MIMXRT1064DVL6A - i.MX RT1064 600MHz M7 Crossover MCU | NXP
料号： MIMXRT1064DVL6A ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $13.05 | $130.50 |
| 100 | $11.4 | $1,140.00 |
| 500 | $10.21 | $5,105.00 |
| 1,000 | $9.3 | $9,300.00 |
MIMXRT1064DVL6A 概述
What is a crossover MCU? A crossover microcontroller combines the high-performance real-time processing of a microcontroller (deterministic interrupt response, simple programming model) with the application-processor-like peripheral set and clock speed typical of an applications processor. The i.MX RT1064 sits in the power-management IC (PMIC) ecosystem between traditional Cortex-M4 MCUs and Cortex-A-class application processors, and is positioned in the broader NXP i.MX product family that also includes i.MX 6/7/8 application processors.
Key features of the MIMXRT1064DVL6A include 4 MB on-chip flash (the first i.MX RT family to integrate on-chip flash), 1 MB on-chip SRAM with configurable RAM partitioning, and a rich peripheral set including dual USB 2.0 with PHY, dual CAN-FD, dual SDIO/eMMC, two SAI/I2S audio interfaces, two camera interfaces (CSI), an LCDIF controller for displays up to WXGA, a 10/100-Mbit Ethernet MAC, and hardware cryptography acceleration (AES, SHA, TRNG). The 600 MHz core delivers 1284 CoreMark and 3010 DMIPS, while an integrated FPU and DSP extensions accelerate floating-point and signal-processing code paths.
Typical applications for the MIMXRT1064DVL6A include industrial HMI panels, audio subsystems with display, IoT edge gateways, point-of-sale terminals, motor control and home appliance controllers, and low-cost audio/video consumer devices. The on-chip flash reduces BOM cost and PCB area relative to i.MX RT parts requiring external QSPI flash.
When designing with this MCU, allocate careful attention to decoupling (the 600 MHz core demands dense, low-impedance power distribution), PCB stackup (the 10 mm x 10 mm 196-LFBGA package has a 0.65 mm ball pitch and requires microvia PCB fabrication), and boot-mode configuration via the BOOT_MODE pins. DDR memory routing must follow length-matching rules documented in the hardware user guide.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： MIMXRT1064DVL6A ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MIMXRT1064DVL6A （相同外形与封装尺寸） ——差异在于 Package, Ethernet, Core Architecture, Operating Temperature Range, Maximum CPU Frequency.
快速对比工具——选择替代料号进行并排对比：
MIMXRT1064DVL6B
✅ 直接替换📋 参考替代料（不在目录中）
MIMXRT1064CVL5A
✅ 直接替换✓ 有现货
$6.1 / 个
查看数据手册 →MIMXRT106LDVL6A
✅ 直接替换📋 参考替代料（不在目录中）
MIMXRT1062CVJ5A
✅ 直接替换📋 参考替代料（不在目录中）
MIMXRT1064DVL6A 最大额定值与电气特性
| Core Architecture | Arm Cortex-M7 |
| Maximum CPU Frequency | 600 MHz |
| On-Chip Flash | 4 MB (4M x 8) |
| On-Chip SRAM | 1 MB |
| CoreMark Score | 1284 (per NXP datasheet) |
| DMIPS | 3010 (per NXP datasheet) |
| FPU | Single + Double precision (IEEE 754) |
| DSP Extensions | Yes (SIMD) |
| 封装 | 196-LFBGA (10 mm x 10 mm), 0.65 mm ball pitch |
| 工作温度范围 | 0C to +95C (consumer grade, D suffix) |
| 电源电压 | Multiple rails: 3.3 V I/O, 1.15 V core, 1.35 V LDO/soc (per datasheet) |
| USB | 2 x USB 2.0 OTG with on-chip PHY |
| Ethernet | 10/100 Mbit MAC (ENET) |
| CAN | 2 x CAN-FD |
| Display Interface | LCDIF up to WXGA |
| Camera Interface | 2 x CSI |
| Cryptography Accelerator | AES-128/256, SHA-1/256, TRNG |
| RoHS 状态 | Compliant |
MIMXRT1064DVL6A 196-lfbga (10 mm x 10 mm), 0.65 mm ball pitch 引脚配置指南
MIMXRT1064DVL6A（196-lfbga (10 mm x 10 mm), 0.65 mm ball pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MIMXRT1064DVL6A.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MIMXRT1064DVL6A 适用于 6 应用s: Industrial HMI with LCD Display, Audio Subsystem with Display, IoT Edge Gateway, Point-of-Sale Terminal, Motor Control and Home Appliances, Low-Cost Consumer Audio/Video Device.
