最后一次采购通知: MC9S08QB4CTG 即将停产。最后下单日期: 联系我们. 查看可用的替代料号 →
NXP Semiconductors

MC9S08QB4CTG - S08 8-bit MCU, 4KB Flash, 20MHz CPU | NXP

料号: MC9S08QB4CTG ⚠ 最后一次采购
有现货 1-3 个工作日内发货
1.8 V to 3.6 V Vdss 16-pin TSSOP Package 20 MHz Speed 4 KB (4K x 8) Memory
低至 $1.82 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-20
批量定价
数量 单价 小计
1 $2.85 $2.85
10 $2.56 $25.60
100 $2.28 $228.00
500 $2.05 $1,025.00
1,000 $1.82 $1,820.00
ℹ️ 所有价格均以 USD 计价

MC9S08QB4CTG 概述

The NXP MC9S08QB4CTG is a member of the S08QB family of 8-bit microcontrollers built around the HCS08 central processing unit, integrating 4KB of on-chip Flash program memory and operating at CPU bus speeds up to 20 MHz. The device is housed in a 16-pin Thin Shrink Small Outline Package (TSSOP-16) and is optimized for cost-sensitive, low-power embedded designs that require basic digital I/O, on-chip analog peripherals, and a small code footprint. According to the NXP product page, the device supports operation from a wide supply range down to 1.8 V across the industrial temperature range, making it suitable for battery-powered and energy-harvesting applications.

A microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory, volatile RAM, and a fixed set of peripheral modules such as timers, ADCs, communication interfaces, and GPIO. The HCS08 core used in the MC9S08QB family is an enhanced 8-bit CISC architecture that is upward-compatible with the legacy HC08 instruction set, adding the BGND (background debug) command and improved indexing modes. MCUs sit at the bottom of the embedded computing hierarchy - below microprocessors (MPUs) - and are used wherever deterministic, low-cost, low-power control is needed in products such as appliances, sensors, and consumer electronics.

Key features of the MC9S08QB4CTG include a 20 MHz maximum CPU frequency, 4KB of Flash program memory with in-application programmability, on-chip RAM sized for typical low-end control loops, multiple low-power stop and wait modes that extend battery life, and integrated peripherals including timers, an ADC, and standard serial interfaces. The 16-pin TSSOP package exposes enough I/O for typical human-interface or sensor-interface designs while keeping the PCB footprint small.

The device is engineered around NXP's S08QB low-power platform, which targets sub-dollar BOM cost without sacrificing analog integration. The CPU's CISC architecture lets one instruction cover multi-byte operations, reducing Flash pressure for code-heavy but slow control loops. Low-power Run and Stop modes with peripheral wakeup extend battery life in duty-cycled applications, while the TSSOP-16 footprint supports both hand-solderable prototypes and fully automated SMT lines.

Typical applications include low-end consumer appliances, small-format remote controls and user-interface panels, battery-powered sensor interface boards, simple motor-control firmware using on-chip timers, and white-goods control boards in HVAC and kitchen-appliance segments. It also serves as a cost-optimized main controller in low-cost IoT end nodes where 4KB of Flash is sufficient.

When designing with this device, allocate Flash carefully: the 4KB program memory must fit boot, application, and any in-field reconfiguration code. Use the integrated background debug mode (BDM) for development and field firmware updates, but reserve enough Flash at the top of memory for a small bootloader if in-application updates are required.

This page synthesizes NXP product page data, distributor pricing, and drop-in S08 family alternatives in a single reference not found in any single manufacturer datasheet.

直接替换替代料: MC9S08QB4CTG ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: MC9S08QB4CTG (相同外形与封装尺寸) ——差异在于 Package, Operating Temperature Range, RAM, Core, Instruction Set.

NXP Semiconductors
Core: RS08 (8-bit)
对比 MC9S08QB4CTG →
NXP Semiconductors
Package: 28-pin SOIC
Operating Temperature Range: -40 °C to +85 °C
对比 MC9S08QB4CTG →
NXP Semiconductors
Package: 16-pin TSSOP (Tape and Reel)
Operating Temperature Range: -40C to +85C (industrial)
RAM: 256 bytes
对比 MC9S08QB4CTG →
NXP Semiconductors
Package: 8-SOIC
RAM: 256 B
Instruction Set: HC08 with added BGND instruction
对比 MC9S08QB4CTG →
NXP Semiconductors
Package: 20-pin TSSOP
RAM: 256 B
Core: HCS08 (8-bit)
对比 MC9S08QB4CTG →

快速对比工具——选择替代料号进行并排对比:

