MCIMX6G2CVK05AA-FR - i.MX6UL ARM Cortex-A7 MPU 528MHz | NXP
料号： MCIMX6G2CVK05AA-FR ✓ 量产中MCIMX6G2CVK05AA-FR 概述
An applications processor (AP) is a system-on-chip (SoC) that integrates a CPU core, memory controller, graphics/video pipeline, and industrial peripherals on a single die. The i.MX6UL sits at the entry tier of the i.MX 6 family - below the i.MX 6SoloLite and i.MX 6Solo - targeting HMI, low-cost gateways, and battery-powered IoT nodes. Its role in the broader system hierarchy is: i.MX6UL -> Cortex-A7 class AP -> 32-bit applications microprocessor -> embedded SoC -> semiconductor IC.
Key specifications include 528 MHz maximum CPU frequency, 16 KB L1 instruction cache + 16 KB L1 data cache, 128 KB L2 cache, support for LPDDR2/DDR3/DDR3L memory, dual USB 2.0 OTG controllers with integrated PHYs, two 12-bit ADCs (up to 10 channels), dual CAN-FD, and 1.2V/1.35V/1.5V/1.8V/2.5V/2.8V/3.3V I/O voltage support. The integrated security features include secure boot, high-assurance boot, and tamper detection suitable for industrial- and consumer-grade protection.
The MCIMX6G2CVK05AA-FR is fabricated in a low-power 40 nm CMOS process enabling typical active power in the sub-500 mW range and deep-sleep currents suitable for always-on battery applications. The 272-MAPBGA package provides a thermal resistance suitable for industrial fanless enclosures.
Typical applications include HMI panels, industrial IoT gateways, low-cost POS terminals, e-readers, smart appliances, building automation controllers, and portable medical devices. The Cortex-A7 core's ARMv7-A architecture with NEON makes it well suited for Linux/RTOS-based GUI stacks.
When designing with this part, ensure proper PCB layer stack-up for the 0.5 mm BGA escape routing and provide adequate decoupling on the multi-rail power domains. The wide I/O voltage support allows direct connection to 1.8V or 3.3V peripherals without level shifters.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： MCIMX6G2CVK05AA-FR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MCIMX6G2CVK05AA-FR （相同外形与封装尺寸） ——差异在于 CAN, Mounting Type, USB.
MCIMX6G2CVM05AA
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6G1CVM05AA
✅ 直接替换联系询价
查看数据手册 →MCIMX6G2CVK05AB
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6G2DVK10AA
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6G2CVK08AA
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MCIMX6G2CVK05AA-FR 最大额定值与电气特性
| CPU Core | ARM Cortex-A7 (single core, 32-bit) |
| Maximum CPU Frequency | 528 MHz |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| L2 Cache | 128 KB |
| Memory Interface | LPDDR2, DDR3, DDR3L (16-bit) |
| USB | 2 x USB 2.0 OTG with integrated PHY |
| CAN | 2 x CAN-FD |
| ADC | 2 x 12-bit SAR ADC (up to 10 input channels) |
| I/O Voltage Support | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V |
| Security Features | Secure boot, high-assurance boot, tamper detection, OTF DRAM encryption |
| 封装 | 272-MAPBGA (9x9 mm, 0.5 mm pitch) |
| 工作温度 | -40C to +105C (TJ) |
| Process Technology | 40 nm CMOS |
| 安装类型 | Surface Mount (BGA) |
| MSL 等级 | 3 |
| Lead-Free / RoHS | Yes - Compliant |
MCIMX6G2CVK05AA-FR 272-mapbga (9x9 mm, 0.5 mm pitch) 引脚配置指南
MCIMX6G2CVK05AA-FR（272-mapbga (9x9 mm, 0.5 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MCIMX6G2CVK05AA-FR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MCIMX6G2CVK05AA-FR 适用于 6 应用s: Industrial HMI Panels, IoT Gateways and Edge Nodes, Smart Appliance Controllers, Building Automation Controllers, Portable Medical Devices, POS Terminals and Payment Devices.
Industrial HMI Panels
The MCIMX6G2CVK05AA-FR's 528 MHz Cortex-A7 with NEON engine and 128 KB L2 cache is well matched to industrial HMI panels running Qt or LVGL GUI stacks. The integrated 2D graphics pipeline, dual USB 2.0 OTG for touch controllers, and 12-bit ADC for backlight/ambient-light sensing reduce BOM cost versus discrete MCU+ASIC designs. The -40C to +105C junction temperature rating suits factory-floor enclosures and outdoor kiosks where ambient temperatures exceed 70C. Hardware secure boot (G2 variant) protects firmware integrity in unattended equipment.
推荐
IoT Gateways and Edge Nodes
The MCIMX6G2CVK05AA-FR integrates Cortex-A7 plus dual CAN-FD, dual USB 2.0 with PHY, and 1.2V-3.3V I/O support that lets IoT gateway designs connect directly to 3.3V sensors without level shifters. The 528 MHz core runs lightweight Linux (Yocto/Buildroot) for MQTT, CoAP, or proprietary edge protocols. OTF DRAM encryption (G2 variant) protects sensor data in transit. The 272-MAPBGA's 9x9 mm footprint fits compact gateway enclosures with 4-layer PCB escape routing.
推荐
Smart Appliance Controllers
The MCIMX6G2CVK05AA-FR delivers 528 MHz Cortex-A7 with 16-bit LPDDR2/DDR3 support, providing adequate headroom for appliance control firmware plus Wi-Fi/BLE HMI logic. The integrated dual USB 2.0 with PHY and 12-bit ADC support motor control feedback and temperature sensing without external peripherals. Tamper detection (G2 variant) protects against warranty fraud in connected appliances. Industrial -40C to +105C operation suits appliance compartments with elevated temperatures.