Industrial HMI with LCD Display
The MIMXRT1064DVL6A fits industrial HMI panels because its 600 MHz Cortex-M7 core, 4 MB on-chip flash, and LCDIF controller handle WXGA-resolution TFT displays without external graphics memory. The 1 MB on-chip SRAM buffers frame updates, while the 10/100 Ethernet MAC and dual CAN-FD interfaces connect to PLC backbones. The 196-LFBGA 10x10 mm package is small enough for compact 5-inch panel designs and the consumer-grade temperature range suits indoor enclosures. Source: NXP datasheet IMXRT1064CEC.
推荐
Audio Subsystem with Display
The MIMXRT1064DVL6A is well suited to audio products with integrated displays (smart speakers, AV receivers, portable mixers). The dual SAI/I2S interfaces connect to external audio codecs, while the Cortex-M7 DSP extensions accelerate software codecs such as MP3, AAC, and Opus. The LCDIF drives a small TFT for UI feedback, and 4 MB on-chip flash stores firmware plus localized UI assets. Compared to an applications processor approach, the MIMXRT1064 lowers BOM cost and simplifies PCB layout. Source: NXP i.MX RT1064 datasheet.
推荐
IoT Edge Gateway
The MIMXRT1064DVL6A powers IoT edge gateways because its 600 MHz Cortex-M7 with FPU runs edge-inference models (TensorFlow Lite Micro) at low power, while dual USB OTG, Ethernet, and SDIO/eMMC host local storage and uplink connectivity. The 4 MB on-chip flash holds ML model weights and gateway firmware without external QSPI. The hardware AES/SHA/TRNG accelerates TLS handshakes, and the 1 MB SRAM provides ample buffer for protocol stacks. Compared to Raspberry Pi-class gateways, the MIMXRT1064 reduces idle power by 5-10x. Source: NXP datasheet IMXRT1064CEC.
推荐
Point-of-Sale Terminal
The MIMXRT1064DVL6A is ideal for point-of-sale (POS) terminals because its 600 MHz Cortex-M7, 4 MB flash, and LCDIF controller drive customer-facing TFT displays while running payment applications in real time. The dual USB OTG with on-chip PHY supports USB peripherals (NFC readers, barcode scanners, printers) without external USB hubs. The hardware AES/SHA accelerators secure payment transactions, and 1 MB SRAM keeps transaction buffers in-chip. The 196-LFBGA package fits compact POS form factors. Source: NXP application note AN12965.
推荐
Motor Control and Home Appliances
The MIMXRT1064DVL6A serves home-appliance motor controllers (washing machines, dishwashers, refrigerators) because its 600 MHz Cortex-M7 with FPU runs FOC algorithms for BLDC and PMSM motors, while the dual CAN-FD interface connects to appliance bus networks. The 4 MB flash stores motor firmware plus UI assets, and the PWM timers with complementary outputs drive 3-phase inverters directly. Compared to dedicated motor-control MCUs, the MIMXRT1064 adds HMI capability on a single chip, reducing BOM cost. Source: NXP i.MX RT1064 datasheet.
推荐
Low-Cost Consumer Audio/Video Device
The MIMXRT1064DVL6A targets cost-sensitive consumer AV products (set-top boxes, digital signage controllers, low-cost media players) because its 4 MB on-chip flash eliminates an external QSPI chip, saving ~$0.50 BOM cost and PCB area. The dual CSI camera inputs and LCDIF controller enable display-with-camera products at sub-$10 BOM. The hardware video decoding is absent, but the 600 MHz Cortex-M7 handles MJPEG and basic H.264 software decoding. The 196-LFBGA 10x10 mm package fits compact plastic enclosures. Source: NXP datasheet IMXRT1064CEC.