MC9S08QB8CWGR

✅ 直接替换 ⚠️ 规格未核验
📦 16-pin TSSOP-equivalent (WGR)
8 KB Flash vs 4 KB Flash on MC9S08QB4CTG (+100% program memory), same S08 core at 20 MHz

📋 参考替代料(不在目录中)

MC9S08QB4CWG

✅ 直接替换 ⚠️ 规格未核验
📦 16-pin TSSOP
Same die/package as MC9S08QB4CTG, tray packaging variant (CTG suffix = tape and reel)

📋 参考替代料(不在目录中)

MC9RS08KB8CWJ574

✅ 直接替换 ⚠️ 规格未核验
NXP Semiconductors
📦 16-pin TSSOP-equivalent
NXP Semiconductors (formerly Freescale) · RS08 (8-bit) · RS08KB · Flash · 8 KB (8K x 8) · 20 MHz · 20-SOIC (wide-body, 7.5 mm width) · Surface Mount

✓ 有现货

$0.74 / 个

查看数据手册 →

MC9S08QD4CSC

✅ 直接替换
NXP Semiconductors
📦 16-pin SOIC-equivalent (CS package)
S08 (HCS08), 8-bit CISC · 8-bit · 16 MHz · 4 KB (4K x 8) · 256 B · 3.3 V / 5 V · 10-bit · 4

✓ 有现货

联系询价

查看数据手册 →

S9S08SG4E2CTJ

✅ 直接替换
NXP Semiconductors
📦 20-pin TSSOP-equivalent
HCS08 (8-bit) · 40 MHz (36 MHz above 125 °C) · 4 KB (4K x 8) · 256 B · 2.7 V to 5.5 V · -40 °C to +85 °C · 20-pin TSSOP · Surface Mount

✓ 有现货

$1.85 / 个

查看数据手册 →

MC9S08QB4CTG 最大额定值与电气特性

CPU Core S08 (HCS08, 8-bit CISC)
Maximum CPU Frequency 20 MHz
Program Memory (Flash) 4 KB (4K x 8)
Operating Voltage Range 1.8 V to 3.6 V
工作温度范围 -40C to +85C
封装 16-pin TSSOP
安装类型 Surface Mount
On-chip Debug Background Debug Mode (BDM)
RoHS 状态 Compliant
Lead-Free Yes

MC9S08QB4CTG 引脚配置

TSSOP-16 Package Pinout Diagram TSSOP-16 4.4x5mm, P0.65mm, JEDEC MO-153. 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 TSSOP-16
引脚 1 VDD — Supply voltage (1.8 V to 3.6 V)
引脚 2 VSS — Ground reference
引脚 3 BKGD/MS — Background Debug Mode / Mode Select
引脚 4 RESET — Reset input, active-low
引脚 5 IRQ/TCLK — External interrupt / Timer clock
引脚 6 PTA0 — General-purpose I/O / peripheral channel
引脚 7 PTA1 — General-purpose I/O / peripheral channel
引脚 8 PTA2 — General-purpose I/O / peripheral channel
引脚 9 PTA3 — General-purpose I/O / peripheral channel
引脚 10 PTA4 — General-purpose I/O / peripheral channel
引脚 11 PTB0 — General-purpose I/O / peripheral channel
引脚 12 PTB1 — General-purpose I/O / peripheral channel
引脚 13 PTB2 — General-purpose I/O / peripheral channel
引脚 14 PTB3 — General-purpose I/O / peripheral channel
引脚 15 PTB4 — General-purpose I/O / peripheral channel
引脚 16 PTB5 — General-purpose I/O / peripheral channel

典型应用

MC9S08QB4CTG 适用于 6 应用s: Low-Cost Consumer Appliance Control, Remote Control and HMI Panels, Battery-Powered Sensor Interface Nodes, Simple Motor and Relay Control, White-Goods and HVAC Control Boards, Low-Cost IoT End-Nodes.

🏭

Low-Cost Consumer Appliance Control

The MC9S08QB4CTG fits low-end consumer appliance controllers such as coffee makers, hand-mixer drivers, and small kitchen gadgets where 4 KB of Flash is sufficient for the state machine and timing logic. Its 1.8 V to 3.6 V supply range lets the design run directly from a 3.3 V LDO or two alkaline cells, reducing BOM cost. The integrated 16-pin TSSOP footprint minimizes board area in tight-form-factor products, and the 20 MHz HCS08 core delivers enough headroom to service timers, ADC conversions, and serial peripherals for a complete appliance platform without external logic.

