MCIMX6D5EYM1 - i.MX6 Dual Cortex-A9 MPU 1GHz 624-FCPBGA | NXP
料号： MCIMX6D5EYM1 ✓ 量产中MCIMX6D5EYM1 概述
An application processor (AP/MPU) is a system-on-chip that integrates one or more CPU cores, a graphics processing unit, memory controllers, and a wide peripheral set into a single device. The i.MX 6 family targets multimedia HMI, automotive infotainment, industrial control, and embedded vision. Within the NXP portfolio, the i.MX 6 sits between the lower-end i.MX 28/53 series and the higher-end i.MX 8, offering a balance of cost, performance, and proven software support. The MCIMX6D5EYM1 specifically belongs to the i.MX6D dual-core sub-family with the 5EYM1 ordering code indicating commercial temperature grade and standard feature set.
Key features include a dual-core ARM Cortex-A9 up to 1.0 GHz with 32 KB L1 instruction cache and 32 KB L1 data cache per core, plus a unified 512 KB L2 cache. Integrated graphics include a 3D GPU (Vivante GC2000) supporting OpenGL ES 2.0/3.0 and a 2D GPU (GC320). The device integrates a 32-bit DDR3L-1066 memory controller, dual Gigabit Ethernet MACs, two USB 2.0 OTG controllers, PCIe Gen 2.0, HDMI, MIPI-DSI, MIPI-CSI, and multiple display/camera interfaces.
The architecture combines two superscalar Cortex-A9 cores with NEON SIMD media engine, hardware accelerated graphics, and a rich multimedia IP block set. The device is manufactured in a low-power CMOS process and supports multiple boot sources including NAND flash, eMMC, SD card, and serial SPI flash.
Typical applications include industrial HMI panels, multimedia gateways, point-of-sale terminals, medical imaging interfaces, and ruggedized tablets. The 624-FCPBGA package supports industrial-grade PCB designs with a recommended 6-layer or higher stack-up for proper DDR3L signal integrity.
When designing with this device, ensure proper DDR3L trace length matching within 25 mil tolerance per byte lane and provide a minimum 6-layer PCB stack-up. Thermal management is critical as the package dissipates up to 3 W under full CPU+GPU load, requiring thermal vias and copper pours.
This page synthesizes distributor pricing, application context, and drop-in i.MX6 alternatives not found in the manufacturer datasheet alone, complementing the NXP reference manual with practical sourcing information.
直接替换替代料： MCIMX6D5EYM1 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
MCIMX6Q5EYM1
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6D5EYM2
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6D5EYM10AD
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6Q5EYM10AD
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6D5EYM10AE
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6D5EYM1 最大额定值与电气特性
| Manufacturer | NXP Semiconductors |
| Series | i.MX 6 |
| Core | ARM Cortex-A9 |
| Number of Core Count | 2 (Dual-core) |
| 数据总线宽度 | 32-Bit |
| 最大时钟频率 | 1.0 GHz |
| 封装 | 624-FCPBGA (21 x 21 mm) |
| 安装类型 | Surface Mount |
| Memory Type Supported | DDR3L (32-bit) |
| Graphics | GC2000 3D + GC320 2D (Vivante) |
| Display Interfaces | HDMI, MIPI-DSI, LVDS |
| Camera Interface | MIPI-CSI, parallel CSI |
| USB | 2x USB 2.0 OTG |
| Ethernet | 2x 10/100/1000 Mbps MAC |
| PCIe | PCIe Gen 2.0 (1 lane) |
| 工作温度范围 | 0C to +95C (commercial) |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
MCIMX6D5EYM1 624-fcpbga (21 x 21 mm) 引脚配置指南
MCIMX6D5EYM1（624-fcpbga (21 x 21 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MCIMX6D5EYM1.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MCIMX6D5EYM1 适用于 6 应用s: Industrial HMI Control Panels, Multimedia Gateway and Smart Router, Point-of-Sale Terminals, Medical Imaging Displays and Patient Interfaces, Ruggedized Industrial Tablets, Digital Signage and Kiosks.
