MPC8275ZQMIBA - PowerQUICC II 266MHz SoC MPU | NXP Semiconductors
料号： MPC8275ZQMIBA ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $218.75 | $109,375.00 |
| 1,000 | $195.5 | $195,500.00 |
MPC8275ZQMIBA 概述
Background Knowledge - What is a PowerQUICC communications processor: PowerQUICC is NXP/Freescale's brand name for a family of integrated communications processors that combine a Power Architecture CPU core with a specialized communications processor module (CPM). The CPM offloads peripheral and networking tasks from the main CPU, enabling efficient handling of multiple WAN, LAN, and telecom protocols such as ATM, HDLC, Ethernet, USB, and UTOPIA. PowerQUICC II sits within the broader taxonomy of integrated communications processors -> microprocessors (MPU) -> processors -> semiconductors, and is widely deployed in routers, switches, DSLAMs, and industrial control equipment where deterministic multi-protocol I/O is required.
Key features of the MPC8275ZQMIBA include a 266 MHz PowerPC G2_LE CPU core, hardware-accelerated communications via the CPM, integrated support for Fast Ethernet MAC, USB, PCI, HDLC, and UTOPIA, and a 1.5V core / 3.3V I/O dual-rail power design. The 516-pin PBGA package exposes extensive address/data buses and peripheral pins, supporting a wide variety of networking and embedded control applications. The device's commercial operating temperature range (0C to 105C) suits controlled-environment networking gear.
At the architecture level, the MPC8275ZQMIBA uses a Harvard-style bus architecture for the CPU, a unified 32-bit peripheral bus for the CPM, and dedicated DMA channels that allow the CPM to move data between peripherals and memory without CPU intervention. This integration reduces BOM count and board area relative to discrete CPU-plus-communications-controller designs, while the wide peripheral set lowers the cost of multi-protocol product variants.
Typical applications include wired and wireless infrastructure equipment (DSLAMs, routers, wireless base stations), industrial networking gateways, protocol-conversion appliances, and embedded control systems that require deterministic serial and packet I/O. The combination of CPU throughput and CPM-driven I/O makes it well-suited for products that aggregate multiple physical interfaces.
Design consideration: Power-sequencing must follow NXP's reference design because the MPC8275ZQMIBA uses split 1.5V core and 3.3V I/O rails; bring-up order affects CPM register state. Additionally, the large 516-ball PBGA requires careful BGA PCB layout with controlled-impedance traces and matched-length clocks to maintain signal integrity at the full 266 MHz bus speed.
This page synthesizes distributor stock checks, NXP/Freescale PowerQUICC II family cross-references, and practical BGA bring-up design notes that go beyond the manufacturer datasheet to assist embedded and network-equipment engineers in component selection.
直接替换替代料： MPC8275ZQMIBA ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MPC8275ZQMIBA （相同外形与封装尺寸） ——差异在于 Process Technology, Operating Temperature, Package, Mounting Type, Core Architecture.
快速对比工具——选择替代料号进行并排对比：
MPC8275CVRMIBA
✅ 直接替换✓ 有现货
$140.2 / 个
查看数据手册 →MPC8275VRMIBA
✅ 直接替换✓ 有现货
$87.8 / 个
查看数据手册 →MPC8270ZQMIBA
✅ 直接替换✓ 有现货
$54.25 / 个
查看数据手册 →MPC8270VRMIBA
✅ 直接替换✓ 有现货
$95.75 / 个
查看数据手册 →MPC8280ZQMIBA
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MPC8275ZQMIBA 最大额定值与电气特性
| Family | PowerQUICC II (MPC82xx) |
| Core Architecture | PowerPC G2_LE, 32-bit |
| Maximum Core Frequency | 266 MHz |
| Number of Cores | 1 |
| Core Voltage | 1.5 V |
| I/O Voltage | 3.3 V |
| Process Technology | 0.13 micron (HiP7) |
| Integrated Communications Engine | Yes (CPM with FCC, HDLC, USB, UTOPIA) |
| PCI Interface | Yes |
| USB Interface | Yes |
| Ethernet Support | Fast Ethernet MAC |
| UTOPIA Interface | Yes |
| 工作温度范围 | 0 C to 105 C (Commercial) |
| 封装 | 516-ball PBGA, 27x27 mm |
| 安装类型 | Surface Mount |
MPC8275ZQMIBA 516-ball pbga, 27x27 mm 引脚配置指南
MPC8275ZQMIBA（516-ball pbga, 27x27 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MPC8275ZQMIBA.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MPC8275ZQMIBA 适用于 6 应用s: Wired Communications Infrastructure (DSLAM / Router), Industrial Networking Gateways, Wireless Base Station Controllers, Protocol Conversion Appliances, Embedded Control and Test Systems, VoIP and Media Gateways.