📱

Remote Control and HMI Panels

Remote controls and small human-machine-interface panels benefit from the MC9S08QB4CTG's small TSSOP-16 footprint and low-power S08 core, allowing direct battery operation from coin cells or two AA cells. The HCS08 CISC architecture keeps the keypad scanning and IR transmit code small enough to comfortably fit in the 4 KB Flash budget. The integrated timers and serial peripherals handle PWM-driven LCD backlight control and IR carrier generation. With Stop and Wait modes dropping current to microampere levels, the design can sit idle for months between user interactions.

🧩

Battery-Powered Sensor Interface Nodes

Battery-powered wireless sensor nodes using the MC9S08QB4CTG leverage its 1.8 V operation and low-power Stop modes to extend battery life into the multi-year range. The HCS08 core wakes on timer or external interrupts, reads an analog or digital sensor, and transmits via an external RF transceiver controlled by GPIO/SPI, then returns to sleep. The 4 KB Flash comfortably fits a simple duty-cycled sensor + transmit routine, while the TSSOP-16 package fits on the small PCBAs typical of these nodes. This application is one of the most common S08QB-family use cases.

⚡

Simple Motor and Relay Control

Small brushed-DC, stepper, or relay-based actuators in white goods, HVAC accessories, and garage-door peripherals are well served by the MC9S08QB4CTG. The 20 MHz HCS08 core runs a PWM timer firmware stack in 4 KB Flash, while on-chip peripherals drive FET bridges via GPIO, ADC, and timer channels. The 16-pin TSSOP-16 footprint offers enough I/O for two motor half-bridges plus sensor feedback and a serial interface, and the 1.8 V to 3.6 V supply range simplifies interface to 3.3 V gate drivers. Designers can upgrade to MC9S08QB8 for additional firmware headroom.

🏭

White-Goods and HVAC Control Boards

Control boards inside white goods such as washing-machine sub-modules, dishwasher user interfaces, and HVAC accessories frequently pair an MC9S08QB4CTG with the main appliance MCU. The 8-bit controller handles user-input scanning, display multiplexing, sensor pre-processing, and simple safety timers. Its 4 KB Flash fits standard appliance-control code, and the -40C to +85C operating range covers under-cabinet and attic-mounted HVAC environments. The TSSOP-16 package suits both hand-built and high-volume SMT manufacturing.

🧩

Low-Cost IoT End-Nodes

Cost-driven IoT end nodes such as connected-temperature sensors, leak detectors, and occupancy beacons are a sweet spot for the MC9S08QB4CTG where the ARM Cortex-M0 class would inflate BOM cost beyond the target. The S08 core executes the duty-cycled sensor read-and-transmit firmware inside 4 KB Flash, and the integrated low-power modes with Wake-Up on interrupt keep the average current low enough for a coin-cell battery. The 16-pin TSSOP-16 leaves enough I/O for a serial interface to the RF transceiver, a temperature/humidity sensor, and a status LED.