Industrial HMI Control Panels
The NXP MCIMX6D5EYM1 fits industrial HMI panels because its dual-core ARM Cortex-A9 at 1 GHz plus integrated Vivante GC2000 GPU delivers the responsive multi-touch LVDS/MIPI-DSI panel rendering required by factory-floor operator interfaces. The integrated 32-bit DDR3L controller and dual Gigabit Ethernet MACs simplify wiring to PLC backplanes and SCADA gateways. The 624-FCPBGA package allows compact panel-mount designs; the same SoC runs Linux with the NXP Yocto BSP, enabling Qt-based HMIs with hardware-accelerated OpenGL. Engineers typically pair the MCIMX6D5EYM1 with a TI TPS65216 PMIC, Murata Wi-Fi/Bluetooth module, and a 7-15 inch LVDS display; unlike an external GPU solution, the integrated graphics reduce BOM cost and PCB area for space-constrained enclosures.
推荐
Multimedia Gateway and Smart Router
The MCIMX6D5EYM1 suits multimedia gateways because its dual-core Cortex-A9 supports packet processing plus media transcoding concurrently, while the dual Gigabit Ethernet MACs, two USB 2.0 OTG ports, and PCIe Gen 2.0 lane allow direct attachment of Wi-Fi 6 NICs, LTE modems, and HDMI output. The SoC's 1.0 GHz speed and NEON SIMD engine accelerate H.264/H.265 decode for IPTV streams. A typical design uses 1 GB DDR3L, 4 GB eMMC, and runs OpenWrt or Yocto Linux. Compared to single-core routers, the dual-core complex lets one core handle network stack interrupt load while the second runs user-space services, reducing latency under burst load. Pin-compatible upgrades to MCIMX6Q5EYM1 scale to higher-throughput gateway SKUs.
推荐
Point-of-Sale Terminals
The MCIMX6D5EYM1 is well suited for retail point-of-sale terminals: the dual-core A9 delivers responsive Android/Linux UI rendering while handling encrypted payment flows on the second core, and the integrated touchscreen controller interfaces plus HDMI output drive both the cashier display and customer-facing VFD/LCD. The SoC's commercial temperature grade (0C to +95C) covers indoor retail environments. Designers typically pair the SoC with a MagTek encrypting card reader, an Epson thermal printer controller, and 4 GB DDR3L. The 624-FCPBGA package supports compact mainboard layouts; the same package as the i.MX6Q variants gives a clean upgrade path for dual-screen POS systems. NXP's long-term product longevity program reduces obsolescence risk for 7-10 year POS lifecycle.
推荐
Medical Imaging Displays and Patient Interfaces
The MCIMX6D5EYM1 is appropriate for medical imaging displays and patient bedside terminals where low-latency graphics and dual-core processing drive high-resolution LVDS/MIPI-DSI panels while a second core handles secure HL7 data exchange. The integrated Vivante GC2000 GPU supports medical visualization shaders, and dual USB OTG ports accommodate medical-grade cameras and barcode scanners. The SoC operates from 0C to +95C and NXP offers an i.MX6Q 5EYM2 industrial-temperature variant on the same FCPBGA-624 footprint for broader clinical environments. Typical designs integrate capacitive touch, isolated Ethernet, and battery-backed RTC. The dual-core architecture isolates deterministic imaging rendering from network stack jitter, important for IEC 62304-compliant software partitioning.
推荐
Ruggedized Industrial Tablets
The MCIMX6D5EYM1 powers ruggedized industrial tablets used in field service, warehousing, and logistics. The dual-core Cortex-A9 handles Android/Linux UI plus barcode/RFID middleware concurrently, and the integrated GPU drives sunlight-readable WUXGA panels via LVDS. The SoC's package allows thin tablet mainboards when paired with low-profile DDR3L and eMMC. Industrial-tablet designs use the commercial-grade MCIMX6D5EYM1 (0C to +95C) for indoor fleet deployments, while the industrial-grade MCIMX6D5EYM2 on the same 624-FCPBGA footprint serves outdoor and cold-storage fleets. Compared with discrete CPU+GPU solutions, the integrated SoC lowers BOM cost and battery drain, extending tablet runtime to 10+ hours per shift.
推荐
Digital Signage and Kiosks
The MCIMX6D5EYM1 fits digital signage and interactive kiosks because its dual-core A9 plus GC2000 GPU drives HDMI output at 1080p60 with smooth OpenGL transitions, while the dual Gigabit Ethernet ports connect to content management networks. The SoC's commercial temperature grade covers indoor mall, airport, and transit kiosk environments. Designers pair the SoC with 1-2 GB DDR3L, 8-32 GB eMMC, and a TI PMIC, then run a kiosk-mode Android or Linux distro. Compared to single-core media players, the dual-core complex lets one core decode H.264/H.265 video while the second manages interactivity and network streams. The 624-FCPBGA package is footprint-compatible with MCIMX6Q5EYM1, enabling a single PCB design across entry and premium kiosk SKUs.
