PIC16LF1516T-I/ML - 14KB Flash 8-bit MCU 28-VQFN | Microchip
料号： PIC16LF1516T-I/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2.1 | $2.10 |
| 10 | $1.92 | $19.20 |
| 100 | $1.65 | $165.00 |
| 500 | $1.42 | $710.00 |
| 1,000 | $1.18 | $1,180.00 |
PIC16LF1516T-I/ML 概述
An 8-bit microcontroller (MCU) is a compact programmable processor that integrates a CPU, non-volatile program memory, working RAM, and peripherals on a single silicon die. MCUs sit at the bottom of the embedded-computing hierarchy (8-bit MCU -> microcontroller -> embedded processor -> semiconductor IC) and are typically deployed in cost- and power-sensitive applications where deterministic real-time response matters more than raw throughput. The PIC16 core is a RISC-style Harvard architecture optimized for low power and predictable instruction timing.
Key features of the PIC16LF1516T-I/ML include nanoWatt XLP (eXtreme Low Power) technology for sub-microamp sleep currents, 14KB (8K x 14) self-programmable Flash, 10-bit ADC with multiple channels, two Capture/Compare/PWM modules, and a peripheral pin-select (PPS) system that maps digital functions to any I/O pin. The wide 2.3V-5.5V supply range lets one board design serve both 3.3V and 5V systems.
The architecture pairs a 14-bit instruction word with an 8-bit data path, a hardware stack, and an interrupt controller. The exposed pad on the QFN package improves thermal dissipation, important when the device drives GPIO at full speed while the ADC samples. Internal oscillator options reduce external BOM count by eliminating the need for a separate crystal in many designs.
Typical applications include consumer white goods, sensor signal conditioning, battery-powered IoT nodes, low-cost motor control with PWM, and human-interface boards where buttons, LEDs, and serial communication to a host MCU coexist. Designers pick this part when they need more Flash than PIC16LF150x series chips but do not yet need the larger PIC18 migration.
When laying out the board, place a low-ESR 100nF decoupling capacitor within 2 mm of the VDD pin and a 10uF bulk capacitor nearby. The exposed thermal pad must be soldered to a continuous ground copper pour for both thermal performance and electrical reference; floating the pad will degrade ADC accuracy and may violate absolute-maximum ratings on the die.
This page synthesizes distributor pricing tiers, drop-in same-package alternatives, and practical PCB design notes that complement - but do not replace - the manufacturer datasheet.
直接替换替代料： PIC16LF1516T-I/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC16LF1516T-I/ML （相同外形与封装尺寸） ——差异在于 Package, ADC, MSL Level, Program Memory (Flash), I/O Pins.
快速对比工具——选择替代料号进行并排对比：
PIC16LF1516-I/ML
✅ 直接替换✓ 有现货
$1.05 / 个
查看数据手册 →PIC16LF1516-E/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC16LF1517-I/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC16LF1513-I/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC16LF1516T-I/ML 最大额定值与电气特性
| Program Memory Type | Flash |
| Program Memory Size | 14 KB (8K x 14) |
| RAM Size | 512 B |
| CPU Core | PIC 8-bit, 14-bit instruction word |
| Maximum CPU Clock | 20 MHz |
| Operating Voltage Range | 2.3 V to 5.5 V |
| ADC | 10-bit, multi-channel |
| Capture/Compare/PWM Modules | 2 x CCP |
| Serial Interfaces | SPI, I2C (MI2C), EUSART |
| I/O Pins | 17 (typical, varies by peripheral usage) |
| 封装 | 28-VQFN Exposed Pad (ML) |
| 工作温度范围 | -40 C to +85 C (industrial, I) |
| Low-Power Technology | nanoWatt XLP |
| RoHS 状态 | Compliant |
| 安装类型 | Surface Mount |
PIC16LF1516T-I/ML 引脚配置
| 引脚 1 | RA5 — I/O port A bit 5 |
| 引脚 2 | RA4 — I/O port A bit 4 |
| 引脚 3 | RA3 — I/O port A bit 3 |
| 引脚 4 | RA2 — I/O port A bit 2 |