推荐
Building Automation Controllers
The MCIMX6G2CVK05AA-FR's dual CAN-FD controllers enable native BACnet, KNX, or proprietary building-automation bus connectivity, eliminating external CAN transceivers. The Cortex-A7 core runs real-time building automation protocols with deterministic interrupt latency. Hardware secure boot and OTF DRAM encryption (G2) protect tenant data and access credentials. The wide 1.2V-3.3V I/O support lets the part interface directly with HVAC actuator drivers, lighting ballasts, and security sensors.
推荐
Portable Medical Devices
The MCIMX6G2CVK05AA-FR suits portable medical devices requiring low power, hardware security, and reliable industrial-temperature operation. The 528 MHz Cortex-A7 core can run patient-monitoring algorithms while the integrated 12-bit ADC captures vital-sign analog signals. Hardware secure boot (G2) and OTF DRAM encryption support HIPAA-compliant data protection. The 40 nm CMOS process enables sub-500 mW active power for battery operation across 8-12 hour shifts.
推荐
POS Terminals and Payment Devices
The MCIMX6G2CVK05AA-FR meets POS terminal requirements with its 528 MHz Cortex-A7 core, dual USB 2.0 OTG for payment peripherals, and hardware secure boot (G2 variant) for PCI PTS compliance. Tamper detection monitors enclosure intrusion, while OTF DRAM encryption protects PIN and transaction data. The 272-MAPBGA's compact 9x9 mm footprint fits slim countertop terminals. Linux support via NXP's BSP enables rapid integration of payment application stacks.
推荐
推荐产品汇总
工程参考数据： MCIMX6G2CVK05AA-FR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MCIMX6G2CVM05AA | MCIMX6G1CVM05AA | MCIMX6G2CVK05AB | MCIMX6G2DVK10AA | MCIMX6G2CVK08AA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 272-MAPBGA (9x9 mm, 0.5 mm pitch) | 272-MAPBGA (9x9 mm, 0.5 mm pitch) | 272-MAPBGA (9x9 mm, 0.5 mm pitch) | 272-MAPBGA (9x9 mm, 0.5 mm pitch) | 272-MAPBGA (9x9 mm, 0.5 mm pitch) | 272-MAPBGA (9x9 mm, 0.5 mm pitch) |
| CPU Core | ARM Cortex-A7 single core | ARM Cortex-A7 single core | ARM Cortex-A7 single core | ARM Cortex-A7 single core | ARM Cortex-A7 dual core | ARM Cortex-A7 single core |
| Security Hardware (Secure Boot) | Yes (G2 variant) | Yes (G2 variant) | No (G1 variant) | Yes (G2 with extended) | Yes (G2 variant) | Yes (G2 variant) |
| Tamper Detection | Yes | Yes | No | Yes | Yes | Yes |
| OTF DRAM Encryption | Yes | Yes | No | Yes | Yes | Yes |
| USB 2.0 OTG Ports | 2 | 2 | 2 | 2 | 2 | 2 |
| CAN-FD Controllers | 2 | 2 | 2 | 2 | 2 | 2 |
| Operating Temperature | -40C to +105C (TJ) | -40C to +105C (TJ) | -40C to +105C (TJ) | -40C to +105C (TJ) | -40C to +105C (TJ) | -40C to +105C (TJ) |
关键差异点
- Hardware secure boot and tamper detection （对比 MCIMX6G1CVM05AA)
- 528 MHz speed grade （对比 MCIMX6G2CVK08AA)
- Industrial temperature grade （对比 MCIMX6G2DVK10AA)
设计说明
The 272-MAPBGA at 0.5 mm pitch requires 4-layer PCB minimum with microvia escape routing. Per NXP's i.MX6UL Hardware Design Guide, place 0.1uF decoupling capacitors on every VDD pin within 1 mm of the ball. Use via-in-pad for inner-row balls to escape on inner layers. Allocate at least 4 ground vias under the package thermal pad for thermal dissipation; the 9x9 mm footprint supports up to 2 W typical dissipation with proper copper pour.
The MCIMX6G2CVK05AA-FR requires multiple power rails (VDD_SOC, VDD_ARM, VDD_HIGH, VDD_USB, VDD_PLL) with specific sequencing per NXP datasheet section 4. NXP recommends the PF3000 or PF3001 PMIC companion for proper rail sequencing and reduced external component count. Do not power VDD_ARM before VDD_SOC - this can cause permanent latch-up. Use bulk 22uF ceramic + 100nF HF decoupling on each rail.
Estimated: At 528 MHz with all peripherals active, typical power consumption is approximately 450-700 mW depending on workload. The 272-MAPBGA junction-to-ambient thermal resistance (theta_JA) on a 4-layer JEDEC test board is approximately 25-30 C/W. Derate for industrial designs with TJ max = 105C: maximum ambient temperature = TJ max - (P x theta_JA). For continuous 700 mW operation, limit ambient to 105C - (0.7 x 30) = 84C to maintain margin.
Common pitfalls with i.MX6UL designs include: (1) incorrect boot configuration resistor values on BOOT_MODE pins causing boot failure, (2) failing to assert POR_B for at least 1 ms after all rails stabilize, (3) using DDR3L without proper impedance-matched routing (target 50 ohm single-ended, 100 ohm differential), and (4) omitting the 32.768 kHz RTC crystal which prevents low-power RTC operation. Always validate boot mode with NXP's manufacturing tool before firmware integration.
合规信息
RoHS and REACH compliant per NXP product page. Industrial temperature grade (-40C to +105C TJ) but not formally AEC-Q100 qualified - for AEC-Q100 automotive applications, consult NXP's automotive-grade i.MX portfolio. Halogen-free status not specified in verified data.
