PIC16F1719-E/MV - 28KB Flash 8-bit MCU w/ Op Amps | Microchip
料号： PIC16F1719-E/MV ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.5 | $4.50 |
| 10 | $4.05 | $40.50 |
| 100 | $3.6 | $360.00 |
| 500 | $3.15 | $1,575.00 |
| 1,000 | $2.75 | $2,750.00 |
PIC16F1719-E/MV 概述
A PIC microcontroller (MCU) is a compact, self-contained computer-on-a-chip that combines a CPU core, program memory (Flash), EEPROM, RAM, and a rich set of peripherals (ADC, timers, communication interfaces, analog blocks). PIC16F MCUs sit in the 8-bit RISC family tree: MCU -> microcontroller -> PIC microcontroller -> PIC16F family -> enhanced mid-range core. They are commonly used as the central controller in cost-sensitive embedded designs where low power consumption, deterministic behavior, and flexible I/O outweigh raw throughput.
The standout features of this device are its Intelligent Analog integration: up to three on-chip operational amplifiers, two comparators with 50 ns response time, a 10-bit ADC with computation, an 8-bit DAC, and Zero Cross Detect that simplifies TRIAC and synchronized switching control. Combined with Core Independent Peripherals, the chip can perform signal conditioning and timing tasks without CPU intervention, reducing firmware complexity.
Architecturally, the PIC16F1719 uses Microchip's enhanced mid-range 8-bit core with a 14-bit instruction word, hardware multiplier, and XLP (eXtreme Low Power) technology. XLP delivers sub-uA sleep currents and multiple idle/sleep modes that make this MCU particularly suitable for battery-powered sensor applications. Operating voltage spans 2.3 V to 5.5 V across the full temperature range.
Typical applications include IoT sensor nodes, intelligent HVAC and lighting controls, low-cost instrumentation, white goods and consumer appliances, and general-purpose embedded control. Design considerations include ensuring the exposed pad of the UQFN package is properly soldered for thermal and electrical performance, providing a clean analog supply for the op amp channels, and following Microchip's in-circuit serial programming (ICSP) guidelines for production programming.
直接替换替代料： PIC16F1719-E/MV ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC16F1719-E/MV （相同外形与封装尺寸） ——差异在于 Package, DAC, ADC, Comparators, Program Memory (Flash).
快速对比工具——选择替代料号进行并排对比：
PIC16F1719-I/MV
✅ 直接替换✓ 有现货
$1.89 / 个
查看数据手册 →PIC16F1718-I/MV
✅ 直接替换📋 参考替代料（不在目录中）
PIC16F1717-I/MV
✅ 直接替换✓ 有现货
$1.72 / 个
查看数据手册 →PIC16F1716-I/MV
✅ 直接替换✓ 有现货
$1.04 / 个
查看数据手册 →PIC16F1709-I/MV
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
PIC16F1719-E/MV 最大额定值与电气特性
| Core | PIC16 enhanced mid-range 8-bit RISC |
| Instruction Set | 14-bit instruction word |
| Maximum CPU Speed | 32 MHz |
| Program Memory (Flash) | 28 KB (16K x 14) |
| Data RAM | 2 KB |
| EEPROM | 256 bytes |
| Operating Voltage Range | 2.3 V to 5.5 V |
| 工作温度范围 | -40C to +125C (Industrial, E suffix) |
| 封装 | 40-pin UQFN (MV) 5x5 mm with EP |
| On-chip Op Amps | Up to 3 |
| Comparators | 2 with 50 ns response time |
| ADC | 10-bit with computation |
| DAC | 8-bit |
| Core Independent Peripherals | CLC, COG, NCO, Zero Cross Detect |
| Peripheral Pin Select (PPS) | Yes |
| XLP (eXtreme Low Power) | Yes, sub-uA sleep current |
| RoHS 状态 | Compliant |
PIC16F1719-E/MV 引脚配置
| 引脚 1 | RA5 — I/O / AN4 / C2IN2- |
| 引脚 2 | RA4 — I/O / OPA1IN0- |
| 引脚 3 | RA3 — I/O / VREF+ |
| 引脚 4 | RA2 — I/O / OPA1OUT |
| 引脚 5 | RA1 — I/O / OPA1IN0+ |
| 引脚 6 | RA0 — I/O / OPA2IN0- |
| 引脚 7 | VSS — Ground reference |
| 引脚 8 | RA7 — I/O / OPA2OUT |
| 引脚 9 | RA6 — I/O / OPA2IN0+ |
| 引脚 10 | RC0 — I/O / AN20 / DACOUT |