What is the CPU core and clock speed of MC9S08QB4CTG?
The MC9S08QB4CTG uses the NXP S08 (HCS08) 8-bit CISC core running at up to 20 MHz CPU bus frequency. According to the NXP product page, the core executes an enhanced HC08 instruction set with added BGND background debug, and pairs the 20 MHz CPU with 4KB of on-chip Flash program memory in a 16-pin TSSOP package.
How much Flash and RAM does MC9S08QB4CTG have?
The MC9S08QB4CTG integrates 4 KB (4K x 8) of Flash program memory as confirmed by DigiKey's product detail page. The exact on-chip RAM byte count was not included in the verified web snippets and is marked [DATA_NEEDED: RAM size in bytes]; typical S08QB-family devices feature 256-512 bytes of RAM. For the exact number, consult the NXP datasheet.
What package does MC9S08QB4CTG use and how many pins?
The MC9S08QB4CTG is packaged in a 16-pin Thin Shrink Small Outline Package (TSSOP-16) per Mouser and DigiKey listings. The TSSOP-16 footprint measures roughly 5 mm x 4.4 mm and is fully surface-mount compatible with hand-solderable prototypes and automated SMT production lines.
What is the operating voltage of MC9S08QB4CTG?
The MC9S08QB4CTG operates across a 1.8 V to 3.6 V supply range, supporting both single-cell battery and 3.3 V regulated rails. The NXP datasheet specifies 1.8 V operation across the full -40C to +85C industrial temperature range, making the part appropriate for low-voltage and battery-powered designs.
What is the lifecycle status of MC9S08QB4CTG?
The MC9S08QB4CTG is in Last-Time-Buy (LTB) status as of 2026-10-20 based on the NXP product page header showing 'End of Life / Discontinuance'. Designers should plan for an NXP recommended replacement or a qualified drop-in S08 alternative such as MC9S08QB8 or compatible S08QD-series parts before the final LTB ship date.
Where can I buy MC9S08QB4CTG and what does it cost?
The MC9S08QB4CTG is listed at distributors including DigiKey, Mouser, Octopart, Ampheo, Xecor, Avaq and Jotrin as of 2026-10-20. Listed pricing clusters between $1.82 at 1000-piece breaks and roughly $2.85 at unit quantity; for last-time-buy stock, expect rising prices and longer lead times as the NXP discontinuance takes effect.
What is the lead time for MC9S08QB4CTG orders?
Lead times on remaining MC9S08QB4CTG stock vary by distributor and order size as the part approaches its discontinuance date. As of 2026-10-20, DigiKey and Mouser list the part with reference stock; distributors such as Rochester Electronics may carry extended inventory after the LTB window closes. Always request a current lead-time quote before placing production orders.
What is the best drop-in replacement for MC9S08QB4CTG?
The best drop-in replacement for MC9S08QB4CTG in the same S08 family and TSSOP-16 family is the higher-density MC9S08QB8 in TSSOP-16, which doubles program memory to 8 KB while preserving the S08 core, peripherals, and footprint direction. Pin-to-pin compatibility should be confirmed against the NXP family datasheet before PCB reuse.
MC9S08QB4CTG vs MC9S08QD4CSC - which to choose?
Both the MC9S08QB4CTG (TSSOP-16) and the MC9S08QD4CSC use the S08 8-bit core, but the QD4CSC runs at a higher CPU frequency and is offered in a different SOIC-style package. For TSSOP-16, pin-compatible designs, the MC9S08QB4CTG family is the direct choice; for higher CPU throughput, evaluate MC9S08QD4CSC with a footprint compatibility review.
When should I choose MC9S08QB4CTG over a 32-bit ARM MCU?
Choose MC9S08QB4CTG over an ARM Cortex-M0 MCU when BOM cost is the dominant constraint, the firmware comfortably fits in 4 KB Flash, and the design needs only basic timers, ADC, and serial interfaces. Step up to a 32-bit ARM MCU when the algorithm is computationally heavy, requires DSP, or needs significantly more Flash/RAM.
Can MC9S08QB8 replace MC9S08QB4CTG on the same PCB?
The MC9S08QB8 is a logical step-up within the same S08QB family and shares the 16-pin TSSOP form factor, making it a near drop-in upgrade. Confirm pinout versus the MC9S08QB4CTG footprint in the NXP family datasheet before reuse, and budget for the doubling of Flash memory - up to 8 KB - without altering the bill of materials beyond the MPN change.
Where do I download the MC9S08QB4CTG datasheet PDF?
The official MC9S08QB4CTG datasheet PDF is hosted on the NXP website at the part's product page. The direct datasheet PDF link is https://www.nxp.com/docs/en/data-sheet/MC9S08QB4.pdf; secondary mirrors are available on DigiKey and Mouser part detail pages under their respective 'datasheet' tabs.
Where can I find MC9S08QB4CTG pinout and TSSOP-16 pin map?
The MC9S08QB4CTG pinout for the 16-pin TSSOP package is documented in the NXP MC9S08QB4 datasheet section 'Pin Functions'. The pin map assigns VDD, VSS, RESET, BKGD/MS, and the GPIO, timer, ADC, and communication peripheral pins to positions 1 through 16 with the standard TSSOP counter-clockwise numbering.
What low-power modes does MC9S08QB4CTG support?
The MC9S08QB4CTG, like other S08QB-family microcontrollers, supports the S08 low-power Run, Wait, and Stop modes with peripheral wake-up. According to the NXP datasheet, these modes reduce quiescent current to single-digit microampere levels, enabling battery duty-cycled designs in remote controls and sensor nodes.
Is MC9S08QB4CTG suitable for IoT sensor nodes?
The MC9S08QB4CTG is well suited to simple IoT end-node designs where 4 KB of Flash is sufficient for the application firmware and the operating voltage can be a single 1.8 V to 3.6 V rail. Pair it with a low-power RF transceiver or a sensor front end, and the integrated low-power Run/Stop modes can extend battery life into the multi-year range.

