PIC16F18855-E/ML - 8-bit 32MHz 14KB Flash MCU | Microchip
料号： PIC16F18855-E/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1.39 | $1.39 |
| 10 | $1.27 | $12.70 |
| 100 | $1.08 | $108.00 |
| 500 | $0.94 | $470.00 |
| 1,000 | $0.84 | $840.00 |
| 3,000 | $0.71 | $2,130.00 |
PIC16F18855-E/ML 概述
A PIC microcontroller (MCU) is a compact programmable processor that integrates a CPU, non-volatile Flash memory, RAM, EEPROM, and a rich set of peripherals into a single IC. PIC MCUs use a modified Harvard RISC architecture and are positioned in the broader semiconductor hierarchy as: microcontroller -> embedded processor -> integrated circuit. Microchip's PIC16 mid-range family targets cost-sensitive applications needing deterministic real-time control, low-power sleep modes, and a wide peripheral mix.
Key features of the PIC16F18855 include a 32 MHz internal oscillator, up to 14 KB self-programmable Flash, 1 KB SRAM, 256 B EEPROM, an integrated 10-bit ADC with computation, multiple communication peripherals (I2C, SPI, EUSART), and a rich set of Core Independent Peripherals such as Configurable Logic Cells (CLC), Complementary Waveform Generator (CWG), Numerically Controlled Oscillator (NCO), and Zero-Cross Detect (ZCD). The XLP deep-sleep current is in the nanoampere range, ideal for battery-powered and energy-harvesting designs.
Architecturally, the device uses Microchip's mid-range 16-bit instruction word core with a hardware stack and prioritised interrupt controller. Hardware CIP blocks offload tasks such as waveform synthesis, signal conditioning, and event-driven logic from the CPU, reducing code size and improving responsiveness while keeping active-mode current low.
Typical applications include IoT sensor nodes, home appliances, automotive body and interior modules, consumer electronics, battery-powered instrumentation, LED lighting control, and industrial control panels. The FuSa-ready feature set (CRC/SCAN, HLT, Windowed WDT) supports designs targeting IEC 60730 Class B safety compliance.
When designing with the PIC16F18855-E/ML, populate the CONFIG words from MPLAB X IDE code generation tools and verify the operating voltage window of 2.3 V to 5.5 V matches your power rail. Keep traces to the exposed pad short and stitch vias through the e-pad for thermal and electrical reference.
This page synthesises distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for selection and sourcing decisions.
直接替换替代料： PIC16F18855-E/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC16F18855-E/ML （相同外形与封装尺寸） ——差异在于 Package, ADC, Operating Temperature, Core Architecture, Timers.
快速对比工具——选择替代料号进行并排对比：
PIC16F18855-I/ML
✅ 直接替换✓ 有现货
$1.38 / 个
查看数据手册 →PIC16F18855-E/MV
✅ 直接替换📋 参考替代料（不在目录中）
PIC16F18854-I/ML
✅ 直接替换✓ 有现货
$1.02 / 个
查看数据手册 →PIC16F1829-I/ML
✅ 直接替换✓ 有现货
$1.18 / 个
查看数据手册 →PIC16F18855-E/ML 最大额定值与电气特性
| Product Family | PIC16F1885X / PIC16F1887X |
| Core Architecture | PIC16 8-bit mid-range |
| CPU Speed (max) | 32 MHz |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| Data SRAM | 1 KB |
| Data EEPROM | 256 B |
| Operating Voltage | 2.3 V to 5.5 V |
| 工作温度 | -40 C to +125 C (E suffix) |
| ADC | 10-bit, integrated |
| 封装 | 28-QFN (6x6 mm) with exposed pad |
| 安装类型 | Surface Mount |
| Low-Power Technology | eXtreme Low Power (XLP) |
| Functional Safety | FuSa (CRC/SCAN, HLT, Windowed WDT) |
