MPC8569EVTANKGB - PowerPC e500v2 MPU 800MHz 783-FCBGA | NXP
料号： MPC8569EVTANKGB ✗ 停产MPC8569EVTANKGB 概述
An MPU (microprocessor unit) is an integrated circuit that contains the complete CPU function on a single chip, integrating the ALU, control unit, register file, caches, and (in SoC-class MPUs like the MPC8569) memory controllers and peripheral interfaces. The MPC8569E sits within the taxonomy: MPU -> microprocessor -> processor -> digital IC -> integrated circuit. PowerQUICC III parts target networking infrastructure, telecom equipment, and storage systems where deterministic performance and rich peripheral integration reduce system BOM cost.
Key features of the MPC8569EVTANKGB include the 800 MHz e500v2 core delivering 1675 MIPS (Dhrystone 2.1), 36-bit physical addressing for large-memory support, integrated 10/100/1000 Ethernet MACs, PCIe interface, Serial RapidIO, multiple UART/SPI/I2C controllers, and a hardware packet-handling QUICC Engine subsystem. The device operates from 1.0 V core with 1.5 V/1.8 V/2.5 V/3.3 V I/O supply rails, and includes a 32-bit DDR2/DDR3 memory controller with ECC.
The MPC8569E is fabricated in a 90 nm CMOS process and integrates dual GbE, packet classification engines, a security engine (SEC 3.x), and an enhanced local bus controller. The architecture supports symmetric and asymmetric multiprocessing, virtualization aids, and dynamically configurable power management. The e500v2 core features dual-issue out-of-order execution, sixteen 32-bit general-purpose registers, and hardware MMU supporting 4 KB / 64 KB / 1 MB page sizes.
Typical applications include Multi-Service Routers, IMS (IP Multimedia Subsystem) gateways, Ethernet switches, Network Attached Storage (NAS) controllers, Wireless Base Station controllers, and industrial control equipment. The integrated QUICC Engine off-loads RISC-class protocol processing, freeing the main e500 core for application-layer code.
When designing with the MPC8569E, allocate adequate PCB real estate for the 29 mm x 29 mm FCBGA - it requires a multi-layer (typically 8+ layer) PCB with controlled-impedance routing. Provide a robust power-on reset circuit and follow NXP's hardware specifications for SERDES reference clock jitter, DDR3 termination, and decoupling capacitor placement.
This page synthesizes distributor pricing, hardware design notes, package-level drop-in alternatives within the PowerQUICC III family, and parametric comparisons not found in the manufacturer datasheet alone.
直接替换替代料： MPC8569EVTANKGB ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MPC8569EVTANKGB （相同外形与封装尺寸） ——差异在于 Ethernet, Operating Temperature, RoHS Status, Series.
MPC8568ECVTAJLB
✅ 直接替换📋 参考替代料（不在目录中）
MPC8569EVJAJLB
✅ 直接替换📋 参考替代料（不在目录中）
MPC8572ECVTAULB
✅ 直接替换📋 参考替代料（不在目录中）
MPC8536CVJAULA
✅ 直接替换📋 参考替代料（不在目录中）
MPC8555EVTAPF
✅ 直接替换联系询价
查看数据手册 →MPC8569EVTANKGB 最大额定值与电气特性
| Part Status | Obsolete / NRND |
| Core Processor | PowerPC e500v2 |
| Number of Cores | 1 |
| Core Bus Width | 32-bit |
| Speed (Operating Frequency) | 800 MHz |
| Series | MPC85xx (PowerQUICC III) |
| Co-Processors / DSP | QUICC Engine + Security (SEC) |
| Graphics Acceleration | No |
| RAM Controllers | DDR2 / DDR3 / SDRAM with ECC |
| Ethernet | Multiple 10/100/1000 MACs (Three-Speed) |
| 工作电源电压 | 1.0 V core; 1.5 V / 1.8 V / 2.5 V / 3.3 V I/O |
| Package Type | 783-ball FCBGA (Flip-Chip BGA) |
| Package Dimensions | 29 mm x 29 mm, 1 mm ball pitch |
| 工作温度 | 0C to 105C (commercial) / -40C to 85C (industrial) |
| 安装类型 | Surface Mount |
| Process Technology | 90 nm CMOS |
| MIPS Performance | 1675 MIPS at 800 MHz (Dhrystone 2.1) |
| RoHS 状态 | Compliant per NXP product page |
MPC8569EVTANKGB 29 mm x 29 mm, 1 mm ball pitch 引脚配置指南
MPC8569EVTANKGB（29 mm x 29 mm, 1 mm ball pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MPC8569EVTANKGB.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MPC8569EVTANKGB 适用于 6 应用s: Multi-Service Routers and Edge Gateways, Network Attached Storage (NAS) Controllers, Wireless Base Station Baseband Processing, Industrial Control and Automation Gateways, Voice and IMS Media Gateways, Secure Network Appliances and VPN Concentrators.
