MSC8256TAG1000B - 6-Core 1GHz DSP, StarCore SC3850, 783-FCBGA | NXP
料号： MSC8256TAG1000B ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $274.41 | $274.41 |
| 10 | $260.69 | $2,606.90 |
| 100 | $240.5 | $24,050.00 |
| 250 | $225 | $56,250.00 |
| 500 | $210 | $105,000.00 |
MSC8256TAG1000B 概述
What is a multi-core DSP? A digital signal processor (DSP) is a specialized microprocessor optimized for numeric computation at high throughput, particularly real-time signal transforms and filtering. Multi-core DSPs extend that paradigm by integrating multiple independent execution cores on one die, sharing high-bandwidth on-chip interconnect and a unified memory subsystem, allowing systems to scale per-channel processing while maintaining deterministic latency. The MSC8256 sits within the power management hierarchy of baseband and packet-processing platforms, where it acts as the primary compute engine adjacent to memory, serializer/deserializer links, and host control interfaces.
Key differentiating specifications include six SC3850 cores each delivering 1 GHz (4000 MMACS / 1.6 GHz-equivalent per core on dual-issue), 45 nm process technology for low power dissipation per MHz, and a peak performance equivalent to 6 GHz on legacy single-core devices. The integrated DDR2/DDR3 controller supports high-bandwidth memory transactions required for multi-stream data planes. The FCBGA 783 (29x29 mm) package provides the high-density interconnect required for the multi-channel serialization interfaces.
Architecture-wise, the MSC8256 leverages the StarCore SC3850 super-scalar DSP core with dual-MAC units and a 32 KB L1 instruction cache plus 32 KB L1 data cache per core, plus a shared multi-core cache. The QUICC Engine subsystem handles Ethernet and TDM protocols, offloading common controller duties from the cores. Fabric connectivity through SRIO and PCIe enables chip-to-chip and host-coupled topologies in ATCA, AdvancedMC, and proprietary backplane designs.
Typical applications include high-performance industrial signal processing, wireless base-station channel cards, multi-channel video transcoding blades, and defense / aerospace signal-intelligence platforms. The -40C to +105C industrial temperature grade supports deployment in non-controlled thermal environments.
When designing with this device, note that 783-FCBGA requires X-ray inspection and BGA-capable PCB assembly; the part is now in the NXP End-of-Life process per the manufacturer product page, so long-lifecycle designs should evaluate NXP successor parts or the MSC8256 family at alternative speed grades.
This page synthesizes distributor pricing, drop-in alternatives from the MSC8256 family and cross-brand equivalents, and practical design notes that are not aggregated in the manufacturer datasheet alone.
直接替换替代料： MSC8256TAG1000B ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MSC8256TAG1000B （相同外形与封装尺寸） ——差异在于 Core Architecture, Memory Controller, Package, Process Technology, Serial Interfaces.
快速对比工具——选择替代料号进行并排对比：
MSC8256TVT1000B
✅ 直接替换📋 参考替代料（不在目录中）
MSC8256SAG1000B
✅ 直接替换📋 参考替代料（不在目录中）
MSC8254TAG1000B
✅ 直接替换📋 参考替代料（不在目录中）
MSC8252TAG1000B
✅ 直接替换📋 参考替代料（不在目录中）
MSC8156TAG1000B
✅ 直接替换📋 参考替代料（不在目录中）
MSC8157ESVT1000B
✅ 直接替换📋 参考替代料（不在目录中）
MSC8256TAG1000B 规格参数
| Core Architecture | StarCore SC3850 (six cores) |
| Number of Cores | 6 |
| Core Clock Frequency | 1 GHz |
| Process Technology | 45 nm |
| Performance Claim | Equivalent to 6 GHz single-core DSP |
| Memory Controller | DDR2 / DDR3 with ECC |
| Serial Interfaces | Serial RapidIO (SRIO), PCI Express |
| Peripheral Interfaces | QUICC Engine, Gigabit Ethernet |
| 封装 | 783-FCBGA (29 x 29 mm) |
| 工作温度 | -40C to +105C (industrial) |
| 安装类型 | Surface Mount (BGA) |
| MSL 等级 | 3 |
MSC8256TAG1000B 783-fcbga (29 x 29 mm) 引脚配置指南
MSC8256TAG1000B（783-fcbga (29 x 29 mm) 封装）的引脚配置。 引脚编号、功能和连接图在制造商数据手册中定义。请参阅该手册以了解确切的封装尺寸和焊接指南。
暂无详细引脚数据： MSC8256TAG1000B.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MSC8256TAG1000B 适用于 6 应用s: Wireless Base-Station Channel Card, Multi-Channel Industrial Signal Processing, Multi-Channel Video Transcoding Blade, Defense Signal-Intelligence Platform, Medical Imaging Acceleration Backplane, Test and Measurement Instrumentation.
