MC7448HX1250ND - PowerPC G4 MPU 1.25GHz 1MB L2 | NXP
料号： MC7448HX1250ND ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $636.99 | $636.99 |
| 10 | $580 | $5,800.00 |
| 100 | $495 | $49,500.00 |
| 500 | $410 | $205,000.00 |
| 1,000 | $360 | $360,000.00 |
MC7448HX1250ND 概述
What is a PowerPC microprocessor? A PowerPC microprocessor is a reduced instruction set computer (RISC) CPU based on the Power Architecture instruction set developed jointly by Apple, IBM, and Motorola. The MPC74xx line (PowerPC G4) targets high-performance embedded applications that require deterministic compute, large L2 caches, and AltiVec SIMD acceleration - placing it in the hierarchy: PowerPC -> RISC MPU -> microprocessor -> integrated circuit -> semiconductor. The MPC7448 is the most significant update to the MPC74xx line to date, manufactured on 90 nm SOI for lower power and higher frequency.
Key features include a 32-bit Power Architecture core at 1.25 GHz, 1 MB of unified L2 cache, the AltiVec vector engine for single-instruction multiple-data (SIMD) workloads, an MPX/60x system bus for high-bandwidth memory and I/O, and a low 1.1 V core voltage. Power dissipation is managed through dynamic frequency scaling and deep power-down states, allowing the part to fit thermal envelopes as low as approximately 7 W typical. Hardware virtualization, MMU, and on-chip debug are standard.
Architecturally, the MPC7448 expands the original MPC7410/MPC7447 pipeline with a wider issue width, enhanced branch prediction, and a dedicated L2 prefetch engine that sustains throughput on cache-miss workloads. The 90 nm SOI process reduces leakage current compared with earlier 130 nm G4 parts, while preserving software compatibility across the MPC74xx family. The MPX bus scales to 200 MHz and supports multiprocessor coherency, allowing two MPC7448 devices to be paired for symmetric multiprocessing.
Typical applications include network routing and switching line cards, telecom baseband and control-plane processing, military/aerospace ruggedized compute modules, industrial machine vision, and high-end imaging or print controllers. AltiVec also accelerates DSP-style inner loops in software-defined radio and video preprocessing.
When designing with this device, provision a robust thermal solution because FCCBGA-360 packages dissipate significant power at 1.25 GHz. Maintain a stable 1.1 V core rail with low ripple, route the MPX bus with controlled impedance, and follow NXP layout guidelines for BGA decoupling and clock distribution.
This page synthesizes distributor pricing, same-family drop-in alternatives, and design guidance not found in the bare datasheet - giving engineers a single reference for EOL risk, second-source options, and practical layout considerations for the MC7448HX1250ND.
直接替换替代料： MC7448HX1250ND ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MC7448HX1250ND （相同外形与封装尺寸） ——差异在于 Core Architecture, Mounting Type, Package, Process Technology, SIMD Engine.
快速对比工具——选择替代料号进行并排对比：
MC7448HX1400ND
✅ 直接替换📋 参考替代料（不在目录中）
MC7448HX1267ND
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC7448HX1167ND
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC7448HX1000ND
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$235.8 / 个
查看数据手册 →MPC7448VS1267ND
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC7448HX1250ND 最大额定值与电气特性
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Series | MPC7448 (PowerPC G4) |
| Core Architecture | 32-bit Power Architecture (PowerPC G4) |
| Core Count | 1 |
| Maximum Core Frequency | 1.25 GHz |
| L2 Cache Size | 1 MB (unified, on-chip) |
| Process Technology | 90 nm Silicon-on-Insulator (SOI) |
| System Bus | MPX/60x, up to 200 MHz |
| SIMD Engine | AltiVec (VMX) |
| Core Voltage (Vdd) | 1.1 V |
| 工作温度 | -40C to +105C |
| 封装 | 360-ball FCCBGA (25x25 mm) |
| 安装类型 | Surface Mount (BGA) |
MC7448HX1250ND 360-ball fccbga (25x25 mm) 引脚配置指南
MC7448HX1250ND（360-ball fccbga (25x25 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MC7448HX1250ND.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MC7448HX1250ND 适用于 6 应用s: Network Routing & Switching Line Cards, Telecom Baseband & Control-Plane Processing, Military & Aerospace Ruggedized Compute, Industrial Machine Vision Systems, High-End Imaging & Print Controllers, Software-Defined Radio (SDR) Front-Ends.
Network Routing & Switching Line Cards
The MC7448HX1250ND's 1.25 GHz PowerPC G4 core with AltiVec SIMD accelerates packet header parsing, route-lookup, and QoS classification in enterprise routing line cards. The MPX/60x bus sustains 200 MHz transfers to external DDR memory and lookup ASICs, while 1 MB of L2 cache keeps routing tables hot for low-latency forwarding. Power consumption around 7-10 W fits NEBS-compliant chassis thermal budgets.