| 引脚 5 | RA1 — I/O port A bit 1 |
| 引脚 6 | RA0 — I/O port A bit 0 |
| 引脚 7 | VSS — Ground reference |
| 引脚 8 | RA7 — I/O port A bit 7 |
| 引脚 9 | RA6 — I/O port A bit 6 / OSC1 |
| 引脚 10 | RC0 — I/O port C bit 0 |
| 引脚 11 | RC1 — I/O port C bit 1 |
| 引脚 12 | RC2 — I/O port C bit 2 |
| 引脚 13 | RC3 — I/O port C bit 3 / SCL |
| 引脚 14 | RC4 — I/O port C bit 4 / SDA |
| 引脚 15 | RC5 — I/O port C bit 5 |
| 引脚 16 | RC6 — I/O port C bit 6 / TX |
| 引脚 17 | RC7 — I/O port C bit 7 / RX |
| 引脚 18 | RB7 — I/O port B bit 7 / ICSPDAT |
| 引脚 19 | RB6 — I/O port B bit 6 / ICSPCLK |
| 引脚 20 | RB5 — I/O port B bit 5 |
| 引脚 21 | RB4 — I/O port B bit 4 |
| 引脚 22 | RB3 — I/O port B bit 3 / MCLR |
| 引脚 23 | RB2 — I/O port B bit 2 |
| 引脚 24 | RB1 — I/O port B bit 1 |
| 引脚 25 | RB0 — I/O port B bit 0 / INT |
| 引脚 26 | VDD — Positive supply 2.3V-5.5V |
| 引脚 27 | RA6/OSC2 — I/O / oscillator output (alt mapping) |
| 引脚 28 | EP — Exposed thermal pad - tie to VSS |
典型应用
PIC16LF1516T-I/ML 适用于 6 应用s: Battery-Powered IoT Sensor Nodes, Consumer White Goods Control Boards, LED Lighting and Signage Controllers, Industrial Sensor Signal Conditioning, Automotive Body Electronics (Non-Safety), HMI Keypad and Remote Control Boards.
Battery-Powered IoT Sensor Nodes
The PIC16LF1516T-I/ML's nanoWatt XLP technology delivers sub-microamp sleep currents, and its 2.3V-5.5V supply range allows direct connection to a single-cell Li-Ion or two-AA battery stack. The 10-bit ADC front-ends analog sensors (temperature, humidity, or gas) with no extra signal chain. With 14KB Flash, designers fit MQTT-SN, LoRaWAN, or BLE-beacon stacks alongside sensor processing. Per Microchip datasheet 40005706C, the 20MHz core executes 5 MIPS, enough to wake, sample, run a small DSP filter, transmit, and return to sleep within milliseconds - well below the energy budget of typical coin-cell deployments.
推荐
Consumer White Goods Control Boards
The PIC16LF1516T-I/ML suits washing machines, dishwashers, and induction cooktops that need deterministic timing and reliable human-interface handling. Two CCP modules drive triac-controlled heating elements or brushed DC motors with hardware PWM, while the EUSART links to a UI display board. The 28-VQFN footprint survives the high-temperature, high-vibration environment of an appliance chassis when the exposed pad is soldered to a continuous ground pour. PIC16LF1516T-I/ML's wide 2.3V-5.5V supply range accepts either a 3.3V or 5V power tree without rework.
推荐
LED Lighting and Signage Controllers
Color-mixing and chasing patterns in architectural lighting benefit from the PIC16LF1516T-I/ML's two CCP modules generating PWM dimming signals for multi-channel LED strings. With PPS, designers reassign PWM outputs to any spare GPIO, simplifying PCB routing in dense channel-count drivers. The 14KB Flash holds pattern tables, color-temperature curves, and DMX-512 or DALI command parsing for professional installations. Low sleep current lets always-on fixtures consume negligible standby power when lights are off but the controller remains network-connected.
推荐
Industrial Sensor Signal Conditioning
In factory automation, the PIC16LF1516T-I/ML front-ends 4-20mA loops, thermocouples, and bridge sensors with its 10-bit ADC, then linearizes and transmits via RS-485 EUSART or SPI to a host PLC. The -40C to +85C industrial temperature rating meets most factory-floor environments, and the wide supply range accepts 24V industrial rails after external regulation. Hardware PWM drives a fault LED or alert buzzer without consuming CPU cycles. The 28-VQFN's small footprint fits tight DIN-rail transducer enclosures while the exposed pad dissipates heat from continuous ADC sampling.
