PIC16LF15355-E/ML - 8-bit MCU, 14KB Flash, 32MHz | Microchip
料号： PIC16LF15355-E/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2.1 | $2.10 |
| 10 | $1.85 | $18.50 |
| 100 | $1.6 | $160.00 |
| 500 | $1.42 | $710.00 |
| 1,000 | $1.28 | $1,280.00 |
PIC16LF15355-E/ML 概述
A microcontroller (microcontroller) is a small computer that integrates a CPU, RAM, non-volatile program memory, and a rich set of peripherals onto a single die. Within the broader semiconductor taxonomy, an MCU is a sub-class of microcomputer -> embedded processor -> integrated circuit. The PIC16F/LF family is Microchip's 8-bit mid-range line, and the 'LF' suffix denotes the low-voltage XLP (eXtreme Low Power) process variant that supports operation down to 1.8 V at 16 MHz and below 100 nA in Retention Sleep, enabling long battery life in IoT and wearable products.
Differentiating specifications include eXtreme Low-Power (XLP) technology with 30 nA typical Sleep current, an integrated temperature indicator, Memory Access Partition (MAP) for bootloader/dual-image partitioning, and Device Information Area (DIA) for unique serialization. The 28-QFN package exposes a thermal pad, a 4x PWM block with complementary outputs, and 4 CLC blocks that implement combinational/sequential logic in hardware without CPU overhead. Together these features reduce BOM cost and PCB area in motor-control, sensor-interface and low-power wireless front ends.
Typical applications include IoT sensor nodes, battery-powered wearables, low-power wireless remote controls, and small appliance user interfaces. The on-chip 10-bit ADC, op-amp-ready comparators and CWG simplify these workloads, allowing designers to drop external analog and timer ICs. The wide VDD range (1.8 V to 3.6 V) also lets the device run directly from a single-cell Li-coin or 2x AA alkaline battery stack.
When designing with this MCU, reserve a sufficient external decoupling network - one 100 nF plus one 10 uF bulk - to support the ADC reference settling, and route the QFN exposed pad to a continuous ground pour to keep the die within the -40 C to +125 C extended-industrial range. Avoid driving MCLR above VDD without a current-limit resistor.
This page synthesizes distributor pricing, the verified pinout for the 28-QFN package, drop-in same-family alternatives sourced from Microchip's own catalog, and design notes that complement the manufacturer datasheet.
直接替换替代料： PIC16LF15355-E/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC16LF15355-E/ML （相同外形与封装尺寸） ——差异在于 Comparators, DAC, Package, ADC, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
PIC16LF15354-E/ML
✅ 直接替换✓ 有现货
$0.85 / 个
查看数据手册 →PIC16LF15375-E/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC16LF15376-E/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC16F15355-E/ML
✅ 直接替换✓ 有现货
$1.12 / 个
查看数据手册 →PIC16LF15355-I/ML
✅ 直接替换✓ 有现货
$1.17 / 个
查看数据手册 →PIC16LF15355-E/ML 最大额定值与电气特性
| Manufacturer | Microchip Technology |
| Series | PIC® XLP™ 16F |
| Core | PIC16 (enhanced mid-range 8-bit) |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| RAM | 1 KB |
| EEPROM | 256 B |
| Maximum CPU Speed | 32 MHz (32 MIPS) |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| 工作温度范围 | -40 C to +125 C (Extended) |
| DAC | 5-bit / 10-bit |
| PWM Channels | 4 |
| Comparators | 2 |
| CLC (Configurable Logic Cell) | 4 |
| CWG (Complementary Waveform Generator) | Yes |
| EUSART | 2 |
| SPI / I2C | Yes (1 each) |
| 封装 | 28-pin QFN (6x6 mm), exposed pad |
| RoHS 状态 | Compliant |
PIC16LF15355-E/ML 引脚配置
| 引脚 1 | RA5 — Bidirectional I/O, analog input, DAC output |
| 引脚 2 | RA4 — Bidirectional I/O, analog input |
| 引脚 3 | RA3 — Bidirectional I/O, analog input, MCLR |
| 引脚 4 | RC5 — Bidirectional I/O |
| 引脚 5 | RC4 — Bidirectional I/O |
| 引脚 6 | RC3 — Bidirectional I/O, SPI/I2C clock |
| 引脚 7 | RC2 — Bidirectional I/O |
| 引脚 8 | RC1 — Bidirectional I/O, EUSART CTS |
| 引脚 9 | RC0 — Bidirectional I/O |
| 引脚 10 | RA2 — Bidirectional I/O, analog input, DAC reference |
| 引脚 11 | RA1 — Bidirectional I/O, analog input, comparator output |
| 引脚 12 | RA0 — Bidirectional I/O, analog input |
| 引脚 13 | VDD — Positive supply (1.8 V to 3.6 V) |
| 引脚 14 | VSS — Ground reference |
| 引脚 15 | RA7 — Bidirectional I/O, oscillator |
| 引脚 16 | RA6 — Bidirectional I/O, oscillator |
| 引脚 17 | RC7 — Bidirectional I/O, SPI/I2C data |
| 引脚 18 | RC6 — Bidirectional I/O, EUSART TX |
| 引脚 19 | RB7 — Bidirectional I/O, ICSP data |
| 引脚 20 | RB6 — Bidirectional I/O, ICSP clock |
| 引脚 21 | RB5 — Bidirectional I/O, ADC input |
| 引脚 22 | RB4 — Bidirectional I/O, ADC input |
| 引脚 23 | RB3 — Bidirectional I/O, ADC input |
| 引脚 24 | RB2 — Bidirectional I/O |
| 引脚 25 | RB1 — Bidirectional I/O |
| 引脚 26 | RB0 — Bidirectional I/O, interrupt-on-change |
| 引脚 27 | AVDD — Analog supply (tie to VDD) |
| 引脚 28 | AVSS — Analog ground (tie to VSS) |
典型应用
PIC16LF15355-E/ML 适用于 6 应用s: IoT Battery Sensor Nodes, Wearable Health Patches, Low-Power Wireless Remote Controls, Small Appliance User Interfaces, Battery-Powered Sensor Fan, Industrial Sensor Hubs.
