Photoelectric Smoke Detector IC | NXP
料号： MC145010P ✗ 停产MC145010P 概述
A photoelectric smoke detector IC is a specialized sensor-interface and signal-processing component. Unlike a simple photointerrupter, it coordinates an infrared light source, an optical chamber, and detection electronics within the broader smoke-alarm system. The MC145010 family belongs to the CMOS integrated-circuit hierarchy and is intended for compact, low-power residential and commercial alarm equipment where response accuracy and standby power are important.
The principal operating characteristics include very-low-power CMOS circuitry, a 12 µA supply current, photoelectric input sensing, voltage output, and an I/O pin that can be interconnected with other detector units. The I/O arrangement permits up to 40 units to share common signaling according to the manufacturer documentation. A local smoke condition activates the short-circuit-protected I/O driver to notify remotely connected units and can also support functions such as escape-light activation.
Technically, the MC145010P combines analog detection functions with digital control and signaling in one package. The analog section interfaces with the infrared photoelectric chamber, while the digital section manages detector behavior, output signaling, and inter-unit communication. This integration reduces the number of discrete components required in a smoke-alarm design while maintaining a very-low 12 µA supply current. Its 16-pin DIP format also supports through-hole assembly and hand-repairable industrial appliance construction.
Typical applications include residential photoelectric smoke alarms, commercial building alarm panels, interconnected multi-unit smoke-detection systems, and low-power safety appliances. The device is particularly appropriate where an infrared chamber is used instead of an ionization chamber and where low standby consumption supports long-lived battery operation. The I/O function can connect detectors across a larger installation so that a local alarm condition can be communicated to remote units.
When designing around the MC145010P, follow the manufacturer pin-description and maximum-rating tables when assigning chamber, supply, output, and I/O connections. Preserve the recommended bypass and interconnection arrangements, and verify that the detector’s electrical thresholds match the selected chamber and infrared emitter. Because the I/O line can connect multiple units, check noise immunity, fault propagation, and short-circuit behavior across the completed system.
This page organizes the product specifications, sourcing information, application guidance, and verified references for engineers evaluating the MC145010P. It also distinguishes a verified drop-in replacement from related parts that cannot be assumed to share the same footprint, preventing a functionally similar component from being treated as a safe PCB-level substitution.
直接替换替代料： MC145010P ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
该产品暂无直接替换替代料。
请求替代料MC145010P 规格参数
| Product Type | Photoelectric smoke detector integrated circuit with I/O |
| Input Type | Photoelectric |
| 输出类型 | Voltage |
| 电源电流 | 12 µA |
| Technology | CMOS |
| 封装 | 16-DIP, 0.300 inch pitch, 7.62 mm |
| Terminal Count | 16 terminals |
| 安装类型 | Through-hole DIP |
| Packaging | Tube |
| 接口 | Dedicated I/O interface |
| I/O Unit Interconnection Capacity | Up to 40 units |
| I/O Fault Protection | Short-circuit-protected I/O driver |
| Optical Sensing Method | Infrared photoelectric chamber |
| Surface Mount | No |
MC145010P 16-dip, 0.300 inch pitch, 7.62 mm 引脚配置指南
MC145010P（16-dip, 0.300 inch pitch, 7.62 mm 封装）的引脚配置。 引脚编号、功能和连接图在制造商数据手册中定义。请参阅该手册以了解确切的封装尺寸和焊接指南。
暂无详细引脚数据： MC145010P.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MC145010P 适用于 6 应用s: Residential Photoelectric Smoke Alarm, Interconnected Multi-Unit Alarm Network, Low-Power Residential Safety Appliance, Commercial Building Smoke-Detection Module, Portable Battery-Operated Alarm, Alarm Panel Remote Detector Interface.
Residential Photoelectric Smoke Alarm
The MC145010P fits a residential smoke alarm that uses an infrared photoelectric chamber rather than an ionization detector. Its CMOS detection circuitry and specified 12 µA supply current help limit standby demand when the alarm is battery powered. The 16-DIP package supports through-hole assembly, while the voltage output can be routed into the alarm and indicator circuitry. The complete design must also budget current for the infrared emitter, audible alarm, and status LED. Check the detector’s thresholds and timing against the final chamber geometry before production because chamber optics, ambient light, and dust can affect signal behavior.
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Interconnected Multi-Unit Alarm Network
The MC145010P is suited to buildings in which smoke detectors communicate over a shared signaling line. The manufacturer documentation states that the I/O pin can interconnect as many as 40 units, and the short-circuit-protected driver reports a local smoke condition to remote units. The on-chip current sink also improves noise immunity when the I/O line is used as an input. System design must preserve the recommended common-line configuration and account for line faults, activation timing, and alarm propagation. Verify compatibility with the master alarm panel and all attached detector models before using a mixed-brand installation.