Wired Communications Infrastructure (DSLAM / Router)
The MPC8275ZQMIBA is purpose-built for wired infrastructure equipment such as DSLAMs, multi-service routers, and broadband access concentrators. Its integrated CPM offloads HDLC framing, ATM cell processing, and Fast Ethernet MAC operations so the 266 MHz PowerPC G2_LE core can focus on routing, QoS, and management-plane tasks. Designers benefit from deterministic per-channel DMA, multi-protocol PPPoA/PPPoE termination, and 3.3V I/O interfacing directly to PHY and line-driver ICs. The 1.5V/3.3V dual-rail power design simplifies the power tree, while the 516 PBGA keeps BOM count low by eliminating external communications controllers. This part delivers the protocol agility telco-grade access products require.
推荐
Industrial Networking Gateways
Industrial protocol gateways and serial-to-Ethernet converters benefit from the MPC8275ZQMIBA's combination of Ethernet, HDLC, USB, and PCI in a single chip. The 266 MHz core runs protocol-conversion firmware while the CPM manages multi-port serial, Modbus, and PROFIBUS-style traffic with hardware acceleration. The 0 C to +105 C commercial temperature range covers factory-floor cabinets and outdoor enclosures in mild climates, while dual power rails (1.5V core, 3.3V I/O) simplify integration with industrial PHYs and RS-485 transceivers. The result is a compact, deterministic gateway that replaces a CPU-plus-discrete-controller discrete design.
推荐
Wireless Base Station Controllers
The MPC8275ZQMIBA is used in 2G/3G base-station controllers and picocell baseband units where its CPM handles Abis/Iub framing, E1/T1 HDLC channels, and Ethernet backhaul simultaneously. The 266 MHz PowerPC G2_LE executes Layer 2/3 forwarding, while the CPM's dedicated DMA engines move data between memory and the multiple TDM/Ethernet ports without CPU intervention - critical for deterministic latency in cellular backhaul. PCI and local bus expansion let designers add baseband modem cards or radio-unit interfaces without external glue logic. The mature PowerQUICC II silicon provides proven reliability in carrier-grade deployments.
推荐
Protocol Conversion Appliances
Protocol-conversion appliances - bridging legacy fieldbus, serial, and modern IP networks - rely on the MPC8275ZQMIBA's multi-protocol offload. The CPM's FCCs can be configured for HDLC, UART, BISYNC, or Ethernet, while the PCI bus allows expansion to additional PHY or FPGA cards. Designers appreciate the deterministic interrupt latency of the PowerQUICC II architecture for SCADA and industrial-control protocol stacks (Modbus TCP, DNP3, IEC 60870). The 516 PBGA package plus a single 1.5V/3.3V regulator pair keeps the appliance footprint compact and the BOM cost competitive for medium-volume deployments.
推荐
Embedded Control and Test Systems
Embedded control systems and automated test equipment (ATE) leverage the MPC8275ZQMIBA for its combination of high-throughput CPU, integrated Ethernet and USB for host connectivity, and PCI for instrument expansion. The PowerPC G2_LE executes real-time control loops while the CPM manages instrument-bus protocols. Designers can attach PCI-based data-acquisition modules directly to the host bus, eliminating an external bridge chip. The mature toolchain (U-Boot, VxWorks, Linux 2.6 PowerPC) keeps firmware development cost low compared to migrating to a newer SoC. This is the same use-case profile the PowerQUICC family was originally designed to address.
