MCF5327CVM240J - ColdFire V3 240MHz MPU 196-LBGA | NXP
料号： MCF5327CVM240J ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.75 | $2,175.00 |
| 500 | $18.4 | $9,200.00 |
| 1,000 | $15.95 | $15,950.00 |
MCF5327CVM240J 概述
Key features include 32 KB internal SRAM, 94 user I/O lines, ROMless external memory interface, JTAG/BDM debug, and an integrated TFT/LCD controller. The ColdFire V3 core delivers 211 MIPS at 240 MHz while maintaining code compatibility with the wider ColdFire ecosystem, easing migration from older V2 designs.
The architecture pairs the V3 core with a 32-bit system bus, dedicated DMA channels, and a peripheral set that includes Ethernet MAC, USB 2.0 Full-Speed OTG, CAN, SPI, I2C, UARTs, and a 16-bit external memory controller supporting SDRAM, SRAM, and NOR flash. The integrated LCD controller supports TFT panels up to 800x600, eliminating the need for an external graphics controller in many HMI designs.
Typical applications include industrial HMI panels, factory automation controllers, point-of-sale terminals, medical instrument displays, building automation touch panels, and embedded operator interfaces. The combination of Ethernet, USB, CAN, and LCD in one package reduces BOM cost and PCB area.
Designers should verify that the LBGA 15x15 mm land pattern is acceptable for their manufacturing process (X-ray or AOI inspection is recommended for BGA rework) and that thermal vias under the package are adequate for the application power profile.
This page consolidates distributor pricing, drop-in alternatives, and design guidance not found in the manufacturer datasheet, enabling faster part selection and lifecycle planning.
直接替换替代料： MCF5327CVM240J ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MCF5327CVM240J （相同外形与封装尺寸） ——差异在于 Package, Core Architecture, Mounting Type, Lifecycle Status, Program Memory.
快速对比工具——选择替代料号进行并排对比：
MCF5329CVM240
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$25.6 / 个
查看数据手册 →MCF5328CVM240
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$35 / 个
查看数据手册 →MCF5327CVM240
✅ 直接替换📋 参考替代料（不在目录中）
MCF5327CVM240J 最大额定值与电气特性
| Core Architecture | ColdFire V3 (32-bit RISC, variable-length) |
| 最大时钟频率 | 240 MHz |
| Performance | 211 MIPS |
| Internal SRAM | 32 KB |
| Program Memory | ROMless (external memory interface) |
| Number of I/O Lines | 94 |
| Oscillator Type | External |
| 封装 | 196-LBGA (MAPBGA) 15x15 mm |
| 安装类型 | Surface Mount |
| Operating Temperature Grade | Industrial |
| Integrated LCD Controller | Yes (TFT, up to 800x600) |
| Ethernet MAC | Yes (10/100) |
| USB | USB 2.0 Full-Speed OTG |
| CAN | Yes |
| JTAG / BDM Debug | Yes |
| RoHS 状态 | Compliant |
MCF5327CVM240J 196-lbga (mapbga) 15x15 mm 引脚配置指南
MCF5327CVM240J（196-lbga (mapbga) 15x15 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MCF5327CVM240J.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MCF5327CVM240J 适用于 6 应用s: Industrial HMI Touch Panels, Factory Automation Controllers, Point-of-Sale Terminals, Medical Instrument Displays, Building Automation Touch Panels, Embedded Operator Interfaces.
Industrial HMI Touch Panels
The MCF5327CVM240J is the canonical target for industrial HMI touch panels because it integrates a TFT LCD controller supporting resolutions up to 800x600 alongside a 240 MHz ColdFire V3 core that runs Qt/Embedded or Microwindows GUI stacks comfortably. The 94 user I/O lines accept capacitive touch controller interrupts, rotary encoder inputs, and front-panel key matrices without external I/O expanders. The integrated 10/100 Ethernet MAC and CAN interface let the HMI talk directly to factory PLCs and SCADA hosts, removing the need for a separate communications coprocessor. Per NXP's MCF532x product brief, this is the first ColdFire family to integrate an LCD controller, which is why it dominates HMI designs that previously required an external graphics chip.
推荐
Factory Automation Controllers
For factory automation controllers, the MCF5327CVM240J's 211 MIPS at 240 MHz gives sufficient headroom for IEC 61131-3 soft-PLC runtimes plus fieldbus protocol stacks (Modbus TCP, EtherNet/IP, CANopen). The 32 KB on-chip SRAM accelerates deterministic interrupt response for real-time control loops, while the external SDRAM controller streams larger program images from 32-bit memory. Industrial temperature grade and the integrated CAN interface let a single board replace legacy PLC subsystems, reducing panel footprint and BOM cost. Engineers typically pair this MPU with opto-isolated digital I/O and an external PHY for the Ethernet MAC.
推荐
Point-of-Sale Terminals
Point-of-sale terminals benefit from the MCF5327CVM240J's combination of integrated LCD, USB 2.0 FS OTG, and Ethernet in one BGA. The USB OTG port directly drives barcode scanners, receipt printers, and customer-facing secondary displays, eliminating an external USB hub. The TFT controller drives the operator-facing 640x480 or 800x600 color panel that shows transaction and inventory screens. ColdFire code compatibility lets POS ISVs port mature V2 firmware forward with minimal rewrite, preserving the substantial software investment of established payment applications.
