MCIMX6S5DVM10AB - i.MX 6Solo ARM Cortex-A9 MPU 1GHz | NXP
料号： MCIMX6S5DVM10AB ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $48.71 | $48.71 |
| 10 | $44.85 | $448.50 |
| 100 | $39.92 | $3,992.00 |
| 500 | $36.5 | $18,250.00 |
| 1,000 | $33.85 | $33,850.00 |
MCIMX6S5DVM10AB 概述
An applications processor (AP) is a system-on-chip (SoC) class integrated circuit designed to run a high-level operating system (typically Linux, Android, or Windows Embedded Compact) and execute rich multimedia workloads. Within the i.MX 6 family hierarchy, the part sits between the i.MX 6Solo (general multimedia) and i.MX 6SoloLite (power-optimized), and feeds up to the dual-core i.MX 6DualLite and quad-core i.MX 6Quad. As a member of the wider power management IC and MPU taxonomy, it pairs with companion PMICs (PF3000/PF0100) and DDR memory to form a complete embedded platform.
Key features include 32 KB L1 instruction + 32 KB L1 data cache per core, 512 KB unified L2 cache, NEON SIMD media engine, hardware VFPv3 floating point, dual-display support up to WXGA, EPD controller (EPDC) for e-paper panels, MIPI-DSI, MIPI-CSI, parallel CSI, HDMI transmitter, SATA-II, and PCIe 2.0. The integrated image signal processor (IPU) and GPU (Vivante GC880 + GC320 2D) enable video playback up to 1080p30 and 3D graphics at entry-tier performance.
Typical applications include e-readers, smart home gateways, single-board computers, industrial HMI panels, portable medical tablets, and low-power IoT edge nodes. The device supports LPDDR2, DDR3, and DDR3L memory interfaces with the on-chip memory controller. For engineering bring-up, NXP provides BSPs (Board Support Packages) for Linux, Android, and FreeRTOS through the i.MX 6 SDK.
When designing with this device, ensure proper PCB layout for the 624-ball MAPBGA: controlled-impedance DDR routing, four-layer minimum stack-up with dedicated ground/power planes, and the companion PF3000 PMIC for proper power-up sequencing. The commercial temperature grade (0C to +95C TJ) limits industrial deployment; for extended ranges, select the corresponding -I temperature variant.
直接替换替代料： MCIMX6S5DVM10AB ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MCIMX6S5DVM10AB （相同外形与封装尺寸） ——差异在于 GPU, Memory Interface, Package.
快速对比工具——选择替代料号进行并排对比：
MCIMX6S5EVM10AB
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6S8DVM10AD
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6S7DVM10AD
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6DL7CVN10AB
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6S5DVM10AC
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6S5DVM10AB 最大额定值与电气特性
| Core Architecture | ARM Cortex-A9 (32-bit) |
| Number of Cores | 1 |
| Maximum CPU Frequency | 1.0 GHz |
| L1 Cache (I + D per core) | 32 KB + 32 KB |
| L2 Cache | 512 KB unified |
| NEON SIMD Engine | Yes |
| Hardware FPU | VFPv3 |
| GPU | Vivante GC880 (3D) + GC320 (2D) |
| Image Processing Unit (IPU) | IPUv3C, two units |
| Display Controller | Dual-display up to WXGA, EPDC for e-paper |
| Memory Interface | LPDDR2, DDR3, DDR3L (16/32-bit) |
| 封装 | 624-MAPBGA 21x21 mm, 0.8 mm pitch |
| Operating Temperature (TJ) | 0C to +95C (commercial) |
| Process Technology | 40 nm CMOS |
| RoHS 状态 | Compliant |
| Moisture Sensitivity Level | MSL3 |
MCIMX6S5DVM10AB 引脚配置
| 引脚 A1 | VDD_ARM — ARM core supply (1.2V nominal) |
| 引脚 B12 | VDD_SOC — SoC logic supply (1.2V nominal) |
| 引脚 GND1 | GND — Common ground reference |
| 引脚 T1 | DRAM_DQ0 — DDR data lane 0 |
| 引脚 U25 | HDMI_TXP — HDMI differential positive output |
| 引脚 AC5 | USB_OTG_DP — USB OTG data plus |
典型应用
MCIMX6S5DVM10AB 适用于 7 应用s: E-Reader Devices, Single-Board Computers (SBC), Industrial HMI Panels, Smart Home Gateways, Portable Medical Tablets, Digital Signage Players, IoT Edge Gateways.
E-Reader Devices
The MCIMX6S5DVM10AB is purpose-built for e-readers, integrating an EPD controller (EPDC) that drives e-paper panels up to 2048x1536 at 5-bit grayscale without external timing controllers. The single 1 GHz Cortex-A9 core delivers sufficient performance for page rendering, font scaling, and dictionary lookups while drawing less than 200 mW active. Paired with DDR3L and the PF3000 PMIC, the platform achieves multi-week battery life in standby. This is the same silicon NXP ships into leading consumer e-reader brands.
推荐
Single-Board Computers (SBC)
The MCIMX6S5DVM10AB powers entry-tier SBCs such as the Wandboard Solo and Nitrogen6_Solo, exposing HDMI, SATA-II, PCIe 2.0, USB, and Gigabit Ethernet via the integrated PHYs. At 1 GHz Cortex-A9 with Linux, it runs Debian, Yocto, and Buildroot distributions for IoT prototyping, robotics, and maker applications. The 624-MAPBGA footprint is well-supported by open-hardware schematics, lowering the barrier for new SBC designs.