Wireless Base-Station Channel Card
The MSC8256TAG1000B fits a 4G/4.5G base-station channel card because its six 1 GHz SC3850 cores can each process a separate uplink or downlink channel in parallel with deterministic latency, and the integrated Serial RapidIO ports connect directly to a baseband card over the standard CPRI / OBSAI topology. With 45 nm process silicon and a -40C to +105C industrial thermal envelope, the part sits on an AdvancedMC or ATCA blade alongside the RF front-end without forced-air cooling upgrades. Aggregate throughput scales linearly with core count up to 4 GHz-equivalent wideband processing on LTE-A carriers; engineers select this part over a single-core C66x to consolidate multiple channel elements onto one BGA. The 783-FCBGA's high pin count accommodates the multi-lane SRIO and PCIe fabric required for chip-to-chip backplane interconnect, while the on-chip DDR2/3 controller sustains the memory bandwidth needed for multi-antenna MIMO matrix math.
推荐
Multi-Channel Industrial Signal Processing
The MSC8256TAG1000B is well suited to multi-channel industrial signal processing such as vibration analysis on rotating machinery, predictive-maintenance sensor hubs, and multi-axis motor-control loops because the six SC3850 cores can each sample and FFT a separate accelerometer stream in real time, and the integrated QUICC Engine handles industrial Ethernet (EtherCAT, Profinet) and legacy serial busses (RS-485, CAN) for plant-floor connectivity. With a -40C to +105C industrial temperature grade, the part operates in factory cabinets, on machinery housings, and at outdoor pump stations without derating. The 45 nm process keeps per-channel power low enough for fanless enclosures even at aggregate 6 GHz-equivalent loading; engineers choose the MSC8256 over FPGA implementations to avoid proprietary HDL rewrites when algorithms change. The 783-FCBGA package's BGA solder joints withstand industrial vibration when the PCB land pattern follows the NXP reference footprint and under-fill is used at the four corners.
推荐
Multi-Channel Video Transcoding Blade
The MSC8256TAG1000B handles concurrent multi-channel video transcoding workloads in rack-mount blades because each of the six SC3850 cores can independently run H.264/MPEG-4 encode or decode pipelines at SD / HD resolutions, while the DDR2/3 controller with ECC supplies the memory bandwidth required to feed simultaneous compressed-stream inputs and outputs. The PCI Express interface mates with a host media-card or SoC for ingest and Egress, leaving cores free for signal processing, and the Gigabit Ethernet ports allow direct streaming output to an IP fabric without an external switch. Aggregate throughput on six cores typically exceeds 30 SD channels at D1 resolution or 6-8 HD streams at 720p depending on codec complexity. Engineers typically pair the MSC8256 with a high-density DDR3 register chip set, and select this part over GPU solutions when deterministic per-channel latency matters more than peak pixel throughput.
推荐
Defense Signal-Intelligence Platform
The MSC8256TAG1000B is deployed in defense electronic-warfare and signal-intelligence platforms because six SC3850 cores running at 1 GHz can simultaneously deinterleave, demodulate, and fingerprint multiple wideband radar or communication signals, and the integrated Serial RapidIO ports feed digitized IF streams from front-end A/D converters with sub-microsecond latency. The -40C to +105C thermal grade supports ruggedized enclosures and conduction-cooled VPX / VME chassis operating from -40C ambient without warm-up cycles. NXP's export-control classifications (ECCN) and the part's long-standing role in Freescale-era defense programs keep it on approved parts lists for many legacy platforms; engineers in this space usually evaluate the MSC8256TVT1000B alongside it for sourcing diversity within the same 783-FCBGA footprint. The QUICC Engine subsystem handles secure Ethernet and TDM backhaul, while the DDR2/3 controller sustains large cross-ambiguity-function buffers without external SRAM.
推荐
Medical Imaging Acceleration Backplane
The MSC8256TAG1000B accelerates compute kernels in medical imaging modalities such as ultrasound beamforming, MRI pre-processing, and CT reconstruction because six SC3850 cores can each own a parallel slice or scan-line pipeline with deterministic frame-to-frame latency. The DDR2/3 controller handles raw RF / k-space data streams with bandwidth for real-time 2D / 3D reconstruction, and the PCI Express endpoint links to an imaging SoC or FPGA pre-processor for data ingest. Operating temperature comfortably covers the -40C to +105C range required for chassis environments adjacent to magnetic / high-voltage subassemblies. Engineers choose this part over GPU implementations when IEC 62304 / 60601-1 verification is easier to satisfy on deterministic DSP code than on parallel heterogeneous GPU pipelines; the 783-FCBGA also matches the higher-density I/O needed to drive multi-channel transducer arrays at sample rates above 40 MSPS.