推荐
VoIP and Media Gateways
VoIP media gateways and softswitches use the MPC8275ZQMIBA to terminate TDM voice circuits (T1/E1) via the HDLC-capable FCCs, while the integrated Fast Ethernet MAC and UTOPIA interface carry RTP/UDP voice streams to the IP backbone. The CPM's per-channel DMA keeps jitter low, a critical requirement for voice quality, while the 266 MHz PowerPC core handles signaling stacks (SIP, H.248, MGCP) and transcoding coordination. The commercial temperature range suits indoor central-office and customer-premises equipment. Designers benefit from consolidating CPU, TDM, and Ethernet functions on a single 516 PBGA, reducing gateway BOM and board area.
推荐
推荐产品汇总
工程参考数据： MPC8275ZQMIBA ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPC8275CVRMIBA | MPC8275VRMIBA | MPC8270ZQMIBA | MPC8270VRMIBA | MPC8280ZQMIBA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516 PBGA (27x27) | 516 PBGA (27x27) - same | 516 PBGA (27x27) - same | 516 PBGA (27x27) - same | 516 PBGA (27x27) - same | 516 PBGA (27x27) - same |
| Family | PowerQUICC II (MPC82xx) | PowerQUICC II (MPC82xx) | PowerQUICC II (MPC82xx) | PowerQUICC II (MPC82xx) | PowerQUICC II (MPC82xx) | PowerQUICC II (MPC82xx) |
| Integrated Ethernet MAC | Yes (Fast Ethernet) | Yes (Fast Ethernet) | Yes (Fast Ethernet) | No | No | Yes |
| UTOPIA Interface | Yes | Yes | Yes | No | No | Yes |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
关键差异点
- Integrated Fast Ethernet MAC + UTOPIA on the same 516 PBGA （对比 MPC8270ZQMIBA)
- Mid-frequency position in the PowerQUICC II range with proven CPM （对比 MPC8280ZQMIBA)
- Mature PowerQUICC II toolchain and reference designs （对比 Newer NXP QorIQ/Layerscape parts)
设计说明
The 516-ball PBGA at 27x27 mm requires a high-layer-count PCB with microvia (laser-drilled) stackups. Use 1.0 mm or 1.27 mm ball pitch BGA fan-out rules and pair each high-speed signal with a continuous reference plane. Decoupling must use a mix of bulk, mid-frequency, and high-frequency ceramic capacitors placed within 100 mils of the balls; the NXP MPC8275 hardware design guide provides the reference capacitor mix (e.g. 10 uF bulk + 1 uF + 100 nF + 10 nF per power pin group).
Power sequencing for the MPC8275ZQMIBA must bring up the 1.5V core rail before the 3.3V I/O rail, otherwise internal CPM register state may latch incorrectly. Follow the NXP reference design for sequencing - many designs use a power-management ASIC (e.g. a TPS family PMIC) or a simple comparator-based sequencer. Hold RESET asserted until both rails are stable for the minimum datasheet-specified interval.
Estimated: worst-case power dissipation in a fully-active MPC8275ZQMIBA design with all CPM channels active is approximately 2.5-3.5 W. With a 516 PBGA theta-JA of roughly 15-20 C/W on a 6-layer JEDEC test board, this corresponds to a junction temperature rise of roughly 50-70 C above ambient at 25 C - well within the 105 C commercial limit. Designers should still verify thermal performance in the final enclosure because forced-air cooling and board-stack airflow vary widely.
The 266 MHz external bus and PCI clock generation require matched-length traces and controlled impedance (typically 50 ohm single-ended, 100 ohm differential for PCI). Use length-matching within +/- 50 mil for byte lanes and route clock signals with a 3W spacing rule to avoid crosstalk. Series termination may be required on heavily-loaded address/data buses; check the IBIS model in the NXP design kit before committing to layout.
A common bring-up pitfall is omitting the correct configuration of the Hard Reset Configuration Words - the MPC8275ZQMIBA samples several address/data pins during reset to determine bus width, endianness, and boot ROM location. Incorrect settings will result in a silent no-boot; consult the PowerQUICC II reference manual chapter on reset configuration. Also watch for the well-documented issue of incorrect CPM command queue synchronization when porting code from MPC8260 to MPC8275 - the timing of the parameter RAM initialization differs slightly.
合规信息
Compliance information not present in the verified web sources. The MPC8275ZQMIBA is a legacy NXP/Freescale PowerQUICC II part; lead-free and RoHS status should be confirmed via NXP's product material declaration or by contacting the franchised distributor before PCB assembly.
