MCIMX355AVM4BR2 - i.MX35 ARM11 400MHz MPU, 400-LFBGA | NXP
料号： MCIMX355AVM4BR2 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.1 | $261.00 |
| 100 | $23.45 | $2,345.00 |
| 500 | $21.2 | $10,600.00 |
| 1,000 | $19.85 | $19,850.00 |
MCIMX355AVM4BR2 概述
What is an applications processor MPU? An applications processor MPU is a microprocessor unit designed to run full operating systems (Linux, Windows Embedded, Android) and execute rich multimedia and connectivity stacks, in contrast to a microcontroller (MCU) which is optimized for bare-metal real-time control. The i.MX35 sits in the i.MX applications-processor family — a hierarchy of system-on-chip parts that integrate CPU core, memory controller, graphics/video, and I/O onto one die. The MCIMX355AVM4BR2 belongs to the i.MX35 sub-family, succeeding the i.MX31 with higher clock speed, on-chip SRAM and an integrated image processing pipeline.
Key features include an ARM1136JF-S 32-bit core with Jazelle Java acceleration, 400 MHz maximum CPU frequency, integrated 128 KB SRAM, hardware-accelerated image processing (IPU) supporting camera input and LCD output, eMMA pre/post-processing module, USB 2.0 high-speed OTG, and a 96 GPIO count. The 400-LFBGA package exposes a rich peripheral set including two MMC/SD ports, 3 UARTs, I2C, I2S audio, CAN and Fast Ethernet MAC, allowing the device to act as the entire host subsystem for industrial HMI or automotive infotainment boards.
The part is fabricated in a 90 nm CMOS process and is AEC-Q100 qualified for automotive environments, including AEC-Q100 grade 3 temperature range. The 'V' suffix in the part number denotes the 17x17 mm 0.8 mm pitch LFBGA, the 'M4' segment indicates 400 MHz speed grade, 'B' indicates tape-and-reel orientation, and 'R2' is the reel quantity code.
Typical applications include automotive infotainment head units, industrial human-machine-interface panels, point-of-sale terminals, portable medical data terminals, and connected printing/scanning devices. The combination of ARM11 throughput, integrated IPU, and AEC-Q100 qualification makes it particularly attractive for in-vehicle displays and ruggedized industrial operator panels.
When designing with this part, allocate adequate PCB area for the 400-ball 0.8 mm pitch BGA — it requires microvia or laser-drilled via technology at the chosen board stack-up. DDR2 memory routing must be length-matched; NXP provides reference designs and BSDL files in the i.MX35 hardware development kit.
This page synthesizes distributor inventory, AEC-Q100 cross-references, and practical design notes beyond what is in the manufacturer datasheet, including alternatives within the i.MX family that share the same LFBGA footprint.
直接替换替代料： MCIMX355AVM4BR2 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MCIMX355AVM4BR2 （相同外形与封装尺寸） ——差异在于 Automotive Qualification, Core Architecture, Mounting Type, Package.
快速对比工具——选择替代料号进行并排对比：
MCIMX355AVM5BR2
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX355AVM4BR2
✅ 直接替换✓ 有现货
$19.85 / 个
查看数据手册 →MCIMX356AVM5B
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX357AVM5B
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MCIMX358AVM5B
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MCIMX355AVM4BR2 最大额定值与电气特性
| Core Architecture | ARM1136JF-S (32-bit, Jazelle) |
| Maximum CPU Frequency | 400 MHz |
| Internal SRAM | 128 KB |
| Process Technology | 90 nm CMOS |
| 封装 | 400-LFBGA (MAP-BGA) 17x17 mm, 0.8 mm pitch |
| Number of I/O | 96 |
| Automotive Qualification | AEC-Q100 |
| Image Processing Unit (IPU) | Yes (integrated) |
| eMMA Multimedia Accelerator | Yes (integrated) |
| USB | USB 2.0 High-Speed OTG |
| MMC/SD Interfaces | 2 |
| UART | 3 |
| 安装类型 | Surface Mount (BGA) |
| Packaging | Tape & Reel (TR) |
MCIMX355AVM4BR2 400-lfbga (map-bga) 17x17 mm, 0.8 mm pitch 引脚配置指南
MCIMX355AVM4BR2（400-lfbga (map-bga) 17x17 mm, 0.8 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MCIMX355AVM4BR2.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MCIMX355AVM4BR2 适用于 7 应用s: Automotive Infotainment Head Unit, Industrial Human-Machine Interface (HMI) Panel, Point-of-Sale (POS) Terminal, Portable Medical Data Terminal, Connected Printing and Imaging Appliance, In-Vehicle Instrument Cluster Display, Ruggedized Handheld Data Terminal.
