PIC16F18855-I/ML - 8-Bit 32MHz 14KB Flash XLP MCU | Microchip
MPN: PIC16F18855-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.1 | $2.10 |
| 10 | $1.92 | $19.20 |
| 100 | $1.72 | $172.00 |
| 500 | $1.55 | $775.00 |
| 1,000 | $1.38 | $1,380.00 |
PIC16F18855-I/ML Overview
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data path, typically using a Harvard or modified-Harvard architecture, integrating CPU core, non-volatile program memory (Flash), volatile data memory (SRAM), EEPROM, and a rich set of on-chip peripherals. Within the broader taxonomy, the PIC16F18855 sits as: 8-bit MCU -> PIC16 family -> mid-range PIC microcontroller -> embedded microcontroller -> semiconductor IC. 8-bit MCUs dominate cost-sensitive, low-power applications such as sensor nodes, consumer appliances, and IoT endpoints where 32-bit performance is unnecessary.
Key features include 14KB self-programmable Flash program memory with program Flash protection, 1KB SRAM data memory, 256B EEPROM with high-endurance 100k write/erase cycles, and up to 32MHz internal oscillator. The CIP block integrates configurable logic cells, numerically controlled oscillator (NCO), complementary waveform generator (CWG), and signal measurement timer (SMT), enabling hardware-state-machine tasks without CPU intervention. The XLP technology delivers nanoWatt sleep currents down to 60 nA typical, and the device supports 1.8V-5.5V (F) or 1.8V-3.6V (LF) operation.
Architecturally, the device uses Microchip's enhanced mid-range core with a 14-bit instruction word, single-cycle ALU, and hardware multiply/divide assist. The integrated analog chain includes a 10-bit ADC with computation (ADC2), 5-/8-bit DAC, two comparators, and a zero-cross detector, allowing mixed-signal tasks in firmware-light code. Communication peripherals cover EUSART, MSSP (I2C/SPI), and multiple PWM/CCP modules for motor and lighting control.
Typical applications include IoT sensor nodes, battery-powered wearables, home-automation controllers, BLDC motor control, LED lighting drivers, and functional-safety systems. Functional Safety (FuSa) documentation per IEC 61508 SIL 2/3 supports safety-critical industrial designs.
When designing with this part, plan the PCB layout to keep the exposed pad soldered to a continuous ground plane to meet QFN thermal performance (theta_JA around 30 C/W). Confirm the voltage range: 'F' parts run 2.5V-5.5V at full 32MHz speed, while 'LF' parts run 1.8V-3.6V.
This page synthesizes distributor pricing from DigiKey/Mouser/LCSC, drop-in alternatives within the same QFN-28 package, and practical design notes not aggregated on any single manufacturer page.
Drop-in alternatives for PIC16F18855-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16F18855-I/ML (same form factor and footprint) — differing in Package, ADC, Core Architecture, Timers, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F18855-I/SP
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
PIC16F18855-I/SO
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1.29 / Unit
View Datasheet →PIC16F18855T-I/ML
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1.26 / Unit
View Datasheet →PIC16F18857-I/ML
✅ Drop-In✓ In Stock
$1.8 / Unit
View Datasheet →PIC16F18875-I/ML
✅ Drop-In✓ In Stock
$1.55 / Unit
View Datasheet →PIC16F18854-I/ML
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1.02 / Unit
View Datasheet →PIC16F18856-I/ML
✅ Drop-In✓ In Stock
$1.65 / Unit
View Datasheet →PIC16F18855-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | 8-bit PIC enhanced mid-range (14-bit instruction word) |
| Family | PIC16(L)F1885X/7X |
| Max CPU Speed | 32 MHz |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| Data Memory (SRAM) | 1 KB |
| EEPROM | 256 B |
| Supply Voltage (F) | 2.5 V to 5.5 V |
| Supply Voltage (LF) | 1.8 V to 3.6 V |