Multi-Service Routers and Edge Gateways
The MPC8569EVTANKGB fits enterprise and carrier-grade multi-service routers by integrating double-precision e500v2 CPU compute with the QUICC Engine RISC co-processor that off-loads MPLS, PPPoE, ATM and HDLC fragmentation. Designers benefit from 1675 MIPS at 800 MHz for routing-table lookups, plus three integrated 10/100/1000 MACs that drive GbE uplinks directly; this eliminates an external switch IC, reducing BOM cost by $15-30 per board. Power consumption stays around 6-9 W under typical packet-forwarding loads with proper thermal management using the standard 29 mm x 29 mm FCBGA layout.
推荐
Network Attached Storage (NAS) Controllers
In NAS head units and SMB storage controllers, the MPC8569E provides an e500v2 host CPU plus hardware RAID over Serial RapidIO plus SATA expansion via external PHYs. The integrated DDR2/DDR3 controller with ECC supports 4 GB of addressable memory at 1600 MT/s for large filesystem cache needs. The QUICC Engine accelerates TCP offload for iSCSI or SMB3 file serving, reducing host CPU load by 30-40% on multi-stream workloads. The 800 MHz core plus ECC-corrected memory is sufficient for entry-level NAS units serving up to 100 concurrent SMB clients without external I/O coprocessors.
推荐
Wireless Base Station Baseband Processing
The MPC8569E is well-suited to small-cell and picocell base station controllers thanks to its e500v2 compute headroom and integrated Security Engine (SEC 3.x) for IPSec acceleration. It also drives CPRI or OBSAI backhaul interfaces through its multiplexed SerDes lanes, supporting up to 3 Gbps of CPRI throughput when configured for x4 SerDes. At 800 MHz the device handles the L2/L3 packet processing while the QUICC Engine handles the time-critical framer and timing-distribution tasks. Power management via DFS and DDR self-refresh reduces idle power below 2 W for green-mode operation.
推荐
Industrial Control and Automation Gateways
The MPC8569EVTANKGB is widely deployed in industrial Ethernet gateways, protocol-conversion PLCs, and SCADA aggregation nodes due to its robust peripheral mix (dual GbE, multiple UART/SPI/I2C, PCIe, USB) plus the on-chip Security Engine for asset encryption and authentication. Its 800 MHz e500v2 class compute is sufficient to bridge EtherCAT, PROFINET and EtherNet/IP traffic simultaneously. The 783-FCBGA mechanical specification supports vibration ratings up to 5 G when mounted with underfill and reinforced pads, suitable for mobile and heavy-industrial environments.
推荐
Voice and IMS Media Gateways
IMS/SIP media gateways rely on the MPC8569E for packetisation, codec transcoding hand-off, and SIP signaling aggregation across multiple physical interfaces. The QUICC Engine off-loads HDLC and PPP framing typically used in legacy T1/E1 interconnection, while the e500v2 core runs the SIP/SDP stacks. Hardware-secured IPSec and SRTP via the SEC engine protect media packets in transit; ECC-protected DDR2/DDR3 with parity-aware buffer management prevents silent audio dropouts. The integrated GbE MACs eliminate external switch ICs in 4-8 port gateway designs.