推荐
Medical Instrument Displays
Medical instrument displays such as patient monitors and bedside infotainment use the MCF5327CVM240J to drive mid-resolution TFT panels while running the device's measurement and alarm logic on the ColdFire V3 core. The 94 I/O lines accept analog front-end interrupts, button inputs, and alarm-tone DAC handshaking without external glue logic. Industrial temperature operation and the long-life cycle of the ColdFire V3 silicon support the 7-10 year availability window medical OEMs require. The integrated Ethernet MAC supports HL7 data export to hospital information systems over standard TCP stacks.
推荐
Building Automation Touch Panels
Building automation touch panels for HVAC, lighting, and access control use the MCF5327CVM240J to combine a touchscreen UI with BACnet/IP or Modbus TCP fieldbus connectivity. The integrated LCD controller drives the wall-mount color touchscreen, while the 10/100 Ethernet MAC uplinks to the building management system. The ColdFire V3 core's 211 MIPS runs the BACnet stack plus a web-based configuration UI simultaneously, and the 32 KB SRAM caches recent trend-log data for instant screen refresh without SD card latency.
推荐
Embedded Operator Interfaces
Embedded operator interfaces for printing presses, packaging machinery, and CNC equipment use the MCF5327CVM240J as a single-chip solution that drives the panel and runs the operator-facing HMI logic. The CAN interface links to the machine's main controller for status and command exchange, while the integrated LCD controller drives the local 800x600 panel without external video memory. Compared to ARM Cortex-M3 designs, the ColdFire V3 offers more deterministic interrupt latency for safety-critical stop and e-stop handling, which is why it remains preferred for heavy-industry machinery.
推荐
推荐产品汇总
工程参考数据： MCF5327CVM240J ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MCF5329CVM240 | MCF5328CVM240 | MCF5327CVM240 |
|---|---|---|---|---|
| Package | 196-LBGA (MAPBGA) 15x15 mm | 196-LBGA (MAPBGA) 15x15 mm - same | 196-LBGA (MAPBGA) 15x15 mm - same | 196-LBGA (MAPBGA) 15x15 mm - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ColdFire V3 (32-bit) | ColdFire V3 (32-bit) | ColdFire V3 (32-bit) | ColdFire V3 (32-bit) |
| Max Clock Frequency | 240 MHz | 240 MHz | 240 MHz | 240 MHz |
| Performance | 211 MIPS | 211 MIPS | 211 MIPS | 211 MIPS |
| Internal SRAM | 32 KB | 32 KB | 32 KB | 32 KB |
| User I/O Lines | 94 | 94 | 94 | 94 |
| USB 2.0 OTG | Yes | Yes | No | Yes |
| Integrated LCD Controller | Yes (TFT up to 800x600) | Yes (TFT up to 800x600) | Yes (TFT up to 800x600) | Yes (TFT up to 800x600) |
| Security / Firewall | Standard | Enhanced (security firewall) | Standard | Standard |
关键差异点
- First ColdFire family with integrated TFT LCD controller （对比 External graphics controller designs)
- 211 MIPS at 240 MHz with 32 KB SRAM （对比 MCF5328CVM240)
- Industrial temperature grade with long lifecycle （对比 ARM Cortex-M3 MPU alternatives)
设计说明
The 196-LBGA package has a relatively high theta_JA for a BGA because the die is exposed through the bottom of the array. Per the MCF532x datasheet, a 6x6 grid of thermal vias (0.3 mm pitch, 0.2 mm drill) directly under the die is required to achieve the published thermal performance. Without thermal vias, junction rise at 240 MHz full-load operation can exceed 50 C above ambient, which may push the part out of the industrial temperature window in enclosed cabinets.
Place SDRAM as close as possible to the MCF5327CVM240J with matched-length address and clock traces. The 32-bit external memory bus has timing windows under 2 ns at 240 MHz core clock, so stubs must be kept below 5 mm. Use 50-ohm controlled-impedance routing for the SDRAM clock pair and isolate analog supplies (PLL VDD, ADC AVSS) with ferrite beads.
Do not assume the -J suffix denotes a different silicon - it is a packaging/reel code defined by NXP. The base MCF5327CVM240 (without -J) shares the same die and pinout. Also note that the JTAG/BDM pins double as GPIO after reset; add 10 kohm pull-ups on JTAG TMS and TDI to prevent the debugger from latching spurious commands during cold-boot.
Route the Ethernet MAC differential pairs (TX_EN, TXD, RXD) with 100-ohm differential impedance and keep them at least 3 mm away from the LCD pixel clock traces to avoid coupling. The integrated Ethernet PHY interface requires a 25 MHz reference crystal; place this crystal within 5 mm of the MAC_REF pins and guard it with a ground ring.
合规信息
RoHS compliance confirmed per NXP/Freescale product listing. Industrial temperature grade per datasheet. Halogen-free status not explicitly stated in the verified web data.
