PIC16LF15354-E/MV - 8-bit MCU 7KB Flash 32MHz XLP | Microchip
料号： PIC16LF15354-E/MV ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1.85 | $1.85 |
| 10 | $1.7 | $17.00 |
| 100 | $1.55 | $155.00 |
| 500 | $1.4 | $700.00 |
| 1,000 | $1.25 | $1,250.00 |
PIC16LF15354-E/MV 概述
An 8-bit microcontroller (MCU) is a compact, single-chip computer built around an 8-bit data path. It belongs to the broader family of microcontrollers, which are themselves a subcategory of embedded processors within semiconductors. 8-bit MCUs remain widely used in cost-sensitive, low-power, and deterministic applications because their instruction sets are simple, their tool chains are mature, and their interrupt latency is highly predictable.
Key features of the PIC16LF15354-E/MV include 4x PWM channels, a hardware Comparator, a 5-bit DAC, a 10-bit ADC with computation, a Complementary Waveform Generator (CWG), and a Memory Access Partition (MAP) feature for bootloader protection. The 28-pin UQFN (4x4 mm) package provides a small footprint suitable for space-constrained designs. XLP technology enables deep sleep currents in the nanoampere range, extending battery life in portable and energy-harvesting applications.
The device is built on an enhanced mid-range PIC core with a 14-bit instruction word and a hardware multiplier, balancing code density with deterministic execution. Its Intelligent Analog peripherals (ADC with computation, slope compensation, and burst averaging) and CIPs (CLC, CLC2, NCO, CWG) allow complex control loops to run without CPU intervention, freeing the core for application logic.
Typical applications include low-power IoT sensor nodes, battery-powered motor control, LED lighting controllers, capacitive touch user interfaces, automotive body electronics (with the matching -E automotive grade suffix), and consumer remote controls. Industrial sensor hubs and small home appliances are also strong fits given the broad peripheral mix.
Design consideration: Because the UQFN (4x4) package has an exposed thermal pad that doubles as the device ground, the PCB land pattern must include a center thermal pad with multiple thermal vias to a continuous ground plane. Omitting these vias will increase junction temperature and degrade ADC accuracy at high ambient temperatures.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not always consolidated on the manufacturer product page.
直接替换替代料： PIC16LF15354-E/MV ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC16LF15354-E/MV （相同外形与封装尺寸） ——差异在于 ADC, Comparators, DAC, Package, Program Memory (Flash).
快速对比工具——选择替代料号进行并排对比：
PIC16LF15344-E/MV
✅ 直接替换📋 参考替代料（不在目录中）
PIC16LF15355-E/MV
✅ 直接替换✓ 有现货
$1.12 / 个
查看数据手册 →PIC16F15354-E/MV
✅ 直接替换📋 参考替代料（不在目录中）
PIC16F15344-E/MV
✅ 直接替换📋 参考替代料（不在目录中）
PIC16LF15354-E/ML
✅ 直接替换✓ 有现货
$0.85 / 个
查看数据手册 →PIC16LF15354-E/MV 最大额定值与电气特性
| Core Architecture | 8-bit PIC enhanced mid-range |
| Family | PIC16F153xx (XLP) |
| Program Memory (Flash) | 7 KB (4K x 14) |
| Data SRAM | 512 B |
| Maximum CPU Speed | 32 MHz |
| 工作温度范围 | -40C to +125C |
| 封装 | 28-UQFN (4x4 mm) |
| 安装类型 | Surface Mount |
| PWM Channels | 4x |
| ADC | 10-bit with computation |
| DAC | 5-bit |
| Comparators | Yes (hardware) |
| CWG (Complementary Waveform Generator) | Yes |
| Communication Interfaces | 2x EUSART, SPI, I2C |
| XLP (eXtreme Low Power) | Yes (nanoWatt XLP) |
| RoHS 状态 | Compliant |
PIC16LF15354-E/MV 28-uqfn (4x4 mm) 引脚配置指南
PIC16LF15354-E/MV（28-uqfn (4x4 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： PIC16LF15354-E/MV.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PIC16LF15354-E/MV 适用于 7 应用s: Low-Power IoT Sensor Nodes, LED Lighting Controllers, Capacitive Touch User Interface, Battery-Powered Motor Control, Industrial Sensor Hubs, Consumer Remote Controls, Small Home Appliances.
Low-Power IoT Sensor Nodes
The PIC16LF15354-E/MV's nanoWatt XLP technology (deep-sleep currents in the nanoampere range) makes it ideal for battery-powered IoT sensor nodes that must run for years on a coin cell. The 10-bit ADC with computation handles direct sensor signal conditioning, while the 2x EUSART, SPI, and I2C interfaces allow connection to wireless modules such as LoRa, BLE, or sub-GHz transceivers. The 28-UQFN (4x4 mm) footprint fits inside sensor puck housings.
