MPC8347EVVAGDB - PowerQUICC II Pro, 400MHz e300 MPU, 672-LBGA | NXP
料号： MPC8347EVVAGDB ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88.5 | $885.00 |
| 100 | $82 | $8,200.00 |
| 250 | $76.5 | $19,125.00 |
| 500 | $71 | $35,500.00 |
MPC8347EVVAGDB 概述
A PowerQUICC II Pro processor is a next-generation extension of the original PowerQUICC II communications processor line, combining a high-performance Power Architecture core with dedicated communications engines (QUICC Engine) for protocol termination. In the system hierarchy, the MPC8347E sits between a general-purpose MPU and a fully-integrated SoC: it is a microprocessor (MPU category) used in wired communications and industrial control, typically alongside an external PHY, memory chips, and an FPGA or ASIC coprocessor. The integrated QUICC Engine offloads protocol processing, freeing the e300 core for application-layer tasks.
Key features include a 400 MHz e300 core with MMU and double-precision FPU, dual DDR1/DDR2 memory controllers up to 333 MHz, 32-bit PCI 2.3 interface, two 10/100/1000 Ethernet MACs (one RGMII, one GMII/TBI), USB 2.0 high-speed host/device/OTG with on-chip PHY, integrated security engine (SEC 2.0) supporting DES, 3DES, AES, SHA-1/MD5, and a 16-channel DMA controller. The QUICC Engine subsystem runs 333 MHz and handles up to four SCCs plus two FCCs for serial protocols.
Architecturally, the MPC8347E uses a 0.13 micron CMOS process and a hierarchical internal bus structure that decouples the e300 core from I/O traffic. The on-chip memory controller supports up to 1 GB of DDR2 SDRAM with ECC, and an integrated SRAM controller supports up to 256 KB of internal system SRAM for zero-wait-state code execution. Boot options include I2C EEPROM, PCI, and local bus.
Typical applications include industrial Ethernet switches and routers, secure VPN gateways, network-attached storage (NAS) controllers, factory automation controllers, and PCI-based telecom line cards. The combination of integrated USB, dual Gigabit Ethernet, and the QUICC Engine makes it well-suited to wired infrastructure nodes that need hardware protocol offload and deterministic throughput.
When designing with this part, allocate at least four PCB layers for the 672-ball LBGA and route the DDR2 channels with matched lengths (within 50 mils intra-pair) and proper termination. Power sequencing must observe the 1.8 V core ramp before the 2.5 V I/O, and the full LBGA land pattern requires a heatsink or thermal pad for designs exceeding 3 W dissipation. Designers should also review the latest NXP product change notices, as this part has entered end-of-life.
This page synthesizes distributor stock, NXP end-of-life status, cross-reference comparisons, and practical thermal/PCB guidance not found in the manufacturer datasheet alone.
直接替换替代料： MPC8347EVVAGDB ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MPC8347EVVAGDB （相同外形与封装尺寸） ——差异在于 Memory Controller, Mounting Type, Operating Temperature, Package, Process Technology.
快速对比工具——选择替代料号进行并排对比：
MPC8347EVVAGD
✅ 直接替换📋 参考替代料（不在目录中）
MPC8347CVVAGDB
✅ 直接替换📋 参考替代料（不在目录中）
MPC8349ECVVAJDB
✅ 直接替换📋 参考替代料（不在目录中）
MPC8349ECVVAGDB
✅ 直接替换📋 参考替代料（不在目录中）
MPC8347EVVAJD
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MPC8347EVVAGDB 最大额定值与电气特性
| Architecture | Power Architecture e300 core (32-bit RISC, superscalar) |
| Core Frequency | 400 MHz |
| Instruction Set | Power Architecture, 32-bit |
| L1 Cache | 32 KB instruction + 32 KB data |
| Memory Controller | DDR1 / DDR2, up to 333 MHz, ECC support |
| Maximum DRAM | 1 GB DDR2 (per controller) |
| PCI Interface | PCI 2.3, 32-bit, up to 66 MHz |
| Ethernet MACs | 2 (one RGMII, one GMII/TBI), 10/100/1000 Mbps |
| USB Controller | USB 2.0 High-Speed Host/Device/OTG with on-chip PHY |
| Security Engine | SEC 2.0 (DES/3DES/AES, SHA-1, MD5) |
| DMA Channels | 16 |
| QUICC Engine | 1x QE, 333 MHz, multi-SCC/FCC |
| 电源电压 | 1.8 V core, 2.5 V I/O, 3.3 V I/O |
| Process Technology | 0.13 micron CMOS |
| 工作温度 | 0 C to +105 C (industrial grade) |
| 封装 | 672-pin LBGA (TBGA), 35 mm x 35 mm |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Contains lead (non-RoHS per search-data; verify before use) |
| Encryption Support | SEC 2.0 hardware accelerator |
MPC8347EVVAGDB 672-pin lbga (tbga), 35 mm x 35 mm 引脚配置指南
MPC8347EVVAGDB（672-pin lbga (tbga), 35 mm x 35 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MPC8347EVVAGDB.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MPC8347EVVAGDB 适用于 6 应用s: Industrial Ethernet Router / Switch, Secure VPN / IPsec Gateway, Network-Attached Storage (NAS) Controller, PCI-Based Telecom Line Card, Factory Automation Controller (PLC / PAC), Print / Imaging Controller Board.