| I/O Pins | 25 (maximum) |
| ADC | 10-bit ADC2 with computation, up to 24 channels |
| DAC | 5-bit and 8-bit DAC modules |
| Comparators | 2 |
| PWM / CCP | Multiple CCP and PWM channels |
| Communication | EUSART, MSSP (I2C/SPI), CWG, NCO, SMT |
| Core Independent Peripherals (CIP) | Yes (CLC, NCO, CWG, SMT, CRC/SCAN, HLT) |
| XLP (eXtreme Low Power) | Yes, nanoWatt sleep ~60 nA typical |
| Functional Safety (FuSa) | IEC 61508 SIL 2/3 documentation available |
| Operating Temperature | -40 C to +85 C (industrial) |
| Package | 28-pin QFN (ML) 6x6 mm with exposed pad |
| Mounting Type | Surface Mount |
| MSL Level | 1 (unlimited) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
PIC16F18855-I/ML Pin Configuration
| Pin 1 | RA5 — Bidirectional I/O / ADC input |
| Pin 2 | RA4 — Bidirectional I/O / ADC input |
| Pin 3 | RA3 — Bidirectional I/O / VPP programming |
| Pin 4 | RA2 — Bidirectional I/O / analog input |
| Pin 5 | RA1 — Bidirectional I/O / DAC1 output / comparator |
| Pin 6 | RA0 — Bidirectional I/O / DAC2 output / comparator |
| Pin 7 | VSS — Ground reference |
| Pin 8 | RA7 — Bidirectional I/O / oscillator |
| Pin 9 | RA6 — Bidirectional I/O / oscillator |
| Pin 10 | RC0 — Bidirectional I/O / analog input |
| Pin 11 | RC1 — Bidirectional I/O / analog input |
| Pin 12 | RC2 — Bidirectional I/O / analog input |
| Pin 13 | RC3 — Bidirectional I/O / analog input / SCL |
| Pin 14 | RC4 — Bidirectional I/O / analog input / SDA |
| Pin 15 | RC5 — Bidirectional I/O / analog input |
| Pin 16 | RC6 — Bidirectional I/O / analog input |
| Pin 17 | RC7 — Bidirectional I/O / analog input |
| Pin 18 | RB7 — Bidirectional I/O / ICSP data |
| Pin 19 | RB6 — Bidirectional I/O / ICSP clock |
| Pin 20 | RB5 — Bidirectional I/O / analog input |
| Pin 21 | RB4 — Bidirectional I/O / analog input |
| Pin 22 | RB3 — Bidirectional I/O / analog input |
| Pin 23 | RB2 — Bidirectional I/O / analog input |
| Pin 24 | RB1 — Bidirectional I/O / analog input |
| Pin 25 | RB0 — Bidirectional I/O / analog input / interrupt |
| Pin 26 | VDD — Positive supply voltage |
| Pin 27 | VSS — Ground reference |
| Pin 28 | VDD — Positive supply voltage |
Typical Applications
PIC16F18855-I/ML is suitable for 7 applications: IoT Wireless Sensor Nodes, Home Appliance Control, LED Lighting Drivers, Wearable Health Bands, Industrial Sensor Transmitters, Automotive Body Electronics, Functional Safety Subsystems.
IoT Wireless Sensor Nodes
The PIC16F18855-I/ML's XLP technology and Core Independent Peripherals (CIP) make it ideal for battery-powered IoT sensor nodes. The nanoWatt sleep mode drops current to ~60 nA typical with RTC running, allowing multi-year operation on a CR2032 coin cell when duty-cycled at 0.1%. The 10-bit ADC2 with computation automates threshold detection and averaging without waking the CPU, and 14KB Flash accommodates BLE/Zigbee/LoRa host stacks or proprietary sub-GHz protocols. CLC cells can implement custom wake-up signal conditioning and SMbus polling entirely in hardware. Typical reference design: PIC16F18855 + RN2483 LoRa module + TMP117 temperature sensor reporting every 60 s on 2x AA batteries for 5+ years.
Recommended
Home Appliance Control
The PIC16F18855-I/ML fits white-goods and small-appliance control boards that need reliable 8-bit processing at a tight cost point. Its 32MHz core drives BLDC or single-phase AC motor control via the Complementary Waveform Generator (CWG) and up to four PWM channels with dead-band control. The 28-pin QFN (6x6 mm) drops onto compact boards inside washing machines, dishwashers, and air purifiers. Two comparators and a zero-cross detector support line-voltage sensing without extra ICs. Functional Safety documentation per IEC 61508 SIL 2/3 assists compliance for safety-critical appliance subsystems.