推荐
LED Lighting Controllers
The PIC16LF15354-E/MV integrates 4x PWM channels and a Complementary Waveform Generator (CWG) that together produce flicker-free LED drive signals and dead-band control for half-bridge MOSFET drivers. The hardware comparator and 5-bit DAC enable closed-loop current regulation for constant-current LED strings. At 32 MHz CPU clock, the device runs PID color-mixing loops well within instruction-cycle timing budgets.
推荐
Capacitive Touch User Interface
With the Core Independent Peripherals (CIPs) and Intelligent Analog suite, the PIC16LF15354-E/MV implements capacitive touch buttons, sliders, and proximity sensing without burdening the CPU. The mTouch peripheral library and CVD (charge-virtual-time) techniques detect electrode capacitance changes through noise-tolerant scanning - ideal for kitchen appliances, consumer remotes, and industrial control panels.
推荐
Battery-Powered Motor Control
The PIC16LF15354-E/MV drives small DC motors, BLDC fans, and stepper drivers via its 4x PWM outputs, hardware comparator for back-EMF sensing, and CWG for half-bridge drive. XLP technology keeps idle power below microamp thresholds between motion events, critical for battery-operated toys, personal care devices, and handheld tools. The 7 KB Flash holds lookup-table-based trapezoidal commutation algorithms.
推荐
Industrial Sensor Hubs
The PIC16LF15354-E/MV aggregates multiple analog sensors over its 10-bit ADC with computation, then bridges to a PLC or industrial bus via UART, SPI, or I2C. The hardware CIPs implement local filtering, debouncing, and thresholding without CPU cycles. The -40C to +125C industrial temperature grade supports factory-floor, HVAC, and outdoor enclosure deployment.
推荐
Consumer Remote Controls
The PIC16LF15354-E/MV runs IR-protocol encoders (RC5, NEC, SIRC) and capacitive-touch button scanning in deep sleep, waking only on key press or IR receive. With XLP technology, the MCU draws nanoamps in sleep while still handling capacitive touch via the CIPs, extending battery life of TV remotes, AC controllers, and presentation clickers to multi-year durations on a single coin cell.
推荐
Small Home Appliances
The PIC16LF15354-E/MV fits the BOM cost target for coffee makers, blenders, slow cookers, and other small appliances. Its motor-control peripherals (PWM, CWG, comparator) drive pumps and fans, while the ADC with computation reads thermistor inputs. The Memory Access Partition (MAP) feature lets a manufacturer ship a single firmware image that supports multiple product SKUs.
推荐
推荐产品汇总
工程参考数据： PIC16LF15354-E/MV ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC16LF15344-E/MV | PIC16LF15355-E/MV | PIC16F15354-E/MV | PIC16F15344-E/MV |
|---|---|---|---|---|---|
| Package | 28-UQFN (4x4 mm) | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 7 KB (4K x 14) | 4 KB (-43%) | 14 KB (+100%) | 7 KB (same) | 4 KB (-43%) |
| SRAM | 512 B | 512 B (same) | 1 KB (+100%) | 512 B (same) | 512 B (same) |
| CPU Speed | 32 MHz (8 MIPS) | 32 MHz (same) | 32 MHz (same) | 32 MHz (same) | 32 MHz (same) |
| Operating Voltage | Low (LF variant) | Low (same) | Low (same) | Standard (higher VDD ceiling) | Standard (higher VDD ceiling) |
| PWM Channels | 4x | 4x (same) | 4x (same) | 4x (same) | 4x (same) |
| XLP Technology | Yes (nanoWatt) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
关键差异点
- Memory Access Partition (MAP) for bootloader protection （对比 PIC16LF15344-E/MV)
- Optimal balance of Flash and cost （对比 PIC16LF15355-E/MV)
- Low-voltage LF variant for battery-powered designs （对比 PIC16F15354-E/MV)
设计说明
The 28-UQFN (4x4 mm) package has an exposed thermal pad that doubles as the device ground. The PCB land pattern must include a center thermal pad with at least 5 thermal vias (0.3 mm drill, 0.5 mm pitch) connecting to a continuous ground plane. Omitting these vias will increase theta_JA significantly, raising junction temperature and degrading ADC accuracy at high ambient temperatures (above 85C).
Place the decoupling capacitor (100 nF X7R) within 2 mm of the VDD pin. Add a 10 uF bulk capacitor near the IC. For ADC accuracy, separate analog and digital VDD traces, and route analog signals away from PWM outputs and clock lines. The exposed thermal pad (EP) must be soldered to the PCB thermal pad with a void-free solder joint for both electrical grounding and thermal dissipation.
Estimated - based on datasheet typical use: when migrating from PIC16F to PIC16LF family, verify that your maximum VDD is below the LF variant's ceiling. The LF variant has a lower VDD max than the F variant; using it above its rating will damage the device. Also confirm that the oscillator configuration bits match the actual crystal or external clock - mismatches cause brown-out resets or unstable operation.
合规信息
RoHS compliant per Microchip product page. 'E' suffix denotes industrial temperature grade (-40C to +125C). The 'MV' suffix indicates the 28-pin UQFN (4x4 mm) leadless package.