工程参考数据: MC9S08QB4CTG ——对比、设计指导和合规信息。

选型指南

Choose the MC9S08QB4CTG when you need a low-cost, 8-bit HCS08 microcontroller with 4 KB of Flash in a 16-pin TSSOP package, and your firmware comfortably fits inside that 4 KB Flash budget. Step up to the MC9S08QB8 if you need extra code room or expect in-field firmware growth, and your PCB layout already accommodates the same TSSOP-16 footprint direction. Choose the MC9S08QD4CSC if you need higher CPU clocking and a different SOIC form-factor family. Choose a different family entirely if the application needs significantly more Flash, more peripherals, or 32-bit throughput.

与替代料对比

参数 本产品 MC9S08QB8CWGR MC9S08QB4CWG MC9RS08KB8CWJ MC9S08QD4CSC S9S08SG4E2CTJ
Package 16-pin TSSOP 16-pin TSSOP-equivalent (WGR) 16-pin TSSOP 16-pin TSSOP-equivalent 16-pin SOIC-equivalent (CS package) 20-pin TSSOP-equivalent
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
CPU Core S08 (HCS08), 8-bit S08 (HCS08), 8-bit S08 (HCS08), 8-bit RS08, 8-bit (reduced instruction set) S08 (HCS08), 8-bit S08 (HCS08), 8-bit
Maximum CPU Frequency 20 MHz 20 MHz 20 MHz 20 MHz Higher than 20 MHz (QD family) 20 MHz
Program Memory (Flash) 4 KB 8 KB 4 KB 8 KB 4 KB 4 KB
Operating Voltage 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 2.0 V to 3.6 V (typical QD family) 1.8 V to 3.6 V (typical SG family)
Lifecycle Status Last-Time-Buy (LTB) Check NXP - same family EOL context Last-Time-Buy (same die as MC9S08QB4CTG) Active Active per NXP product page Active
Approximate Unit Price (1 pc) $2.85 Higher (double Flash at parity grade) Similar to MC9S08QB4CTG (same die) Site list candidate - confirm distributor Similar S08 entry-level band Site list candidate - confirm distributor

关键差异点

  • 4 KB Flash fits entry-level BOM targets (对比 MC9S08QB8CWGR)
  • Tight TSSOP-16 footprint for compact designs (对比 MC9S08QD4CSC)
  • S08 CISC core maintains HC08 legacy code compatibility (对比 MC9RS08KB8CWJ)

设计说明

The MC9S08QB4CTG operates from 1.8 V to 3.6 V per NXP. Decouple VDD/VSS with a 100 nF ceramic cap placed within 5 mm of the VDD pin, plus a bulk 1-10 uF cap near the regulator output. For battery operation from two alkaline cells, derive VDD from a low-quiescent LDO with < 5 uA Iq to preserve battery life; the S08 core itself enters low microampere Stop modes.

Estimated Flash budget: with 4 KB total Flash, reserve at least 0.5 KB at the top of memory for a small bootloader if in-application updates are planned. BDM (Background Debug Mode) on the BKGD/MS pin is essential for development and field programming; do not pull BKGD high or low permanently without accounting for debug access. Watch STOP current at high-temperature corners - confirm Stop-mode Iq in the NXP datasheet for your application.

For TSSOP-16 packages, the typical theta_JA of ~100-150 C/W on a 1-oz 1 square-inch copper pad is sufficient for low-power MCU designs that dissipate well under 100 mW. At 20 MHz CPU frequency, the internal power is typically in the low single-digit mW range; no heatsink or copper pour extension is required beyond a standard ground-connected thermal pad area.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
无铅
Yes
无卤
Unknown
冲突矿物
Unknown

RoHS compliance inferred from DigiKey distribution listings and NXP product category. Halogen-free and conflict-minerals status not stated in verified web snippets - confirmed via NXP environmental documentation if material.

数据核验日期: 2026-10-20 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

MC9S08QB4CTG MC9S08QB4CTG datasheet NXP MC9S08QB4CTG S08QB 8-bit MCU 20MHz 4KB flash TSSOP-16 8-bit microcontroller MC9S08QB4CTG low-power MCU battery powered MC9S08QB4CTG vs MC9S08QD4CSC MC9S08QB4CTG drop-in replacement MC9S08QB4CTG buy price LTB where to download MC9S08QB4CTG datasheet PDF MC9S08QB4CTG pinout TSSOP-16 low-cost 8-bit MCU for sensor node

相关元器件 & 术语

NXP Semiconductors MC9S08QB4CTG MC9S08QB4 MC9S08QB8 MC9S08QD4 MC9S08QB4CWG MC9S08QB8CWGR HCS08 S08 core 8-bit microcontroller CISC HC08 instruction set TSSOP-16 Thin Shrink Small Outline Package RoHS REACH background debug mode BDM Flash memory Remote control white goods sensor node low-power Stop mode consumer appliance
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