| 引脚 11 | RC1 — I/O / AN21 / ZCDOUT |
| 引脚 12 | RC2 — I/O / AN22 / C1OUT |
| 引脚 13 | RC3 — I/O / AN23 / C2OUT |
| 引脚 14 | RC4 — I/O / AN16 / OPA1IN1- |
| 引脚 15 | RC5 — I/O / AN17 / OPA1IN1+ |
| 引脚 16 | RC6 — I/O / AN18 / TX/CK |
| 引脚 17 | RC7 — I/O / AN19 / RX/DT |
| 引脚 18 | VSS — Ground reference |
| 引脚 19 | VDD — Positive supply 2.3-5.5 V |
| 引脚 20 | RB0 — I/O / AN8 / CCP1 |
| 引脚 21 | RB1 — I/O / AN9 / P1B |
| 引脚 22 | RB2 — I/O / AN10 / P1C |
| 引脚 23 | RB3 — I/O / AN11 / P1D |
| 引脚 24 | RB4 — I/O / AN12 |
| 引脚 25 | RB5 — I/O / AN13 |
| 引脚 26 | RB6 — I/O / ICSPCLK |
| 引脚 27 | RB7 — I/O / ICSPDAT |
| 引脚 28 | VSS — Ground reference |
| 引脚 29 | VDD — Positive supply 2.3-5.5 V |
| 引脚 30 | RD0 — I/O / AN24 / CWG1IN |
| 引脚 31 | RD1 — I/O / AN25 |
| 引脚 32 | RD2 — I/O / AN26 |
| 引脚 33 | RD3 — I/O / AN27 |
| 引脚 34 | RD4 — I/O / AN28 |
| 引脚 35 | RD5 — I/O / AN29 |
| 引脚 36 | RD6 — I/O / AN30 |
| 引脚 37 | RD7 — I/O / AN31 |
| 引脚 38 | RE0 — I/O / AN5 / OPA3IN- |
| 引脚 39 | RE1 — I/O / AN6 / OPA3IN+ |
| 引脚 40 | RE2 — I/O / AN7 / OPA3OUT |
典型应用
PIC16F1719-E/MV 适用于 6 应用s: IoT Battery Sensor Nodes, White Goods and Home Appliance Control, Intelligent HVAC and Lighting Controls, Low-Cost Instrumentation and Data Acquisition, Consumer Electronics and Toys, Automotive Body and Convenience Modules (sub-125C).
IoT Battery Sensor Nodes
The PIC16F1719-E/MV is well matched to wireless IoT sensor nodes that need on-chip signal conditioning and long battery life. With XLP sub-uA sleep current, three on-chip op amps for sensor front-end gain/buffering, and Zero Cross Detect to wake on AC-line events, designers can run an analog sensor for years from a coin cell. The 32 MHz core and 2 KB RAM handle small protocol stacks (e.g., Modbus RTU or a custom sub-GHz handshake) while the 8-bit DAC closes the loop on actuator control. Same 40-pin UQFN footprint as the rest of the PIC16F171x family eases hardware reuse across node variants.
推荐
White Goods and Home Appliance Control
White goods such as washing machines, dishwashers and refrigerators benefit from the PIC16F1719-E/MV's on-chip op amps (for current-sensing motor drivers) and Zero Cross Detect for synchronized TRIAC switching of AC loads. The 10-bit ADC with computation performs RMS line voltage and current sampling directly, while the CLC, COG and NCO peripherals generate PWM and complementary waveforms for BLDC or universal motors without CPU overhead. The -40C to +125C extended temperature grade meets IEC 60335 household appliance thermal requirements.
推荐
Intelligent HVAC and Lighting Controls
Smart thermostats, dimmers and occupancy-based lighting panels rely on Zero Cross Detect and CLC peripherals that the PIC16F1719-E/MV integrates on-chip. The TRIAC dimming algorithm can run in the core independent COG while the CPU services the user interface and Modbus/CAN stack. On-chip comparators enable zero-cross trigger generation and over-current protection in <100 ns, critical for AC line safety. The wide 2.3-5.5 V VDD range accepts both mains-derived 5 V rails and battery backup 3.3 V supplies.
推荐
Low-Cost Instrumentation and Data Acquisition
Handheld multimeters, panel meters and process indicators use the PIC16F1719-E/MV's 10-bit ADC with computation to average and scale thermocouple, RTD or 4-20 mA inputs while the on-chip op amps provide level shifting and anti-aliasing. The 8-bit DAC can drive a 4-20 mA loop transmitter, and CLC logic gates can be wired to flag out-of-range conditions without waking the CPU. UART/I2C/SPI peripherals interface to character LCDs, BLE modules or EEPROM calibration storage.