Recommended
LED Lighting Drivers
Smart LED drivers benefit from the PIC16F18855-I/ML's 10-bit ADC2 for current sensing, 8-bit DAC for analog dimming reference, and multiple PWM channels for color-mixing RGBW fixtures. The CLC and SMT peripherals implement closed-loop constant-current control without CPU overhead, while XLP sleep reduces standby power below 100 nA for ENERGY STAR compliance. The 14KB Flash accommodates DALI-2, Casambi, or proprietary mesh protocols. The 28-pin QFN keeps the BOM footprint under 50 mm squared including power-stage MOSFETs, ideal for PAR-spot and downlight form factors.
Recommended
Wearable Health Bands
Wearables and fitness bands use the PIC16F18855-I/ML as the main controller or a sensor-hub co-processor thanks to its tiny 6x6 mm QFN footprint and ultra-low sleep current. The 1KB SRAM supports basic step-counting and heart-rate algorithms on-chip, while the 14KB Flash holds BLE GATT services. The 10-bit ADC2 reads PPG photodiode signals with hardware averaging, and the MSSP I2C bus interfaces optical heart-rate sensors and accelerometers without CPU load. CIP blocks drive haptic feedback PWM autonomously. Operating from 1.8V (LF variant), the device pairs with small Li-ion or Li-poly batteries.
Recommended
Industrial Sensor Transmitters
4-20 mA loop-powered and battery-backed industrial transmitters benefit from the PIC16F18855-I/ML's industrial -40 C to +85 C temperature range and Functional Safety documentation. The 10-bit ADC2 with computation delivers calibrated sensor readings for thermocouples, RTDs, pressure, and flow sensors; the 5-bit/8-bit DAC and PWM generate 4-20 mA loop current with minimal external circuitry. Hardware CRC/SCAN supports IEC 61508 SIL compliance checks. The 28-pin QFN packs into DIN-rail head-mount form factors. CIP blocks ensure deterministic response times for safety shutdown signals.
Recommended
Automotive Body Electronics
Body and chassis ECUs use the PIC16F18855-I/ML for cost-sensitive, non-safety-critical functions such as mirror control, ambient lighting, seat-position memory, and HVAC blend-door actuation. The 32MHz core executes LIN stack and PWM actuation in firmware, while the 256B EEPROM stores user preferences. CIP cells manage debounced switch scanning without CPU wakeup, and the 10-bit ADC reads NTC thermistors and potentiometers for HVAC feedback. AEC-Q100 qualification is required for under-hood applications - pair with a Q1-grade part for powertrain domains, but the standard PIC16F18855-I/ML suits interior body modules.
Recommended
Functional Safety Subsystems
The PIC16F18855-I/ML's published IEC 61508 SIL 2/3 Functional Safety documentation makes it suitable for safety-instrumented subsystems such as gas detectors, fire-alarm peripherals, and industrial emergency-stop expanders. Hardware CRC/SCAN continuously checks Flash and RAM integrity, while the Windowed Watchdog Timer (WWDT) catches software lockups. The CIP blocks deliver deterministic interrupt latency for sensor-trip decisions. The 14KB Flash supports a small safety RTOS or state machine, and 1KB SRAM holds trip thresholds and diagnostic counters. Drop-in upgrade to PIC16F18875 adds peripherals for larger safety subsystems.