推荐
Telecom Baseband & Control-Plane Processing
In 3G/4G base stations and control-plane blades, the MC7448HX1250ND provides deterministic single-thread performance for signaling stacks and real-time control loops. AltiVec accelerates DSP inner loops for channel decoding and modulation, while the 32-bit PowerPC ISA preserves software compatibility with legacy VxWorks and Linux BSPs deployed across telecom fleets.
推荐
Military & Aerospace Ruggedized Compute
The MC7448HX1250ND's industrial -40C to +105C operating range and 90 nm SOI radiation-tolerant design make it suitable for avionics, unmanned vehicle control, and ruggedized mission computers. The 360-ball FCCBGA package withstands high-vibration environments when paired with underfill, and the PowerPC ISA enjoys a long heritage of MIL-spec BSPs and real-time OS support.
推荐
Industrial Machine Vision Systems
AltiVec SIMD engine on the MC7448HX1250ND delivers up to 8 GFLOPs of single-precision throughput for image preprocessing, edge detection, and pattern matching in factory-floor machine vision. The 1 MB L2 cache holds multi-megapixel frame buffers in flight, while the deterministic PowerPC pipeline supports hard-real-time inspection cycles under 10 ms.
推荐
High-End Imaging & Print Controllers
The MC7448HX1250ND drives raster image processors (RIPs) in commercial and industrial printers by streaming large page buffers through its L2 cache and decompressing page-description languages via AltiVec. The MPX/60x interface connects to imaging ASICs and high-speed serializers, while the 1.25 GHz clock keeps multi-color print pipelines running at production speed.
推荐
Software-Defined Radio (SDR) Front-Ends
AltiVec SIMD acceleration on the MC7448HX1250ND executes FFT, modulation, and channelization kernels in real time for software-defined radio front-ends. The 1.25 GHz PowerPC core processes multiple MHz of spectrum bandwidth, while the MPX/60x bus streams baseband samples to ADC/DAC companion chips. Deterministic interrupt latency supports time-sensitive protocol stacks.
推荐
推荐产品汇总
工程参考数据： MC7448HX1250ND ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MC7448HX1400ND | MC7448HX1267ND | MC7448HX1167ND | MC7448HX1000ND | MPC7448VS1267ND |
|---|---|---|---|---|---|---|
| Package | 360-FCCBGA (25x25 mm) | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 1.25 GHz | 1.40 GHz | 1.267 GHz | 1.167 GHz | 1.00 GHz | 1.267 GHz |
| L2 Cache | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| Process Technology | 90 nm SOI | 90 nm SOI | 90 nm SOI | 90 nm SOI | 90 nm SOI | 90 nm SOI |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | VID-controlled |
| AltiVec SIMD | Yes | Yes | Yes | Yes | Yes | Yes |
| System Bus | MPX/60x up to 200 MHz | MPX/60x up to 200 MHz | MPX/60x up to 200 MHz | MPX/60x up to 200 MHz | MPX/60x up to 200 MHz | MPX/60x up to 200 MHz |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
关键差异点
- Highest same-package clock in 7448 HX family （对比 MC7448HX1000ND)
- Same die, lower power versus 1.4 GHz binned part （对比 MC7448HX1400ND)
- Industrial temperature screening across -40C to +105C （对比 MPC7448VS1267ND)
设计说明
Estimated: at 1.25 GHz the MC7448HX1250ND dissipates approximately 7-10 W. For an FR4 PCB with the FCCBGA-360 package, theta_JA is typically around 15-25 C/W depending on copper area and via count. Mount a heatsink rated for at least 10 W continuous with thermal interface material, and keep junction temperature under 110C at the worst-case ambient. Verify with the NXP MPC7448 thermal model before final layout.
The 360-ball FCCBGA (25x25 mm) requires high-density fan-out routing. Use microvia stacks (laser-drilled 0.1 mm vias) to escape the inner rows of balls, and provide a solid ground/power plane pair beneath the package. Place at least eight 0.1 uF high-frequency ceramic decoupling capacitors within 5 mm of the package perimeter, plus bulk polymer or tantalum capacitors on each voltage rail.
Core voltage is 1.1 V with tight tolerance; use a buck converter with sub-2% load regulation. Provide a separate PLL supply rail filtered through a ferrite bead and bypassed with 10 uF + 0.1 uF. Sequence the MPX bus voltage and core voltage to avoid latch-up during power-up; consult the NXP MPC7448 hardware specifications addendum for the recommended sequencing order.
Do not confuse the MC7448HX1250ND with the lower-frequency MC7447AHX1000NB or MC7447ATHX1000NB - the 7447 family uses a 130 nm process, 512 KB L2, and runs at 1.0 GHz. Same package ballout but BIOS firmware differs. Also avoid confusing the 'HX' (industrial) suffix against 'VS' (VID-controlled voltage) variants - both share the same die but use different voltage regulation schemes.
合规信息
Compliance status not explicitly stated in the public MPC7448 hardware specifications addendum. NXP transitioned the family to lead-free packaging during its production life, but specific lot compliance should be verified via manufacturer certificate of conformance (CoC). AEC-Q100 is not applicable because this is an MPU, not an automotive-grade IC.