| Communication Peripherals | EUSART, I2C, SPI |
| Core Independent Peripherals | CLC, CWG, NCO, ZCD |
| RoHS 状态 | Compliant |
PIC16F18855-E/ML 引脚配置
| 引脚 1 | RA2 — Bidirectional I/O / analog / CWG |
| 引脚 2 | RA3 — Bidirectional I/O / analog / reference |
| 引脚 3 | RA4 — Bidirectional I/O / analog / ZCD |
| 引脚 4 | RA5 — Bidirectional I/O / analog / CLC |
| 引脚 5 | RA6 — Bidirectional I/O / analog |
| 引脚 6 | RA7 — Bidirectional I/O / analog |
| 引脚 7 | VDD — Positive supply (2.3 V to 5.5 V) |
| 引脚 8 | VSS — Ground reference |
| 引脚 9 | OSC1/RA0 — Crystal oscillator input / GPIO |
| 引脚 10 | OSC2/RA1 — Crystal oscillator output / GPIO |
| 引脚 11 | RC0 — Bidirectional I/O / analog / PWM |
| 引脚 12 | RC1 — Bidirectional I/O / analog / PWM |
| 引脚 13 | RC2 — Bidirectional I/O / analog / PWM |
| 引脚 14 | RC3 — Bidirectional I/O / analog / SCL |
| 引脚 15 | RC4 — Bidirectional I/O / analog / SDA |
| 引脚 16 | RC5 — Bidirectional I/O / analog |
| 引脚 17 | RC6 — Bidirectional I/O / TX |
| 引脚 18 | RC7 — Bidirectional I/O / RX |
| 引脚 19 | RB0 — Bidirectional I/O / interrupt-on-change |
| 引脚 20 | RB1 — Bidirectional I/O / interrupt-on-change |
| 引脚 21 | RB2 — Bidirectional I/O / interrupt-on-change |
| 引脚 22 | RB3 — Bidirectional I/O / interrupt-on-change |
| 引脚 23 | RB4 — Bidirectional I/O / interrupt-on-change |
| 引脚 24 | RB5 — Bidirectional I/O / interrupt-on-change |
| 引脚 25 | RB6 — Bidirectional I/O / ICSCLK |
| 引脚 26 | RB7 — Bidirectional I/O / ICSDA |
| 引脚 27 | VDD — Positive supply (2.3 V to 5.5 V) |
| 引脚 28 | VSS — Ground reference |
典型应用
PIC16F18855-E/ML 适用于 6 应用s: Battery-Powered IoT Sensor Nodes, Home Appliance Control Boards, Automotive Body and Interior Modules, LED Lighting Drivers and Dimming, Industrial Control Panels and HMI, Consumer Electronics Remote Controls.
Battery-Powered IoT Sensor Nodes
The PIC16F18855-E/ML fits IoT sensor nodes because its XLP deep-sleep current is in the nanoampere range, allowing the node to sleep for the bulk of every duty cycle while a sensor is sampled every few seconds. The 14 KB Flash holds the LoRaWAN or BLE protocol stack plus the application, and the Core Independent Peripherals (CLC, NCO, CWG) offload pulse counting and waveform generation without waking the CPU. In a typical 3.6 V Li-SOCl2 application, average current drops below 5 uA, enabling multi-year battery life.
推荐
Home Appliance Control Boards
The PIC16F18855-E/ML is a strong fit for washing machines, dishwashers, and microwave ovens where it must drive relays, read triac zero-crossing, and time motor sequences. The Zero-Cross Detect (ZCD) peripheral synchronises with the AC mains, the Complementary Waveform Generator (CWG) drives half-bridges, and the 10-bit ADC reads temperature and level sensors. The Functional Safety peripherals (CRC/SCAN, HLT) simplify IEC 60730 Class B compliance for white goods.
推荐
Automotive Body and Interior Modules
The PIC16F18855-E/ML operates over -40 C to +125 C, which matches the AEC-Q100 temperature window for body-control modules such as seat controllers, mirror adjusters, and ambient lighting drivers. Its LIN-compatible EUSART can talk to vehicle networks via an external transceiver, while the Windowed Watchdog Timer and CRC/SCAN features help meet functional safety requirements for body electronics. The compact 6x6 mm QFN saves board space inside tight cluster modules.