推荐
Automotive Body Electronics (Non-Safety)
The PIC16LF1516T-I/ML powers window lift switches, seat controllers, mirror adjusters, and ambient lighting nodes that do not require ASIL-rated MCUs. Its 2.3V-5.5V supply accepts 12V battery rails after regulation, while two CCP channels drive small brushed motors or LED strings. Designers select the PIC16LF1516-E/ML extended-temperature grade for under-hood-adjacent modules. PPS simplifies pin assignment for the multi-connector body harnesses common in vehicle interior electronics, reducing PCB layer count versus fixed-pin microcontrollers.
推荐
HMI Keypad and Remote Control Boards
Universal remotes, HVAC wall controllers, and security keypads benefit from the PIC16LF1516T-I/ML's combination of Flash headroom, low sleep current, and EUSART/SPI links to RF transceivers or LCD drivers. The 10-bit ADC scans resistive touch keypads or potentiometer inputs without external analog front ends. PPS reassigns SPI or I2C pins to reach LCD modules routed on the opposite side of a compact PCB. Designers gain low standby drain (nanoWatt XLP) so wall-mounted devices operate years on a coin cell.
推荐
推荐产品汇总
工程参考数据： PIC16LF1516T-I/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC16LF1516-I/ML | PIC16LF1516-E/ML | PIC16LF1517-I/ML | PIC16LF1513-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-VQFN (ML) Exposed Pad | 28-VQFN (ML) - same | 28-VQFN (ML) - same | 28-VQFN (ML) - same | 28-VQFN (ML) - same |
| Flash Program Memory | 14 KB | 14 KB | 14 KB | 28 KB | 7 KB |
| RAM | 512 B | 512 B | 512 B | 1 KB | 256 B |
| Maximum CPU Clock | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Operating Voltage | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C |
| ADC | 10-bit, multi-channel | 10-bit, multi-channel | 10-bit, multi-channel | 10-bit, multi-channel | 10-bit, multi-channel |
| Drop-in Compatibility | Reference | Yes - identical die | Yes - same die, wider temp | Yes - same footprint, more memory | Yes - same footprint, less memory |
关键差异点
- Doubled Flash and RAM headroom versus PIC16LF1513 family （对比 PIC16LF1513-I/ML)
- Same 28-VQFN footprint allows upward migration （对比 PIC16LF1517-I/ML)
- Extended-temperature option in same footprint （对比 PIC16LF1516-E/ML)
设计说明
Place a 100nF low-ESR ceramic decoupling capacitor within 2mm of the VDD pin and a 10uF bulk capacitor on the same supply trace. For battery-powered designs operating from a coin cell, use a 1uF bulk in parallel with 100nF to handle the high inrush when the MCU wakes from nanoWatt sleep. Per Microchip datasheet 40005706C, VDD rise time must remain below datasheet specifications to avoid POR misbehavior.
Solder the 28-VQFN exposed thermal pad (EP) to a continuous ground copper pour with multiple thermal vias. A floating pad degrades ADC accuracy and may violate absolute-maximum thermal ratings. Keep high-speed digital traces (EUSART, SPI) away from the analog ADC inputs to minimize digital-to-analog crosstalk on dense boards.
Do not leave the MCLR pin floating when not used in ICSP programming - tie it to VDD through a 10kohm pull-up. Floating MCLR can cause spurious resets in noisy environments. The PPS peripheral pin-select must be unlocked via the PPSLOCK register sequence; failing to do so causes silent peripheral failures.
Route the ICSPDAT and ICSPCLK signals (RB7/RB6) so that they are not loaded by long stubs, especially when using an MPLAB Snap or PICkit programmer in-circuit. Series 4.7kohm resistors on the ICSP lines protect against programming-tool conflicts when the application shares those pins with user I/O.
合规信息
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - for automotive safety-critical applications use PIC16LF1516-E/ML with extended temperature or migrate to AEC-Q100 qualified PIC16F variants.
