MC68EC060ZU75 - 75MHz 32-bit M680x0 MPU, 304-TBGA | NXP / Freescale
料号： MC68EC060ZU75 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $437.71 | $437.71 |
| 10 | $425 | $4,250.00 |
| 100 | $410 | $41,000.00 |
| 250 | $395 | $98,750.00 |
| 500 | $380 | $190,000.00 |
MC68EC060ZU75 概述
A microprocessor (MPU) is a single-chip CPU that fetches, decodes, and executes instructions from external memory and is the central processing unit of an embedded computing system. Within the wider MPU hierarchy, the M68k family sits alongside PowerPC, ARM, and MIPS as one of the canonical 32-bit CISC/RISC architectures; the MC68EC060ZU75 belongs to the M680x0 family, specifically the EC060 embedded-controller sub-line of the superscalar sixth-generation 680x0 series. It is targeted at systems that need raw M68k software compatibility without the FPU or PMMU requirements of the full MC68060.
Key features include 75 MHz core clock, 3.3 V I/O and core supply, 304-ball TBGA (also listed as 304-LBGA, 31x31 mm), superscalar dual-instruction issue, branch prediction with a 256-entry branch target cache, integrated 8 KB unified cache, and a 32-bit external data bus. Compared with earlier 68040 designs the EC060 typically delivers roughly 2-3x integer Dhrystone MIPS at equivalent clock, while keeping binary compatibility with the 68k instruction set.
The architecture is a 4-stage superscalar pipeline with out-of-order completion, supporting the full M680x0 user instruction set. Burst-mode memory transfers, hardware MMU, and integrated cache reduce external bus traffic, which is critical at 75 MHz on a 32-bit external bus where un-cached accesses dominate throughput.
Typical applications include industrial control, legacy M68k embedded controllers, avionics retrofits, telecommunications line cards, point-of-sale terminals, and VME/cPCI single-board computers that maintain a 68k software base. The 3.3 V supply and high pin-count TBGA make it a drop-in part for existing 68060 board designs that do not require the on-die FPU.
When designing with the MC68EC060ZU75, pay attention to TBGA PCB layout - the 1.27 mm ball pitch demands four or more routing layers with microvia technology to escape the inner ball rows. Provide robust 3.3 V decoupling, and verify that any heatsink thermal solution accommodates the 31x31 mm package footprint.
This page synthesises distributor pricing, same-package drop-in alternatives (including same-speed/lower-speed 68060 variants), and practical layout guidance not found in the manufacturer datasheet alone.
直接替换替代料： MC68EC060ZU75 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
MC68EC060ZU50
✅ 直接替换📋 参考替代料（不在目录中）
MC68EC060ZU66
✅ 直接替换📋 参考替代料（不在目录中）
MC68EC060RC75
✅ 直接替换📋 参考替代料（不在目录中）
MC68LC060ZU75
✅ 直接替换📋 参考替代料（不在目录中）
MC68EC060ZU75B
✅ 直接替换📋 参考替代料（不在目录中）
MC68EC060ZU75 最大额定值与电气特性
| Processor Type | M680x0 32-Bit |
| Core | 68060 (EC060 Embedded Controller variant) |
| Core Count | 1 |
| 最大时钟频率 | 75 MHz |
| 工作电源电压 | 3.3 V |
| Architecture | Superscalar, dual-instruction issue |
| Instruction Set | M680x0 / 68k (full user ISA) |
| On-chip Cache | 8 KB unified instruction/data |
| Memory Management Unit | Integrated MMU |
| External Data Bus Width | 32-bit |
| 封装 | 304-TBGA (31x31 mm), also listed as 304-LBGA |
| 安装类型 | Surface Mount |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| RoHS 状态 | RoHS Non-Compliant |
MC68EC060ZU75 304-tbga (31x31 mm), also listed as 304-lbga 引脚配置指南
MC68EC060ZU75（304-tbga (31x31 mm), also listed as 304-lbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MC68EC060ZU75.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MC68EC060ZU75 适用于 6 应用s: Industrial Control / SCADA Systems, Avionics / Legacy M68k Retrofits, VME / cPCI Single-Board Computers, Telecommunications Line Cards, Point-of-Sale Terminals and Kiosks, Test & Measurement Instrumentation.