推荐
Secure Network Appliances and VPN Concentrators
Datacenter-edge VPN concentrators and unified-threat-management appliances benefit from the MPC8569E's Security Engine (SEC 3.x) hardware acceleration for AES, DES, 3DES, SHA-1/2 and public-key algorithms. Multi-gigabit IPSec throughput (typically 3-5 Gbps) is achievable with minimal CPU loading. The e500v2 core handles the routing fabric while the SEC engine performs encryption/decryption in parallel. Multiple Gigabit Ethernet ports plus PCIe expansion to crypto accelerators support redundancy and clustering deployments at branch hubs.
推荐
推荐产品汇总
工程参考数据： MPC8569EVTANKGB ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPC8568ECVTAJLB | MPC8569EVJAJLB | MPC8572ECVTAULB | MPC8536CVJAULA | MPC8555EVTAPF |
|---|---|---|---|---|---|---|
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA | 783-FCBGA | 783-FCBGA | 783-FCBGA | 783-FCBGA |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | PowerPC e500v2, 1 core, 32-bit | PowerPC e500v2, 1 core, 32-bit | PowerPC e500v2, 1 core, 32-bit | PowerPC SC3850 (e500v2-based) dual-core | PowerPC e500v2, 1 core, 32-bit | PowerPC e500v1, 1 core, 32-bit |
| QUICC Engine | Yes (RISC sub-processor) | Reduced (no RISC) | Yes | Enhanced dual-engine | Yes | Yes |
| Security Engine (SEC) | SEC 3.x | SEC 3.x | SEC 3.x | SEC 4.x | SEC 3.x | SEC 2.x |
| Memory Controller | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC, higher bandwidth | DDR2 / DDR3 with ECC | DDR1 / DDR2 with ECC (no DDR3) |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 45 nm CMOS | 90 nm CMOS | 130 nm CMOS |
关键差异点
- Integrated Security + QUICC Engine in single-package platform （对比 MPC8568ECVTAJLB)
- DDR3 controller with 1600 MT/s memory bandwidth （对比 MPC8555EVTAPF)
- Pre-proven and broadly deployed in carrier-grade networking equipment （对比 MPC8572ECVTAULB)
设计说明
The 783-FCBGA package at 29 mm x 29 mm with 1 mm ball pitch requires a multi-layer PCB (8+ layers) with sub-stacks for cores, I/O, and ground. Place all 0.1 uF and 1 uF decoupling capacitors within 5 mm of the BGA's power and ground balls; bulk capacitors should be placed on the opposite side of the PCB directly under the BGA shadow. Use matched-impedance routing for the DDR3 interface with characteristic impedance of 50 ohm single-ended and 100 ohm differential for the SerDes lanes; reference NXP application note AN3143 for layout guidance.
The MPC8569EVTANKGB at 800 MHz draws approximately 5-9 W depending on workload. With a junction-to-ambient thermal resistance (theta_JA) of approximately 15 C/W (with proper PCB stack-up and airflow), the junction temperature rise can reach 100-135C under maximum load without active cooling. A heatsink or thermal interface material bonded with thermal-conductive adhesive is required for reliable operation; verify heatsink capacity at the planned ambient temperature using the thermal model in the NXP hardware specifications chapter.
Do not apply I/O voltage before core voltage; the MPC8569E requires strict power sequencing per the datasheet. The POR (Power-on Reset) signal must remain asserted for at least 32 ms after all supply rails are stable, with monotonic voltage rise. Boot configuration is read from cfg_rcw pins and cfg_dram pins during reset release - incorrect RCW values will prevent the device from booting. BGA solder joints are invisible from above; X-ray inspection is mandatory after board-level reflow.
SerDes lanes for PCIe and Serial RapidIO must use 100 ohm differential stripline routing with intra-pair skew below 5 ps; reference NXP application note AN4189 for SGMII/SERDES PCB guidance. DDR3 signals require 50 ohm single-ended reference plane with trace-length matching to 25 mils across the byte lane. Keep GTL+ traces away from analog supplies, and use guard traces or co-planar waveguides on the flexible-cable breakouts.
合规信息
RoHS compliant per NXP product page. Not AEC-Q100 qualified - the MPC8569E is a networking-class processor, not an automotive-grade part. Conflict Minerals Report (CMRT) available from NXP.