Recommended
Recommended Products Summary
Engineering reference data for PIC16F18855-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F18855-I/SP | PIC16F18855-I/SO | PIC16F18857-I/ML | PIC16F18875-I/ML | PIC16F18854-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-28 (ML) 6x6 mm | SPDIP-28 (different package) | SOIC-28 wide (different package) | QFN-28 (ML) 6x6 mm - same | QFN-28 (ML) 6x6 mm - same | QFN-28 (ML) 6x6 mm - same |
| Flash Memory | 14 KB | 14 KB | 14 KB | 56 KB | 28 KB | 7 KB |
| SRAM | 1 KB | 1 KB | 1 KB | 4 KB | 2 KB | 1 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| Max CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V |
| Core Independent Peripherals (CIP) | Yes (CLC, NCO, CWG, SMT, CRC/SCAN, HLT) | Yes (same) | Yes (same) | Yes (same) | Yes (same + extra) | Yes (same) |
| XLP Sleep Current | ~60 nA typical | ~60 nA typical | ~60 nA typical | ~60 nA typical | ~60 nA typical | ~60 nA typical |
| Functional Safety (FuSa) Docs | Yes (IEC 61508 SIL 2/3) | Yes (same) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
Key Differentiators
- Industry-leading XLP sleep current ~60 nA (vs PIC16F18854-I/ML)
- QFN-28 (6x6 mm) compact footprint with Functional Safety docs (vs PIC16F18855-I/SP)
- Drop-in upgrade path to PIC16F18857-I/ML (vs PIC16F18854-I/ML)
Design Notes
Estimated: the 28-pin QFN (6x6 mm) has a thermal pad (EP) that MUST be soldered to a continuous ground plane of at least 1 square inch to meet rated electrical and thermal performance. With theta_JA around 30 C/W on a 1-oz 4-layer board, the device safely dissipates up to ~1 W continuous, well above the typical 30-50 mA active current draw. Skip the thermal pad and junction temperature can rise above 125 C at modest loads. Place thermal vias (8-12, 0.3 mm drill) directly under the EP to the inner ground plane.
Decouple VDD with a 100 nF ceramic capacitor placed within 3 mm of pins 26 and 28, plus a bulk 1-10 uF tantalum or ceramic on the supply rail. For battery-powered designs, the on-chip LDO can operate down to 2.5V (F variant) or 1.8V (LF variant). Use Sleep mode + peripheral module disable (PMD) registers to drop quiescent current below 1 uA when idle, and enable the Windowed WWDT to catch software lockups in safety applications. For high-impedance analog signals, disable digital input buffers on the corresponding pins to avoid leakage.
Separate analog and digital ground planes and join them at a single point under the IC's GND pin to minimize ADC noise coupling. Route the 32MHz crystal traces (if used) short and symmetric with guard ground, and keep switching signals (PWM, SPI) away from the ADC input traces. The ICSP/ICD pins (RB6/RB7) should have a 4.7 kohm pull-up to VDD and series 100 ohm to the programmer header to allow in-circuit debug without interfering with the application. For QFN packages, ensure the land pattern uses NSMD (non-solder-mask-defined) pads with 0.2-0.3 mm solder-mask openings for reliable assembly.
Do not confuse PIC16F18855 (F variant, 2.5V-5.5V) with PIC16LF18855 (LF variant, 1.8V-3.6V); over-voltage on the LF variant permanently damages the device. Verify the device ID using the Device ID register (0x8004 expected value 0x3060 for PIC16F18855) before programming in production. When migrating from PIC16F18854 to PIC16F18855, code is binary-compatible but Flash programming commands and memory maps differ - recompile firmware with the new device header. Avoid using internal oscillator above 32 MHz without enabling PLL; otherwise UART EUSART baud-rate errors exceed 2%.
For 32 MHz operation, the High-Frequency Internal Oscillator (HFINTOSC) provides +/- 1% accuracy at room temperature and +/- 2% across -40 C to +85 C, which is sufficient for UART communication at 115200 baud with proper BRG calculation. For RS-485 or CAN applications requiring tighter clock accuracy, use an external 16 MHz crystal with the on-chip PLL to generate 32 MHz system clock. Route the EUSART TX/RX lines as differential pairs with 100 ohm impedance for RS-485, and add TVS diodes for surge protection per IEC 61000-4-2.
Compliance Information
RoHS compliant per Microchip product page. Industrial -40 C to +85 C temperature range. AEC-Q100 qualification not applicable for standard I-grade parts - pair with a -Q1 suffix variant for automotive applications. Functional Safety (FuSa) IEC 61508 SIL 2/3 documentation available on request from Microchip.
