MCIMX6L3DVN10AA - i.MX6SL 1GHz ARM Cortex-A9 MPU | NXP
料号： MCIMX6L3DVN10AA ✗ 停产MCIMX6L3DVN10AA 概述
An applications processor (AP) is a system-on-chip (SoC) class of integrated circuit that combines a CPU complex, memory controller, graphics pipeline, and a rich set of peripheral interfaces into a single die, enabling a complete computing platform for embedded products. Within the broader taxonomy, the i.MX6SL sits inside the microprocessor family, which is itself a sub-category of integrated circuits and ultimately semiconductors - meaning a single chip replaces what would otherwise require a discrete CPU, GPU, northbridge, and dozens of peripheral controllers.
Key features of the MCIMX6L3DVN10AA include the 32-bit ARM Cortex-A9 core with NEON SIMD and TrustZone security extensions, an integrated 2D graphics processing unit (GPU2D) for accelerated display rendering, dual MIPI display and camera interfaces, and a hardware video codec block supporting standards such as H.264 BP/HP and MPEG-4. The device also provides a low-power security domain with secure boot and on-chip eFuse key storage, along with integrated power management and temperature sensors.
Architecturally, the i.MX6SL implements a single Cortex-A9 core with 32 KB L1 instruction cache, 32 KB L1 data cache, and a unified 256 KB L2 cache, connected via a 64-bit AXI fabric to a multi-port DRAM controller that supports LPDDR2/LPDDR3/DDR3/DDR3L memory. An on-chip PMU implements multiple voltage and clock domains so that unused IP blocks can be power-gated during idle states, which is the source of the family's low active/idle power figures.
Typical applications include e-readers and electronic paper displays, portable point-of-sale (POS) terminals, industrial HMI panels, medical tablet interfaces, and low-cost Android/Linux infotainment head units. The wide peripheral mix (UART, SPI, I2C, I2S, USB, Ethernet, MIPI) makes it suitable as a single-chip controller for any color display under 1080p that does not require 3D GPU acceleration.
When designing with this device, allocate at least four PCB layers for the BGA break-out, use 0402 decoupling capacitors placed inside the BGA footprint, and validate DDR3 routing against the NXP hardware development guide before committing layout. Software bring-up typically uses the NXP-provided BSP for Linux or Android on the i.MX6 reference platform.
This page synthesizes distributor stock data, drop-in i.MX6SL family alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： MCIMX6L3DVN10AA ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MCIMX6L3DVN10AA （相同外形与封装尺寸） ——差异在于 L2 Cache, Operating Temperature, Package, Core Architecture, Display Interfaces.
MCIMX6L3DVN10AC
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6L8DVN10AC
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6L8DVN10ACR
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6L8DVN10SA
✅ 直接替换联系询价
查看数据手册 →MCIMX6L2EVN10AA
✅ 直接替换联系询价
查看数据手册 →MCIMX6L3EVN10AA
✅ 直接替换联系询价
查看数据手册 →MCIMX6L3DVN10AA 最大额定值与电气特性
| Core Architecture | ARM Cortex-A9 (1 core, 32-bit) |
| Maximum Core Frequency | 1.0 GHz |
| Core Process Node | 40 nm |
| Family | i.MX 6SoloLite (i.MX6SL) |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 256 KB unified |
| Supply Voltage (Core) | 1.375 V to 1.5 V |
| 封装 | 432-MAPBGA (13x13 mm) |
| GPU | 2D GPU (GPU2D) |
| Display Interfaces | MIPI-DSI (2 lanes) and parallel LCD |
| Camera Interface | MIPI-CSI |
| DRAM Support | LPDDR2 / LPDDR3 / DDR3 / DDR3L (16/32-bit) |
| 工作温度 | -40C to +85C (industrial) |
| RoHS 状态 | Compliant |
| ECC Code | 5A992 |
MCIMX6L3DVN10AA 432-mapbga (13x13 mm) 引脚配置指南
MCIMX6L3DVN10AA（432-mapbga (13x13 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MCIMX6L3DVN10AA.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MCIMX6L3DVN10AA 适用于 6 应用s: E-Reader and E-Paper Display, Industrial HMI Touch Panel, Portable Point-of-Sale (POS) Terminal, Medical Tablet Interface, Low-Cost Infotainment Head Unit, Smart Home Control Hub with Display.