Automotive Infotainment Head Unit
The MCIMX355AVM4BR2 fits automotive infotainment head units because the integrated Image Processing Unit (IPU) drives TFT panels up to XGA resolution while the ARM1136JF-S core runs a Linux or WinCE stack for the HMI. At 400 MHz the part decodes compressed audio, drives a WVGA capacitive touch display, and handles CAN/LIN vehicle bus traffic concurrently, with AEC-Q100 qualification supporting under-dash thermal environments. Compared with i.MX6 the part consumes less power at idle but lacks Cortex-A class headroom for advanced 3D HMI.
推荐
Industrial Human-Machine Interface (HMI) Panel
The MCIMX355AVM4BR2 is well suited for industrial HMI panels because its IPU drives 24-bit parallel TFT output and a CMOS sensor input simultaneously, allowing camera-based gesture or barcode scanning overlays. The 128 KB on-chip SRAM absorbs display line buffers so the ARM11 core can dedicate cycles to the control-loop HMI logic. The 96 GPIOs and three UARTs simplify integration with PLCs, motor drives and field-bus transceivers on the factory floor.
推荐
Point-of-Sale (POS) Terminal
POS terminals benefit from the MCIMX355AVM4BR2 because the ARM1136JF-S runs a Linux stack for payment application and display, while the IPU drives the customer-facing LCD and the eMMA accelerates JPEG compression for receipt or barcode imaging. USB 2.0 High-Speed OTG supports external PIN pads and printers, and the integrated MMC/SD controller hosts the OS image on a removable card for field updates. The 400-LFBGA package fits compact tablet-form-factor terminals.
推荐
Portable Medical Data Terminal
Portable medical terminals such as bedside barcode scanners and patient ID tablets leverage the MCIMX355AVM4BR2's low-power ARM11 core plus integrated IPU to capture and display patient information on a sunlight-readable TFT. The 128 KB SRAM and DDR2 memory controller handle real-time vital-sign telemetry streams while the LCD pipeline renders waveforms. AEC-Q100-grade silicon supports the wider operating-temperature needs of clinical carts that move between cool storage and warm patient rooms.
推荐
Connected Printing and Imaging Appliance
Multi-function printers and document imaging appliances use the MCIMX355AVM4BR2 because the eMMA pre-processing module offloads image conditioning from the ARM11 core, accelerating 600 dpi scan-to-email or scan-to-cloud workflows. USB 2.0 High-Speed connects to the host PC; Ethernet MAC enables network stand-alone operation; and the SD/MMC controller stores fonts and macros. The 400-MHz clock is sufficient to keep the raster image processor (RIP) fed with compressed data.
推荐
In-Vehicle Instrument Cluster Display
The MCIMX355AVM4BR2 fits in-vehicle instrument clusters because the integrated IPU renders dials, tell-tales and driver-information graphics on a TFT or WVGA panel with hardware-accelerated alpha blending. The ARM1136JF-S runs an RTOS or Linux for the cluster logic while two CAN interfaces receive vehicle bus data. AEC-Q100 qualification supports under-dash temperatures and the 400-LFBGA is small enough to embed inside the cluster housing behind the bezel.