推荐
LED Lighting Drivers and Dimming
The PIC16F18855-E/ML drives LED lighting by combining the Complementary Waveform Generator (CWG) for high-frequency PWM dimming with the Zero-Cross Detect (ZCD) for triac-compatible phase-cut dimming. The 10-bit ADC reads colour-mix sensors for tunable-white or RGB feedback loops. The 14 KB Flash accommodates DMX-512 or DALI frame decoders, while the CLC block performs combinatorial logic for fault detection without waking the CPU.
推荐
Industrial Control Panels and HMI
The PIC16F18855-E/ML is ideal for industrial HMI sub-panels and small PLC I/O cards where it must read push buttons and rotary encoders, drive segment LCDs or small TFT displays, and communicate over RS-485. The EUSART plus DMA-fed buffering keeps the CPU free for higher-level protocol handling. The extended temperature range and the Functional Safety peripherals suit rugged factory environments.
推荐
Consumer Electronics Remote Controls
The PIC16F18855-E/ML powers IR and RF remote controls where battery life and PCB area dominate. The Numerically Controlled Oscillator (NCO) generates accurate carrier frequencies for IR transmission, while the CWG produces the modulated waveform, all without consuming CPU cycles. The wide 2.3 V to 5.5 V supply range lets the design run from a single CR2032 coin cell. Low sleep current keeps standby drain below 1 uA, extending battery life to multiple years.
推荐
推荐产品汇总
工程参考数据： PIC16F18855-E/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC16F18855-I/ML | PIC16F18855-E/MV | PIC16F18854-I/ML | PIC16F1829-I/ML |
|---|---|---|---|---|---|
| Package | 28-QFN (6x6) | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 14 KB | 14 KB | 14 KB | 7 KB | 8 KB |
| SRAM | 1 KB | 1 KB | 1 KB | 512 B | 1 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B |
| Operating Temperature | -40 C to +125 C | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C |
| Core Independent Peripherals | CLC, CWG, NCO, ZCD | CLC, CWG, NCO, ZCD | CLC, CWG, NCO, ZCD | CLC, CWG, NCO, ZCD | Limited (no CLC/NCO/CWG) |
| Functional Safety | Yes (CRC/SCAN, HLT, WWDT) | Yes (CRC/SCAN, HLT, WWDT) | Yes (CRC/SCAN, HLT, WWDT) | Yes (CRC/SCAN, HLT, WWDT) | Limited |
| Unit Price @1000 (USD, as of 2026-09-20) | 0.84 | 0.79 (lower - industrial grade) | 0.85 (same) | 0.76 | 0.69 |
关键差异点
- Extended temperature grade for harsh environments （对比 PIC16F18855-I/ML)
- Modern CIP feature set （对比 PIC16F1829-I/ML)
- More Flash in same footprint （对比 PIC16F18854-I/ML)
设计说明
For the PIC16F18855-E/ML 28-QFN (6x6) package, expose the e-pad on the PCB and stitch at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) through to the inner ground plane. This dissipates up to 0.5 W of internal dissipation and ensures a stable thermal reference. Place a 10 nF + 1 uF + 10 uF decoupling capacitor cluster within 2 mm of each VDD pin, with the smallest cap closest to the IC pin.
Do not leave the ICSPCLK and ICSPDAT pins (RB6/RB7) floating in production; they are sensitive to noise and can unintentionally enter programming mode. Add a 10 kohm pull-up to RB7 and a 10 kohm pull-down to RB6 if no ICSP header is fitted. Also, configure the CONFIG words in code using #pragma config, not by relying on MPLAB X IDE defaults, so that the Brown-out Reset, Watchdog, and LVP bits are always set correctly.
Use the XLP sleep modes (DOZE, SLEEP, IDLE_A, IDLE_B) combined with Peripheral Module Disable (PMD) to drop the active current of the PIC16F18855-E/ML below 50 uA/MHz and the deep-sleep current below 100 nA. Enable the Peripheral Interrupt Controllers in sleep mode and wake the CPU only on a timer, ADC threshold, or external interrupt from the CLC. This pattern typically yields 90 percent energy savings on duty-cycled battery-powered designs.
合规信息
RoHS and lead-free compliant per Microchip product page. AEC-Q100 not listed; extended temperature grade supports -40C to +125C but is not a formal automotive qualification.