推荐
Consumer Electronics and Toys
Toys, gaming peripherals, remote controls and small consumer appliances benefit from the PIC16F1719-E/MV's combination of 28 KB Flash (enough for sound playback tables and rich UI), low cost, and on-chip op amps for audio amplification front-ends. The Core Independent Peripherals deliver smooth LED animations via PWM, COG and CLC while leaving CPU bandwidth for IR protocol decoding or BLE command handling. The compact 5x5 mm UQFN package fits in tight enclosures.
推荐
Automotive Body and Convenience Modules (sub-125C)
For non-safety automotive body electronics such as window lifts, mirror adjusters, interior lighting and seat controllers, the PIC16F1719-E/MV's extended temperature range and on-chip op amps (current sensing) plus CLC/COG peripherals (PWM generation) simplify designs. Designers should note the E/MV is not AEC-Q100 qualified; for AEC-Q100 applications the PIC16F1719-E/MVVAO or PIC18F equivalent should be selected. Verified Web Data confirms the device operates reliably across the automotive passenger cabin thermal envelope.
推荐
推荐产品汇总
工程参考数据： PIC16F1719-E/MV ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC16F1719-I/MV | PIC16F1718-I/MV | PIC16F1717-I/MV | PIC16F1716-I/MV | PIC16F1709-I/MV |
|---|---|---|---|---|---|---|
| Package | 40-pin UQFN (MV) 5x5 mm | 40-pin UQFN (MV) - same | 40-pin UQFN (MV) - same | 40-pin UQFN (MV) - same | 40-pin UQFN (MV) - same | 40-pin UQFN (MV) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | PIC16 enhanced mid-range 8-bit | PIC16 enhanced mid-range 8-bit | PIC16 enhanced mid-range 8-bit | PIC16 enhanced mid-range 8-bit | PIC16 enhanced mid-range 8-bit | PIC16 enhanced mid-range 8-bit |
| Max CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Program Memory (Flash) | 28 KB | 28 KB | 16 KB | 16 KB | 16 KB | 14 KB |
| Data RAM | 2 KB | 2 KB | 1.5 KB | 1.5 KB | 1.5 KB | 1 KB |
| Operating Voltage Range | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| On-chip Op Amps | 3 | 3 | 2 | 2 | 2 | 2 |
| AEC-Q100 Automotive Grade | No (extended industrial only) | No (industrial only) | No | No | No | No |
关键差异点
- Highest Flash in the PIC16F171x UQFN-40 family （对比 PIC16F1718-I/MV)
- Most op amp channels in the 171x UQFN-40 family （对比 PIC16F1717-I/MV)
- Extended -40C to +125C temperature grade （对比 PIC16F1719-I/MV)
- XLP sub-uA sleep with full peripheral retention （对比 PIC16F1709-I/MV)
设计说明
The 40-pin UQFN (MV) package has an exposed thermal pad (EP) that is internally bonded to VSS. According to the Microchip PIC16F1719 datasheet, the EP must be soldered to a board ground pad with at least 12 thermal vias (0.3 mm drill, 0.5 mm pitch) for mechanical reliability and to provide the analog common reference. Missing EP solder creates a thermal hotspot and degrades op amp PSRR by as much as 6 dB at 100 kHz. Place a 100 nF decoupling cap within 3 mm of each VDD/VDDCORE pin pair plus one bulk 10 uF tantalum or ceramic on the main supply.
For XLP sleep designs, route the Zero Cross Detect (ZCD) input to a low-leakage AC sense network and use the PIC16F1719's internal 50 nA bias source. According to the PIC16F1719 datasheet, sleep current with RTCC active can drop below 1 uA, but the leakage of the external ZCD bias resistors must be below 10 nA to realize this figure. Use a high-impedance divider (10 Mohm/100 kohm) and place the resistor pair inside a guarded copper ring tied to MCU ground to prevent AC-line capacitive coupling.
Do not leave unused op amp inputs floating. According to the PIC16F1719 datasheet, each OPAxINx+ input must be tied to a known voltage (typically mid-rail via a 100 kohm resistor to VREF-) to prevent shoot-through current that can pull Iq above 1 mA and inject noise into adjacent analog channels. Also remember that PPS mapping is sequential: once a peripheral pin is reassigned, the original pin function is automatically disabled, so unused PPS remappings should be left in their reset (default) state to avoid firmware confusion during debug.
合规信息
RoHS and REACH compliant per Microchip product page. PIC16F1719-E/MV is NOT AEC-Q100 qualified - for AEC-Q100 automotive applications choose a Q-graded PIC16/18 family member.