推荐
Ruggedized Handheld Data Terminal
Ruggedized handhelds for warehouse, logistics or field-service deployments rely on the MCIMX355AVM4BR2 because the ARM11 core runs Windows Embedded or Linux for the barcode, RFID and inventory applications. The IPU drives the main LCD and the camera preview; USB OTG supports the charging cradle; and the SD/MMC slot hosts the user-writable storage. The 400-LFBGA package plus AEC-Q100 silicon let OEMs build IP65-rated handhelds that survive drops and temperature swings.
推荐
推荐产品汇总
工程参考数据： MCIMX355AVM4BR2 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MCIMX355AVM5BR2 | MCIMX356AVM5B | MCIMX357AVM5B |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 400-LFBGA (17x17 mm, 0.8 mm pitch) | 400-LFBGA (17x17 mm, 0.8 mm pitch) - same | 400-LFBGA - same family | 400-LFBGA - same family |
| Core | ARM1136JF-S 32-bit | ARM1136JF-S 32-bit | ARM1136JF-S 32-bit | ARM1136JF-S 32-bit |
| Internal SRAM | 128 KB | 128 KB | 128 KB | 128 KB |
| Image Processing Unit | Yes | Yes | Yes | Yes |
| Automotive Grade (AEC-Q100) | Yes | Yes | Yes | Yes |
| USB | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG | USB 2.0 High-Speed OTG |
| Lifecycle Status | NRND | NRND | NRND | NRND |
关键差异点
- Integrated Image Processing Unit (IPU) reduces external companion-chip BOM （对比 i.MX25 (MCIMX255AVM4))
- AEC-Q100 automotive qualification for in-vehicle deployments （对比 MCIMX255AVM4 (i.MX25))
- Same-package drop-in to the M5 speed grade （对比 MCIMX355AVM5BR2 (M5))
设计说明
Estimated: the 400-ball LFBGA at 0.8 mm pitch requires microvia (laser-drilled) via technology on a 4-layer or 6-layer stack-up. Fan-out the inner-row balls to inner signal layers and outer-row balls to top/bottom layers. Place at least one continuous reference plane directly beneath the BGA to provide a low-impedance return path for the DDR2 bus, which is the noisiest interface on this part. NXP provides a reference design and Altium/Cadence layout files in the i.MX35 hardware development kit.
DDR2 routing to the external memory must be length-matched within the i.MX35 datasheet tolerance (typically +/- 50 mil on the byte groups). Use fly-by termination on address/command and on-die termination (ODT) on the data group. Keep the DDR2 clock trace 2:1 length-matched to the address/command and isolated from the IPU LCD bus by at least one reference plane gap. Series damping on the SDRAM clock is recommended if reflections appear on the TDR plot.
Estimated: at the maximum 400 MHz operation with all peripherals active the part dissipates roughly 1 W. With a JEDEC-standard 400-LFBGA on a 4-layer JEDEC test board theta_JA is around 25-30 C/W, giving junction-to-ambient delta of about 25-30 C above the inlet air. Provide a small copper landing pattern directly under the exposed pad array and ensure the inlet air temperature for an in-vehicle enclosure stays within the AEC-Q100 grade 3 envelope.
Do not assume the boot mode is correct for first silicon bring-up - the BOOT[3:0] pins select between NAND, NOR, SD/MMC, USB and serial boot. Verify the i.MX35 boot mode configuration matrix in IMX35CE Chapter 4 before power-on. Also verify the watchdog reset behaviour in your BSP: an unhandled watchdog reset on an automotive infotainment part will reboot the HMI in the field, which is rarely the desired behaviour. The RMII Ethernet PHY reference clock must be enabled in CCM before the MAC is initialised or link will not come up.
合规信息
AEC-Q100 qualified per NXP i.MX35 product line. RoHS/REACH/halogen status not explicit in distributor listings, marked 'unknown' until verified against the NXP material declaration. Lead-free per BGA ball finish standard for NXP MAP-BGA packages.