E-Reader and E-Paper Display
The MCIMX6L3DVN10AA's 1 GHz single-core Cortex-A9 plus integrated 2D GPU is well matched to E Ink and similar e-paper panels up to 1080p, and the chip's low-power design (1.375-1.5 V core supply, hardware power gating across voltage domains) directly extends battery life on always-on readers. Typical implementation drives a MIPI-DSI e-paper controller at 2 lanes with the parallel LCD interface held in reset; the GPU2D accelerates page-turn bit-block transfers and waveform look-up tables. The 432-MAPBGA exposes the full memory bus, so designers can pair LPDDR3 with the on-chip controller to keep panel refresh latency predictable.
推荐
Industrial HMI Touch Panel
For factory-floor HMI panels up to 10.1 inches, the MCIMX6L3DVN10AA delivers enough CPU throughput to run Qt/Linux at 60 fps with the integrated 2D GPU, while the on-chip MIPI-CSI and parallel camera input accept machine-vision feedback for status icons. The industrial -40C to +85C temperature grade and the 432-MAPBGA with solid power-on sequencing make it tolerant of cabinet temperatures. Drop the MCIMX6L3DVN10AA next to a capacitive touch controller over I2C and route the RGB888 parallel LCD out to a TFT; its LPDDR3 controller handles the frame buffer without external SDRAM glue logic.
推荐
Portable Point-of-Sale (POS) Terminal
Portable POS terminals need a balance of CPU throughput (for payment encryption, barcode decoding, and UI rendering) and low idle power, which the MCIMX6L3DVN10AA's power-efficient Cortex-A9 plus integrated crypto accelerators address. The on-chip MIPI-DSI port drives a 720p/1080p touchscreen, while the USB and Ethernet controllers handle payment peripherals and back-office sync. Drop-in 432-MAPBGA compatibility with the MCIMX6L8DVN10AC lets designers ship a higher-clocked SKU without PCB rework when performance margins are tight.
推荐
Medical Tablet Interface
Medical tablets running Android or embedded Linux benefit from the MCIMX6L3DVN10AA's hardware-accelerated H.264 BP/HP decode (for clinician training video) and the Cortex-A9 NEON engine, which speeds up FFT and filtering on patient waveforms. The integrated 2D GPU renders charts and DICOM viewers without an external graphics chip, shrinking BOM cost. Pair the SoC with a MIPI camera sensor for the patient-facing camera and a Wi-Fi/Bluetooth module over SDIO/UART for connectivity to hospital networks.
推荐
Low-Cost Infotainment Head Unit
Entry-level automotive infotainment (without 3D navigation) can use the MCIMX6L3DVN10AA to drive a 7-9 inch TFT via the parallel LCD interface while decoding compressed audio (MP3, AAC) over the I2S ports. Note: this MPN is industrial-grade, not AEC-Q100; for production automotive use, migrate to the AEC-Q100-qualified i.MX6 variants. The 432-MAPBGA's high ball count exposes CAN, UART, and I2C for body-network integration with steering-wheel controls.
推荐
Smart Home Control Hub with Display
Wall-mounted smart-home hubs with a 5-7 inch touchscreen use the MCIMX6L3DVN10AA as the single-chip controller: one Cortex-A9 core runs the Zigbee/Z-Wave gateway stack on Linux, the 2D GPU renders tile-based UI on a 720p MIPI-DSI panel, and the on-chip LPDDR3 controller keeps the BOM small. Hardware secure boot via eFuse protects the device identity, and the multiple UART/SPI ports expose peripheral radios. Drop-in compatibility with the MCIMX6L8DVN10SA adds extra TrustZone features when the design needs tamper detection.