Industrial Ethernet Router / Switch
The MPC8347EVVAGDB is well-suited to industrial-grade Ethernet routers and managed switches. Its dual 10/100/1000 MACs (RGMII + GMII/TBI), QUICC Engine offload, and 400 MHz e300 core allow wire-speed handling of Layer 2/3 forwarding in switch and router firmware such as Linux/VxWorks. The integrated QUICC Engine can terminate PPP, HDLC, or framed serial protocols on SCC/FCC channels while the e300 core runs the control plane. With on-chip USB and PCI, designers save a separate peripheral controller IC. Operating range 0 C to +105 C satisfies IEC 61850-3 industrial substation requirements when properly derated. Pair with NXP's T1040 PHY family for industrial-temperature MAC-PHY solutions.
推荐
Secure VPN / IPsec Gateway
The integrated SEC 2.0 hardware engine on the MPC8347EVVAGDB accelerates DES, 3DES, AES (128/192/256), SHA-1, SHA-256, and MD5, offloading IPsec/TLS bulk crypto from the e300 core. At 400 MHz with SEC enabled, the part can sustain multi-hundred-Mbps IPsec throughput on typical AES-128/SHA-1 tunnels, suitable for SME VPN gateways. Dual Gbit Ethernet MACs map cleanly to WAN/LAN routing while USB 2.0 OTG provides a management/console channel. Per NXP's hardware specifications, the SEC engine supports public-key operations via standard PK-API libraries. Designers should pair the device with a hardware RNG (e.g., external TPM) and proper key-storage practices per NIST SP 800-90 recommendations.
推荐
Network-Attached Storage (NAS) Controller
The MPC8347EVVAGDB with its dual Gigabit Ethernet MACs and PCI 2.3 host bridge can serve as the main controller for small/medium NAS enclosures. The e300 core runs the file-system stack (Linux EXT4, ZFS, or proprietary RAID), while the local bus bridges to SATA/PATA controller ASICs via PCI. DDR2 ECC at up to 333 MHz supplies corrected memory for write-back cache. Estimated: at 400 MHz the MPU can deliver typical NAS throughput of 80-120 MB/s aggregate for mixed read/write workloads. For better SU/HA, designers can pair two MPC8347EVVAGDBs in active-backup using the PCI interface as a heartbeat channel. The integrated USB 2.0 OTG conveniently drives a front-panel copy button.
推荐
PCI-Based Telecom Line Card
The MPC8347EVVAGDB's PCI 2.3 interface supports 32-bit, 66 MHz operation in master mode, making it well-suited to compact PCI / AdvancedTCA telecom line cards. The QUICC Engine accelerates ATM, HDLC, and PPP protocols traditionally terminated in telecom DSLAMs and channel banks. With its 400 MHz e300 core and 16-channel DMA controller, it can manage real-time TDM streams with deterministic latency. Two Ethernet MACs and dual DDR controllers provide both fabric-uplink and payload buffering. The industrial temperature range 0 C to +105 C meets central-office ambient per Telcordia NEBS Level 3. Designers should note the part's EOL status and plan migration to QorIQ P1020 for new lines.
推荐
Factory Automation Controller (PLC / PAC)
In factory automation the MPC8347EVVAGDB acts as a powerful programmable automation controller (PAC) combining IEC 61131-3 logic execution with deterministic Ethernet protocols (EtherCAT, PROFINET) via its QUICC Engine and dual Ethernet MACs. The 400 MHz e300 core hosts the real-time OS (RTOS) and ladder/logic interpreter while DDR2 with ECC handles large I/O image buffers. USB 2.0 host mode drives operator-panel touchscreens, and PCI can host specialized motion-control cards. The 0 C to +105 C range suits cabinet-mount installations. Per NXP's hardware specs, the integrated 16-channel DMA enables distributed I/O over serial without burdening the core, supporting PLC scan-times under 1 ms on typical workloads.