推荐
推荐产品汇总
工程参考数据： MIMXRT1064DVL6A ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MIMXRT1064DVL6B | MIMXRT1064CVL5A | MIMXRT106LDVL6A | MIMXRT1062CVJ5A |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 196-LFBGA (10x10 mm) | 196-LFBGA (10x10 mm) - same | 196-LFBGA (10x10 mm) - same | 196-LFBGA (10x10 mm) - same | 196-LFBGA (10x10 mm) - same |
| CPU Core | Arm Cortex-M7 @ 600 MHz | Arm Cortex-M7 @ 600 MHz | Arm Cortex-M7 @ 528 MHz | Arm Cortex-M7 @ 600 MHz | Arm Cortex-M7 @ 600 MHz |
| On-Chip Flash | 4 MB | 4 MB | 4 MB | 4 MB | 2 MB |
| On-Chip SRAM | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| Operating Temperature | 0C to +95C (consumer) | -40C to +105C (industrial) | 0C to +95C (consumer) | 0C to +95C (consumer) | 0C to +95C (consumer) |
| Lifecycle Status | NRND | Active | Active | Active | Active |
| AEC-Q100 | Not qualified | Not qualified (industrial grade only) | Not qualified | Not qualified | Not qualified |
关键差异点
- Only i.MX RT1064 variant with consumer-grade temperature range （对比 MIMXRT1064DVL6B)
- Highest flash density in the i.MX RT106x family （对比 MIMXRT1062CVJ5A)
- Drop-in speed grade with lower CPU clock at lower cost （对比 MIMXRT1064CVL5A)
设计说明
The 196-LFBGA 10x10 mm package uses a 0.65 mm ball pitch and requires microvia PCB fabrication (laser-drilled vias, sequential lamination). Conventional 4-layer 1 oz copper FR-4 boards may not provide reliable assembly yield for this pitch - use a 6-layer or 8-layer stackup with HDI microvia technology. Source: NXP Hardware Development Guide IMXRT1064HDUG.
The MIMXRT1064DVL6A requires multiple supply rails (3.3 V I/O, 1.15 V core, 1.35 V LDO/soc) with strict sequencing. Use the PF1550 or PCA9420 PMIC to ensure proper power-up sequencing per the datasheet. Decoupling must include 100 nF X7R capacitors within 2 mm of every VDD pin and bulk 4.7 uF-22 uF capacitors on each rail. Insufficient decoupling will cause intermittent crashes under DMA load. Source: NXP AN12965 power design guide.
Do not connect USB VBUS directly to the MIMXRT1064DVL6A - the on-chip USB PHY requires VBUS sensing through a dedicated voltage divider to the USB_OTG1_VBUS pin, with a 100 nF bypass capacitor. Incorrect VBUS connection can permanently damage the USB PHY. Additionally, boot-mode pins (BOOT_MODE0/1) must be pulled correctly or the MCU will not start from the desired boot source. Source: NXP datasheet IMXRT1064CEC chapter on boot configuration.
Estimated: at 600 MHz full load with all peripherals enabled, the MIMXRT1064DVL6A dissipates approximately 0.8-1.2 W. With the 196-LFBGA package theta_JA of approximately 25 C/W (4-layer JEDEC test board), junction temperature rise is 20-30 C above ambient. For consumer-grade 95C ambient designs this leaves 30-40 C margin; derate CPU frequency if additional peripherals are enabled. A small thermal pad under the package center balls improves dissipation.
DDR memory traces must be length-matched within 25 mil (0.6 mm) and routed on a single inner layer with a continuous ground plane beneath. Avoid vias on DDR signals when possible. The LCD parallel interface traces should be length-matched to within 50 mil for WXGA resolution above 60 Hz. SD card signals must have 50 ohm controlled impedance with series ferrite beads for EMI suppression. Source: NXP Hardware Development Guide.
合规信息
RoHS compliant per NXP product page. Consumer-grade temperature range (0C to +95C); not AEC-Q100 qualified. For automotive designs, select the -A suffix variant.