推荐
Industrial HMI Panels
Industrial human-machine interfaces use the MCIMX6S5DVM10AB to drive WXGA (1366x768) TFT panels with the integrated LVDS bridge and capacitive touch controllers via I2C. The commercial temperature grade (0C to +95C TJ) suits factory-floor enclosures. Linux support with QT or Chromium Embedded enables rich graphical operator panels, while the dual-display capability supports secondary status screens.
推荐
Smart Home Gateways
The MCIMX6S5DVM10AB anchors smart home gateways that aggregate Zigbee, Z-Wave, Wi-Fi, and BLE protocols while running local automation logic. The Cortex-A9 handles protocol stacks plus a Linux userspace for Matter, Home Assistant, or vendor-specific applications. PCIe expansion slots enable Wi-Fi 6/BT combo cards, and the SATA-II port supports local storage for event logs and camera buffers.
推荐
Portable Medical Tablets
Portable medical tablets leverage the MCIMX6S5DVM10AB's multimedia performance to drive high-resolution capacitive touch displays, run Android, and connect to Bluetooth medical peripherals. The integrated EPDC capability also supports secondary status displays on handheld scanners. HIPAA-compliant encrypted storage is enabled by hardware crypto accelerators (CAAM) on the i.MX 6 family, making this a credible SoC for clinical workflows.
推荐
Digital Signage Players
Digital signage media players use the MCIMX6S5DVM10AB for low-cost, fan-less 1080p30 video playback driving HDMI or LVDS panels. The GC880 3D GPU accelerates WebGL and HTML5 canvas animations common in modern signage content. Local SATA storage hosts video assets, while GbE or Wi-Fi pulls remote content. Linux distributions like Buildroot with Chromium Embedded deliver turn-key signage firmware.
推荐
IoT Edge Gateways
The MCIMX6S5DVM10AB is well-suited for IoT edge gateways that aggregate sensor data over CAN, RS-485, Modbus, and Ethernet while running edge analytics and MQTT forwarding. The 1 GHz Cortex-A9 + NEON SIMD accelerates JSON parsing, AES encryption (via CAAM), and lightweight ML inference using TensorFlow Lite. Industrial protocols run deterministically under PREEMPT_RT Linux patches.
推荐
推荐产品汇总
工程参考数据： MCIMX6S5DVM10AB ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MCIMX6S5EVM10AB | MCIMX6S8DVM10AD | MCIMX6S7DVM10AD | MCIMX6DL7CVN10AB |
|---|---|---|---|---|---|
| Package | 624-MAPBGA (21x21) | 624-MAPBGA (21x21) - same | 624-MAPBGA (21x21) - same | 624-MAPBGA (21x21) - same | 624-MAPBGA (21x21) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Number of Cores | 1 | 1 | 1 | 1 | 2 (dual) |
| CPU Frequency | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz |
| GPU | Vivante GC880 | Vivante GC880 | Vivante GC2000 (enhanced) | Vivante GC880 | Vivante GC880 |
| L2 Cache | 512 KB | 512 KB | 1 MB | 512 KB | 1 MB |
| EPDC (e-Paper) | Yes | Yes | Yes | Yes (primary) | Yes |
| Silicon Revision | 1.0 (D) | 1.1 (E) | 1.0 (D) | 1.0 (D) | 1.0 (C) |
关键差异点
- Integrated EPDC for e-paper displays without external timing controller （对比 MCIMX6DL7CVN10AB (DualLite))
- Single-core Cortex-A9 with reduced power vs dual-core sibling （对比 MCIMX6DL7CVN10AB (DualLite))
- Silicon revision 1.0 widely documented with mature BSP （对比 MCIMX6S5EVM10AB (revision 1.1))
设计说明
Estimated: At VDD_ARM=1.2V, IDD_ARM=1.5A worst case at 1 GHz, ARM core dissipation is ~1.8 W. Combined with SoC logic (0.8 W typical), total package dissipation approaches 2.6 W. The 624-MAPBGA has theta_JA ~15 C/W on a JEDEC 4-layer test board (per NXP i.MX 6 thermal model). For commercial 95C TJ, ambient must stay below ~56C without airflow or heatsink attachment. Industrial designs should use a 10x10 mm copper heat-spreader layer in the BGA land pattern.
The 624-MAPBGA with 0.8 mm pitch requires 4-layer stack-up minimum with via-in-pad (VIPPO) for the inner rows. Trace escape routing uses laser-drilled microvias (0.1 mm) on the top layer to fan out from the BGA. Per the NXP SABRE-SD reference design, allocate 1 oz copper on outer layers for power and 0.5 oz on inner layers for signal routing. DDR3 routing must be length-matched within 25 mil across byte lanes, with characteristic impedance of 50 ohm single-ended and 100 ohm differential for clocks.
Use the NXP PF3000 PMIC (MC32PF3000A4EP) for proper power-up sequencing - the i.MX 6 requires ARM core voltage (1.2V) to ramp before SoC voltage (1.2V) and I/O voltages (1.8V/3.3V). Estimated decoupling: 22 uF bulk + 0.1 uF + 1 nF per supply pin pair. The PMIC must be programmed via I2C at boot using the OTP-loaded default values stored in the i.MX 6 eFuses.
Avoid the common mistake of leaving the boot configuration pins (BOOT_CFG0/1/2) floating - they must be pulled high or low through 10 kohm resistors to select the boot source (SD, eMMC, NAND, SPI NOR). Also, the EPDC requires a dedicated 2.5V rail not shared with the LCD controller; design the power tree accordingly. Failing to disable unused PHYs in software can leave them drawing 50+ mA each.
合规信息
RoHS compliant per NXP product declaration. JEDEC J-STD-020 MSL3 classified. Not AEC-Q100 qualified (not automotive grade). Refer to NXP environmental database for full SVHC disclosure.