Industrial Control / SCADA Systems
The MC68EC060ZU75's 75 MHz superscalar 68k core delivers roughly 110 Dhrystone MIPS, well above the headroom needed for PLC scan loops, ladder-logic emulation, and SCADA protocol stacks such as Modbus/TCP on a single MPU. The integrated MMU supports protected process spaces required by modern RTOS schedulers (VxWorks, RTEMS, OS-9), and the 8 KB unified cache absorbs the deterministic bus traffic of 32-bit I/O scans. With 3.3 V supply and 304-TBGA (31x31 mm) footprint, it drops into long-life industrial backplanes that have standardised on the 68060 architecture since the late 1990s. Pair with external SRAM and Flash via the 32-bit data bus for sustained deterministic response.
推荐
Avionics / Legacy M68k Retrofits
Many military and commercial avionics platforms run flight-control, FMS, and display software on legacy 68040/68060 boards. The MC68EC060ZU75's full 68k ISA compatibility allows legacy binary flight code to run unchanged, while the 75 MHz superscalar pipeline delivers 2-3x the integer throughput of older 68040 systems at the same board footprint. The 304-TBGA package survives aerospace thermal cycling (-55 C to +125 C) and the integrated MMU enables DO-178C memory partitioning for safety-critical partitions. Substituting the EC060 in place of an end-of-life 68040 PCMCIA-style board requires only a socket adapter and 3.3 V rail.
推荐
VME / cPCI Single-Board Computers
The MC68EC060ZU75 is a workhorse CPU for VMEbus and cPCI SBCs targeting telecom, defence, and lab-automation racks. Its 32-bit multiplexed address/data bus, dual interrupt acknowledge lines (IPL[2:0]), and 75 MHz clock deliver the throughput needed for VME64 master/slave cycles, while the integrated MMU supports the VxWorks and LynxOS-178 POSIX environments that dominate the VME SBC software base. The 304-TBGA (31x31 mm) footprint is industry-standard for 6U VME SBCs, allowing board designers to alternate between full MC68060 (with FPU), MC68LC060 (FPU only), and MC68EC060 (MMU only) without respinning the carrier.
推荐
Telecommunications Line Cards
The MC68EC060ZU75's integrated MMU, 8 KB cache, and deterministic 68k interrupt handling make it a fit for legacy telecom line cards - DSLAMs, SS7 signalling controllers, and PBX backplanes - where 68k binary compatibility is locked in by decades of carrier-certified code. At 75 MHz the EC060 comfortably runs an SS7 stack plus control-plane management concurrently, and the 3.3 V core helps line-card power budgets. The 304-TBGA package allows dense placement alongside DSP pools and framer ASICs on double-sided line-card PCBs.
推荐
Point-of-Sale Terminals and Kiosks
POS terminals running OS-9 or pSOS+ on a 68k core are an entrenched installed base; the MC68EC060ZU75 lets OEMs roll out faster check-out hardware without porting their application base. The 75 MHz superscalar pipeline accelerates barcode/credit-card transaction stacks, while the integrated MMU enables hardened memory protection between payment and loyalty applications. The 304-TBGA package is the same footprint OEMs already qualify on, so end-of-life 50/66 MHz 68040 boards can be field-upgraded to 75 MHz EC060 with a socket adapter.
推荐
Test & Measurement Instrumentation
Legacy oscilloscopes, protocol analysers, and bench-top instruments built on the 68k architecture leverage the MC68EC060ZU75 as a control-plane CPU where deterministic interrupt response (the 68k's hallmark) is more important than raw throughput. The integrated MMU supports a protected kernel/userspace split for RTOS-driven instrument firmware, while the 75 MHz clock handles UI rendering, GPIB/Ethernet stack, and acquisition triggering concurrently. The 304-TBGA (31x31 mm) footprint integrates cleanly next to ADC and DAC sub-systems on the same board.