推荐
Print / Imaging Controller Board
The MPC8347EVVAGDB suits mid-range commercial print/imaging controller boards. Its dual DDR2 controllers and 32-bit PCI 2.3 host bridge allow high-bandwidth data capture from scanner ASICs while the e300 core runs RIP (raster image processing). PCI expansion attaches a hardware JPEG/MPEG accelerator ASIC, and USB 2.0 OTG drives external media readers. Per NXP datasheet, the 16-channel DMA controller streams image data with deterministic latency for color-critical workflows. Estimated: a 400 MHz MPC8347EVVAGDB can RIP a typical 1200-dpi A4 monochrome page in well under one second on optimized code. Industrial temperature ensures reliable duty-cycling in enclosed printer environments.
推荐
推荐产品汇总
工程参考数据： MPC8347EVVAGDB ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPC8347EVVAGD | MPC8347CVVAGDB | MPC8349ECVVAJDB |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 672-LBGA (TBGA) 35x35 mm | 672-LBGA - same | 672-LBGA - same | 672-LBGA - same |
| Security Engine (SEC) | Yes (SEC 2.0) | Yes (SEC 2.0) | No | Yes (SEC 2.0) |
| DDR1/DDR2 Memory Controller | Yes (333 MHz, DDR1/DDR2) | Yes (DDR1/DDR2) | Yes (DDR1/DDR2) | Yes (DDR1/DDR2) |
| PCI 2.3 Interface | Yes (32-bit) | Yes (32-bit) | Yes (32-bit) | Yes (32-bit) |
| Ethernet MACs | 2 x 10/100/1000 (RGMII + GMII/TBI) | 2 x 10/100/1000 | 2 x 10/100/1000 | 3 x 10/100/1000 |
| USB 2.0 | Host/Device/OTG with on-chip PHY | Yes | Yes | Yes (with PHYs) |
关键差异点
- Integrated SEC 2.0 hardware encryption engine （对比 MPC8347CVVAGDB)
- On-chip USB 2.0 High-Speed PHY （对比 MPC8349ECVVAJDB)
- Dual Gigabit Ethernet MACs (RGMII + GMII/TBI) （对比 MPC8347CVVAGDB)
设计说明
The 672-LBGA dissipates estimated 3-5 W at 400 MHz with full I/O activity. The 35 mm x 35 mm body limits natural-convection cooling; allocate at least four PCB layers (two dedicated ground planes plus two signal), connect the BGA center ground balls to a large copper pad, and apply a thermal-interface material + heatsink assembly. For 24/7 industrial designs, observe junction-temperature limits per the NXP hardware specifications document, and design with a delta of 20-30 C maximum rise.
Route DDR2 channels with matched lengths (within 50 mils intra-pair, 100 mils inter-pair), 100 ohm differential impedance, and 1.5 V termination as required by the JEDEC JESD79-2 specification. Place bypass caps (0.1 uF X7R) immediately adjacent to each power ball cluster. The 672-ball grid at 1.0 mm pitch requires microvia-stack or via-in-pad technology for inner-row signal access; standard through-vias cannot fit between balls without drilling signal voids. Use at least 4-layer stack-up with continuous reference planes for the high-speed DDR and Ethernet nets.
Strict power sequencing must be enforced: 1.8 V (core) ramps first, then 2.5 V I/O, then 3.3 V I/O, per the NXP datasheet. Failure to observe this sequence may cause latch-up. Use a sequenced power-supply controller IC (or discrete supervisor) rather than independent regulators; TPS3808-style supervisors can be daisy-chained to enforce the timing window. Hold RESET asserted for at least 100 us after all rails are stable.
Boot configuration is set via sampled GPIO inputs at the rising edge of PORESET; pull-ups/downs on these lines must be correctly sized because any glitch will trigger an incorrect boot mode (PCI host boot, I2C EEPROM, or local bus). Designers often overlook the JTAG boundary-scan pins - leave them accessible (test points or header) for production board-test. Confirm the BGA solder paste aperture and reflow profile against the IPC-7095 'Process Control for BGA Assembly' guidelines to avoid head-in-pillow defects.
合规信息
Per DigiKey snippet, the part is listed as 'TBGA NO PB' (likely meaning 'with NO PB or with PB-free BGA finish' - confirm with datasheet lead-finish table). RoHS and REACH status should be confirmed against NXP's official product change notice (PCN) and certificate of conformance before use in EU markets. AEC-Q100 not applicable since this is a wired-communications MPU, not an automotive-grade IC.