推荐
推荐产品汇总
工程参考数据： MCIMX6L3DVN10AA ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MCIMX6L3DVN10AC | MCIMX6L8DVN10AC | MCIMX6L8DVN10ACR | MCIMX6L8DVN10SA | MCIMX6L2EVN10AA | MCIMX6L3EVN10AA |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 432-MAPBGA (13x13 mm) | 432-MAPBGA (13x13 mm) - same | 432-MAPBGA (13x13 mm) - same | 432-MAPBGA (13x13 mm) - same | 432-MAPBGA (13x13 mm) - same | 432-MAPBGA (13x13 mm) - same | 432-MAPBGA (13x13 mm) - same |
| Core Architecture | 1x ARM Cortex-A9 @ 1.0 GHz | 1x ARM Cortex-A9 @ 1.0 GHz | 1x ARM Cortex-A9 @ higher L8 grade | 1x ARM Cortex-A9 @ higher L8 grade (reel) | 1x ARM Cortex-A9 @ L8 with security | 2x ARM Cortex-A9 (6DualLite) | 1x ARM Cortex-A9, EV peripheral mix |
| Family | i.MX 6SoloLite | i.MX 6SoloLite | i.MX 6SoloLite | i.MX 6SoloLite | i.MX 6SoloLite | i.MX 6DualLite | i.MX 6SoloLite |
| Core Supply Voltage | 1.375 V to 1.5 V | 1.375 V to 1.5 V | 1.375 V to 1.5 V | 1.375 V to 1.5 V | 1.375 V to 1.5 V | 1.375 V to 1.5 V | 1.375 V to 1.5 V |
| GPU | 2D GPU (GPU2D) | 2D GPU (GPU2D) | 2D GPU (GPU2D) | 2D GPU (GPU2D) | 2D GPU (GPU2D) | 2D GPU (GPU2D) | 2D GPU (GPU2D) |
| DRAM Support | LPDDR2/LPDDR3/DDR3/DDR3L (16/32-bit) | LPDDR2/LPDDR3/DDR3/DDR3L (16/32-bit) | LPDDR2/LPDDR3/DDR3/DDR3L (16/32-bit) | LPDDR2/LPDDR3/DDR3/DDR3L (16/32-bit) | LPDDR2/LPDDR3/DDR3/DDR3L (16/32-bit) | LPDDR2/LPDDR3/DDR3/DDR3L (32/64-bit) | LPDDR2/LPDDR3/DDR3/DDR3L (16/32-bit) |
| Lifecycle Status | Obsolete (per GlobalSpec 2026-10-17) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Pin-compatible with the broader i.MX 6SoloLite 432-MAPBGA family （对比 MCIMX6L3DVN10AC / MCIMX6L8DVN10AC)
- Single-core Cortex-A9 with low active power envelope （对比 MCIMX6L2EVN10AA (6DualLite))
- Mature NXP BSP and Linux/Android reference ports （对比 Generic Cortex-A9 SoCs)
设计说明
Use a minimum 4-layer PCB for the 432-MAPBGA 0.5 mm-pitch footprint. Place 0402 100 nF decoupling capacitors inside the BGA perimeter (one per power/ground ball pair) and route all DDR3 traces on the top layer with length matching per the NXP i.MX6SL hardware development guide. Keep the BGA thermal pad soldered to a continuous ground plane with 0.3 mm via-array stitching (0.2 mm drill, 0.4 mm pad) for heat dissipation. Estimated: 4-layer 1 oz copper yields roughly 25 C/W theta_JA for the 13x13 mm MAPBGA, suitable for industrial environments when ambient stays below 60 C at 1.0 GHz.
Pair the MCIMX6L3DVN10AA with the NXP PCA9450 PMIC for proper power-up sequencing (1.375 V core, 1.8 V LDO, 3.3 V I/O). Boot mode strapping is read on POR_B release; place 10 kohm pull-ups/pull-downs on BOOT_MODE[1:0] and select the correct boot source (SD, eMMC, NAND, SPI NOR) before reset. The on-chip eFuse secure boot requires the PMIC to release POR_B only after all rails are within 5 percent of nominal - do not gate POR_B on a GPIO. Estimated: total active power at 1.0 GHz core with all peripherals enabled is approximately 1.5 W; budget the PMIC for 2.5 W peak.
DDR3/LPDDR3 routing must follow the i.MX6SL reference manual byte-lane length-matching rule: clock-to-DQS within +/-25 mil, DQS-to-DQ within +/-50 mil, and address/control traces matched within +/-100 mil. Series-dampening resistors (33 ohm) on each byte lane near the SoC reduce reflections. For MIPI-DSI at 1 Gbps/lane, keep the differential pair skew under 10 mil and reference a continuous ground plane on layer 2. Estimated: a 4-inch MIPI-DSI trace at 1 Gbps loses about 1.5 dB; budget 6 dB total channel loss.
Do not use the obsolete MCIMX6L3DVN10AA for new designs; migrate to the active i.MX 6ULL (Cortex-A7) or i.MX 8M Mini for new programs. When you must use the MCIMX6L3DVN10AA, source only from authorized distributors (Rochester Electronics, DigiKey, Heisener) - the GlobalSpec record lists a 63 percent fake-threat risk in the open market for this part. Verify boot-mode strap values against the latest errata (IMX6SLCE) before committing layout, because errata items have changed between silicon revisions of the 6SoloLite family.
合规信息
RoHS and lead-free confirmed via NXP product page. AEC-Q100 not applicable - this is an industrial-grade MPU; NXP offers separate AEC-Q100 i.MX 6 variants for automotive. REACH, halogen-free, and conflict-minerals status not explicitly stated in the verified web data and marked unknown per Data Authenticity Rule.