推荐
推荐产品汇总
工程参考数据： MC68EC060ZU75 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MC68EC060ZU50 | MC68EC060ZU66 | MC68EC060RC75 | MC68LC060ZU75 | MC68EC060ZU75B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 304-TBGA (31x31) | 304-TBGA (31x31) - same | 304-TBGA (31x31) - same | 304-TBGA (31x31) - same | 304-TBGA (31x31) - same | 304-TBGA (31x31) - same |
| Maximum Clock Frequency | 75 MHz | 50 MHz | 66 MHz | 75 MHz | 75 MHz | 75 MHz |
| Core Architecture | 68060 EC (MMU, no FPU) | 68060 EC (MMU, no FPU) | 68060 EC (MMU, no FPU) | 68060 EC (MMU, no FPU) | 68060 LC (FPU, no PMMU) | 68060 EC (MMU, no FPU) |
| Operating Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| On-die FPU | No | No | No | No | Yes | No |
| MMU / PMMU | MMU (yes) | MMU (yes) | MMU (yes) | MMU (yes) | PMMU (yes) | MMU (yes) |
关键差异点
- Embedded-controller variant optimised for cost-sensitive 68k systems （对比 MC68LC060ZU75)
- Highest stock 75 MHz speed grade in the 304-TBGA package （对比 MC68EC060ZU66)
- Integrated MMU supports protected-mode RTOS （对比 MC68EC060ZU50)
设计说明
The 304-TBGA package uses 1.27 mm ball pitch on a 31x31 mm body, so the inner ball rows are NOT directly accessible on a 2-layer PCB. Plan a 6-layer stack-up with at least two inner signal layers dedicated to BGA escape and a 3.3 V power plane on a dedicated layer. Use microvias (laser-drilled, 0.1 mm pad) for inner-row fan-out; conventional through-vias will not fit between balls. Match the substrate CTE to FR-4 (13-16 ppm/C) and verify that the PCB fab supports BGA-grade solder mask dams.
The MC68EC060ZU75 specifies 3.3 V for both core and I/O; design the power tree with a low-impedance 3.3 V plane and place 10 uF bulk plus 100 nF high-frequency ceramic decoupling within 5 mm of the BGA. Sequence the 3.3 V rail to ramp monotonically in <100 ms to avoid on-die latch-up; the part is NOT 5 V tolerant on I/O, so any 5 V peripheral interfaces must use external level shifters. Estimated core current at 75 MHz is approximately 400-500 mA based on M68060 family datasheet typical values - verify against your specific silicon revision.
Estimated: at 3.3 V and 75 MHz, the EC060 dissipates roughly 1.5 W worst-case. The 304-TBGA exposes the die through the bottom of the package (no top-side heat spreader), making thermal relief entirely dependent on PCB copper area and airflow. Attach a thermal pad under the BGA with stitched thermal vias to the inner ground plane (at least 25 vias in a 5x5 array under the die shadow). For sealed industrial enclosures plan for 1 m/s minimum airflow across the BGA.
Common pitfalls: (1) Mistaking 'ZU' for a QFP package suffix - it is the 304-TBGA ball-grid designation. (2) Assuming any 68060 is 5 V tolerant - the EC060 is 3.3 V only. (3) Forgetting that the EC060 lacks the FPU; OS or firmware that issues FPU line-A instructions will trap. (5) Using non-leaded (Pb-free) variants without verifying that the TBGA ball finish is solder-compatible with your reflow profile. Always cross-check the M68060 errata list against your silicon mask revision before locking the BOM.
At 75 MHz with a 32-bit multiplexed address/data bus, the MC68EC060ZU75 drives heavily-loaded bus lines (multiple SRAM/Flash devices). Series-terminate the address and data lines at the MPU outputs with 22-33 ohm resistors to damp reflections; keep stubs short (<25 mm) and route data and clock lines as length-matched as possible. The CLK input pin is particularly sensitive to jitter - use a dedicated clock buffer with sub-100 ps jitter rather than chaining from a slower oscillator.
合规信息
Per Digchip datasheet mirror: RoHS Non-Compliant, Contains Lead. AEC-Q100 not applicable for legacy MPU family. REACH, halogen, and conflict-mineral status not stated in the verified web data.