推荐
Low-Power Residential Safety Appliance
The MC145010P can serve as the sensing element in a low-power residential safety appliance designed around an infrared smoke chamber. Its 12 µA supply current is the key power-budget parameter, while the integrated analog and digital functions reduce the component count compared with a discrete photodetection circuit. Because standby current influences battery life, engineers should calculate the complete sleep-state load, including any LEDs, backup-alarm circuitry, and chamber emitter drivers. The device’s through-hole DIP package is also useful where wave-flow or manual assembly methods are preferred over fine-pitch surface-mount assembly.
推荐
Commercial Building Smoke-Detection Module
A commercial building detector module can use the MC145010P when the design requires local photoelectric sensing plus remote signaling through the I/O line. The device supports voltage output and can communicate a local smoke condition to other detectors, which is useful for coordinated building alarms. Designers should treat the chamber and emitter as part of the sensing system and evaluate smoke response, ambient-light rejection, and signal thresholds for the intended enclosure. The I/O fault protection helps improve robustness, but the complete installation still needs suitable wiring, termination, supervision, and panel compatibility to avoid nuisance alarms or missed events.
推荐
Portable Battery-Operated Alarm
The MC145010P can be used in a portable battery-operated alarm where low quiescent consumption and infrared optical detection are important. The 12 µA supply current leaves more of the battery budget for deliberate alarm events, while the voltage output provides a signal for the portable unit’s alarm logic. A portable enclosure requires careful control of optical leaks and ambient light because chamber performance can change with orientation. Confirm the power polarity, supply limits, reset behavior, and I/O use in the manufacturer documentation before finalizing the PCB. If the enclosure does not use a photoelectric chamber, this IC is not the appropriate sensing element.
推荐
Alarm Panel Remote Detector Interface
The MC145010P can act as a remote detector element in a wired alarm panel architecture, using its I/O function to report local smoke events to a central panel. The manufacturer datasheet identifies support for common signaling among as many as 40 interconnected units and describes short-circuit protection on the I/O driver. This makes the device relevant to distributed detection networks where remote units need to participate in a common alarm event. Panel engineers should validate line voltage, polarity, noise immunity, maximum unit count, and fault behavior for the deployed wiring. The 16-DIP package favors through-hole construction in detector modules rather than compact surface-mount detector boards.
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推荐产品汇总
工程参考数据： MC145010P ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 |
|---|---|
| Brand | NXP Semiconductors |
| Package | 16-DIP (0.300 inch, 7.62 mm) |
| Product Type | Photoelectric smoke detector IC with I/O |
| Input Type | Photoelectric |
| Output Type | Voltage |
| Supply Current | 12 µA |
| Technology | CMOS |
| Mounting Type | Through-hole DIP |
| I/O Unit Interconnection Capacity | Up to 40 units |
| I/O Fault Protection | Short-circuit-protected I/O driver |
关键差异点
- Integrated photoelectric sensing and remote signaling （对比 MC14500BCP)
- Protected distributed-alarm I/O （对比 MC145010DW)
- Very-low-power CMOS detector interface （对比 Generic smoke-detector interface ICs)
设计说明
Follow the NXP MC145010 datasheet when assigning the 16 DIP pins to the chamber, supply, voltage output, and I/O functions. Keep the I/O trace away from noisy switching nodes and route it consistently with the grounding scheme shown in the manufacturer documentation. Because the I/O line can support common signaling among as many as 40 units, inspect the assembled board for accidental shorts between detector modules before energizing the alarm network.
The specified 12 µA supply current applies to the MC145010P and should be included in the complete detector power budget. Add the infrared-emitter, alarm, indicator, and panel-interface currents under both standby and alarm conditions to estimate battery life. Place the required bypass capacitor at the device supply pins and follow the manufacturer’s polarity and grounding guidance to prevent switching transients from producing false detector events.
Treat the photoelectric chamber, emitter, and detector optical path as part of the PCB-level design. Avoid placing reflective solder mask, copper, labels, or enclosure structures where they can redirect infrared light into the sensing region. Maintain consistent chamber geometry and component placement between units so that production variations do not shift the threshold relationship. Validate both the empty enclosure and final assembled product under representative ambient-light conditions.
Do not substitute a related smoke-detector IC solely because it has a similar catalog description. Verify the 16-DIP footprint, every pin function, chamber interface, voltage-output behavior, supply limits, and I/O topology against the NXP MC145010 datasheet. A package or family similarity alone does not establish pin-to-pin compatibility. For mixed installations, also confirm master-panel line voltage, polarity, maximum unit count, and fault signaling before field deployment.
合规信息
The catalog information identifies a legacy NXP smoke-detector IC in tube packaging but does not provide an unambiguous environmental-compliance statement.