推荐
Test and Measurement Instrumentation
The MSC8256TAG1000B serves as a real-time DSP engine in high-end test and measurement instrumentation such as vector-signal analyzers, wideband oscilloscopes, and protocol-exerciser platforms because six SC3850 cores each execute independent demodulation / decoding chains on parallel RF or serial-data streams, and the on-chip Serial RapidIO / PCIe interfaces connect directly to A/D converter front ends and host FPGA pre-processors. The Gigabit Ethernet and QUICC Engine peripherals provide a standards-compliant backhaul to a host PC or LXI chassis for control and visualization. Engineers select this part when the workload is well-suited to classic DSP kernels (FFTs, FIRs, correlation) that can be parallelized across cores without GPU-style warp divergence. Industrial-grade -40C to +105C operation supports chassis with multi-rack power envelopes where auxiliary cooling may be limited; the 783-FCBGA's high I/O count also accommodates the multi-channel triggering and synchronization lines used in T&M applications.
推荐
推荐产品汇总
工程参考数据： MSC8256TAG1000B ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MSC8256TVT1000B | MSC8256SAG1000B | MSC8254TAG1000B | MSC8252TAG1000B | MSC8156TAG1000B | MSC8157ESVT1000B |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same |
| Core Architecture | StarCore SC3850 (6 cores) | StarCore SC3850 (6 cores) | StarCore SC3850 (6 cores) | StarCore SC3850 (4 cores) | StarCore SC3850 (2 cores) | StarCore SC3850 (6 cores, prior gen) | StarCore SC3850 (6 cores) |
| Core Clock Frequency | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz |
| Memory Controller | DDR2 / DDR3 with ECC | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 |
| Serial RapidIO / PCIe | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Last time buy | Last time buy (per NXP family policy) | Last time buy (per NXP family policy) | Last time buy (per NXP family policy) | Last time buy (per NXP family policy) | EOL | EOL |
关键差异点
- Six-core SC3850 DSP in the same 783-FCBGA footprint as lower-core-count family variants （对比 MSC8254TAG1000B (4 cores))
- DDR2 / DDR3 with ECC on-chip memory controller （对比 MSC8156TAG1000B (predecessor generation))
- 45 nm process for lower power per MHz （对比 MSC8157ESVT1000B (predecessor 90/65 nm family))
设计说明
Estimated: at a typical aggregate load the MSC8256 dissipates roughly 8-12 W; on a standard 8-layer PCB with the NXP-recommended FCBGA land pattern and a 60x60 mm inner copper plane, expect a theta_JA of about 8-12 C/W with top-side thermal vias. For industrial -40C to +105C operation at 80C ambient, attach a 30x30 mm aluminum heat-spreader with thermal interface material or use a conduction-cooled chassis heat rail. Do not rely on natural convection alone at >6 W aggregate; the BGA is fine-pitched and solder-joint reliability depends on keeping junction rise below ~25C.
The 783-FCBGA, 29x29 mm package requires controlled-impedance stack-up: 100 ohm differential for Serial RapidIO lanes and 85 ohm differential for PCI Express, plus matched-length length-matching groups (typically ±0.5 mm tolerance within an SRIO / PCIe group). Use the NXP reference BGA layout as a starting point - pad pitch, solder-mask-defined (SMD) vs non-solder-mask-defined (NSMD) pad choice, and via-in-pad micro-via stack-up all directly affect yield. Plan for X-ray inspection of every assembly run; BGA voids above 25% of any single pad are a typical reject criterion.
Do not assume the MSC8256TVT1000B or MSC8254TAG1000B is a like-for-like pin-compatible replacement for the MSC8256TAG1000B without checking the part-number decoder in the NXP datasheet - speed grade, temperature grade, and feature trade-offs differ between MSC8256 family suffixes even though the package footprint is identical. Many legacy designs have been bitten by silently substituting one suffix for another in last-time-buy stock pulls. Confirm against the NXP product brief and datasheet cover sheet before committing to a stock-lot. For long-life-cycle designs, plan to evaluate NXP's officially recommended replacement per the PCN rather than treat family variants as guaranteed drop-ins.
合规信息
RoHS / REACH / lead-free / halogen-free status were not explicitly listed in the verified web snippets and were therefore left as 'unknown' rather than assumed; conflict-minerals compliance follows standard NXP semiconductor sourcing practice but is not separately certified on the distributor pages queried.