推荐
推荐产品汇总
工程参考数据： MCIMX6D5EYM1 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MCIMX6Q5EYM1 | MCIMX6D5EYM2 | MCIMX6D5EYM10AD | MCIMX6Q5EYM10AD | MCIMX6D5EYM10AE |
|---|---|---|---|---|---|---|
| Package | 624-FCPBGA (21x21 mm) | 624-FCPBGA (21x21 mm) - same | 624-FCPBGA (21x21 mm) - same | 624-FCPBGA (21x21 mm) - same | 624-FCPBGA (21x21 mm) - same | 624-FCPBGA (21x21 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Number of Cores | 2 (Dual-core ARM Cortex-A9) | 4 (Quad-core ARM Cortex-A9) | 2 (Dual-core ARM Cortex-A9) | 2 (Dual-core ARM Cortex-A9) | 4 (Quad-core ARM Cortex-A9) | 2 (Dual-core ARM Cortex-A9) |
| Maximum CPU Frequency | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz |
| Operating Temperature Range | 0C to +95C (commercial) | 0C to +95C (commercial) | -40C to +105C (industrial) | 0C to +95C (commercial) | 0C to +95C (commercial) | 0C to +95C (commercial) |
| Feature Segmentation | Standard i.MX6D | Standard i.MX6Q | Standard i.MX6D + industrial temp | ROM Performance Enhanced (10AD) | ROM Performance Enhanced quad | ROM Performance Enhanced (10AE) |
| Memory Type | 32-bit DDR3L | 32-bit DDR3L | 32-bit DDR3L | 32-bit DDR3L | 32-bit DDR3L | 32-bit DDR3L |
| Unit Price (qty 1) | $35.50 USD | $48-55 USD (typical) | $42-50 USD (typical) | $36-42 USD (typical) | $52-60 USD (typical) | $38-44 USD (typical) |
关键差异点
- Dual-core ARM Cortex-A9 with hardware NEON at 1.0 GHz with Vivante GC2000 GPU （对比 i.MX 6Solo MCIMX6S7CVM08AC)
- Standard 624-FCPBGA chassis shared across dual-core and quad-core i.MX6 variants （对比 i.MX 7Dual MCIMX7D7DVK10SD)
- Industrial-temperature grade variant available on identical 624-FCPBGA footprint （对比 MCIMX6D5EYM1 (commercial only))
设计说明
Estimated: at full CPU+GPU load (2x Cortex-A9 at 1.0 GHz plus GC2000 3D acceleration), the MCIMX6D5EYM1 dissipates up to approximately 3 W. The 624-FCPBGA package requires a minimum 6-layer PCB with a thermal via array under the die and at least 4 sq cm of inner copper pour for heat spreading; without this, junction temperature exceeds 105C under sustained workload. Designers should size PMIC current capacity at 1.5x worst-case SoC draw for headroom.
DDR3L byte-lane signals require matched impedance routing with characteristic impedance of 50 ohm single-ended and 100 ohm differential. Estimated: trace length matching must be within 25 mil tolerance per byte lane, and trace length to VTT termination resistors must be balanced. Reference NXP hardware user guide section on DDR3L layout before tape-out; the i.MX6 reference manual provides the official topology recommendations including the use of fly-by VTT topology and dedicated VTT termination supply.
Power sequencing for the MCIMX6D5EYM1 must follow NXP's specified rail sequence: ARM core (VDD_ARM) before SoC (VDD_SOC), both gated by the PMIC's PGOOD signal. Use the TI TPS65216 PMIC as documented in the NXP i.MX6 reference design. Datasheet values are cited from the NXP hardware user guide; estimated sequencing delays in our example are 1 ms minimum between rail assertions.
Avoid using the MCIMX6D5EYM1's commercial temperature variant (0C to +95C) in outdoor industrial deployments - choose the MCIMX6D5EYM2 industrial variant on the same 624-FCPBGA footprint for -40C to +105C operation. Likewise, do not assume the MCIMX6Q variants share the same worst-case current draw; quad-core silicon can pull 30-40% more current under SMP load. Validate your thermal solution against the highest-stack variant on your PCB even if you ship the dual-core today.
合规信息
RoHS and REACH compliance per NXP product page. Not AEC-Q100 qualified; for automotive infotainment choose the MCIMX6Q5EYM2 with NXP automotive qualification. NXP Product Longevity Program covers i.MX6 family through 2030+ for industrial SKUs.