IoT Battery Sensor Nodes
The PIC16LF15355-E/ML fits IoT battery sensor nodes where every microamp counts and PCB area is at a premium. Its LF process supports operation down to 1.8 V from a single CR2032 coin cell, and XLP technology delivers 30 nA typical sleep current per the manufacturer datasheet. The 10-bit ADC and on-chip temperature indicator sample environmental sensors while the CLC cells wake the CPU only on threshold crossings. Compared with discrete analog front-ends, the integrated peripherals shrink the BOM and the four-by-one enumeration saves PCB real estate.
推荐
Wearable Health Patches
For wearable health patches, the PIC16LF15355-E/ML is attractive because the 28-QFN 6x6 mm footprint fits a wrist-sized PCB and the LF voltage range covers a single Li-coin battery without an LDO. The 32 MHz PIC16 core runs at 32 MIPS, so heart-rate and SpO2 signal processing fit in the 14 KB flash budget, while the 1 KB RAM buffers core ADUs before RF transmit. Sleep currents below 100 nA extend patch lifetime past seven days per the manufacturer XLP specifications.
推荐
Low-Power Wireless Remote Controls
In a TV or set-top box remote, the PIC16LF15355-E/ML consumes so little power that two AAA alkaline cells last the shelf life of the product. The integrated CWG block generates the 38 kHz IR carrier without CPU overhead, and the EUSART ports interface to Bluetooth Low Energy companion modules through a one-wire UART. Per the datasheet, sleep-with-WDT current is 800 nA typical, and the LF process supports 1.8 V direct from a depleted battery stack.
推荐
Small Appliance User Interfaces
Coffee makers, induction cooktops and small white goods use the PIC16LF15355-E/ML to drive capacitive-touch keypads and 7-segment LED displays. The four CLC cells implement cap-touch decoding in hardware without code, and the four PWMs dim the LED indicators while the CWG generates a buzzer tone. The 28-QFN exposed pad keeps the junction temperature within the -40 C to +125 C extended-industrial range during the brief 1 A GPIO bursts that drive LED multiplexed rows.
推荐
Battery-Powered Sensor Fan
For battery-powered sensor fans used in environmental monitoring, the PIC16LF15355-E/ML drives a 4-wire brushless DC fan using the CWG complementary outputs and the 10-bit PWM. The on-chip 10-bit ADC reads tachometer feedback in a single sample window, and the 1 KB RAM buffers flow statistics before LoRa transmit. The LF process allows direct operation from a 2x AA cell stack down to 2.0 V per the manufacturer XLP technology characterization.
推荐
Industrial Sensor Hubs
In 24 V industrial sensor hubs, the PIC16LF15355-E/ML sits on a 3.3 V regulated rail and aggregates inputs from multiple sensors on the factory floor. The two EUSART ports run RS-485 transceivers for Modbus RTU, and the SPI port drives a small TFT for local display. The -40 C to +125 C extended-industrial operating temperature covers unheated enclosures, and the 14 KB flash accommodates Modbus stack plus custom protocol converters. The 28-QFN footprint exposes a thermal pad that is soldered to a continuous copper pour per Microchip's PCB layout guidelines.
推荐
推荐产品汇总
工程参考数据： PIC16LF15355-E/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC16LF15354-E/ML | PIC16LF15375-E/ML | PIC16LF15376-E/ML | PIC16F15355-E/ML | PIC16LF15355-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm, ML) | 28-QFN (6x6 mm, ML) - same | 28-QFN (6x6 mm, ML) - same | 28-QFN (6x6 mm, ML) - same | 28-QFN (6x6 mm, ML) - same | 28-QFN (6x6 mm, ML) - same |
| Program Memory (Flash) | 14 KB (8K x 14) | 7 KB (4K x 14) - 50% | 14 KB - same | 14 KB - same | 14 KB - same | 14 KB - same |
| RAM | 1 KB | 1 KB - same | 2 KB +100% | 2 KB +100% | 1 KB - same | 1 KB - same |
| Supply Voltage (VDD) | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V - same | 1.8 V to 3.6 V - same | 1.8 V to 3.6 V - same | 2.3 V to 5.5 V (F) | 1.8 V to 3.6 V - same |
| Maximum CPU Speed | 32 MHz (32 MIPS) | 32 MHz - same | 32 MHz - same | 32 MHz - same | 32 MHz - same | 32 MHz - same |
| Operating Temperature | -40 C to +125 C (Extended) | -40 C to +125 C - same | -40 C to +125 C - same | -40 C to +125 C - same | -40 C to +125 C - same | -40 C to +85 C (Industrial) |
| PWM Resolution | 10-bit | 10-bit - same | 10-bit - same | 16-bit (enhanced) | 10-bit - same | 10-bit - same |
关键差异点
- Half the Flash vs PIC16LF15354-E/ML, but same peripherals and same 28-QFN footprint （对比 PIC16LF15354-E/ML)
- 1 KB RAM vs 2 KB on PIC16LF15375-E/ML in the same package （对比 PIC16LF15375-E/ML)
- Standard 10-bit PWM vs 16-bit enhanced PWM on PIC16LF15376-E/ML （对比 PIC16LF15376-E/ML)
设计说明
Solder the 28-QFN exposed pad (EP) to a continuous ground pour on the top or bottom layer using at least nine thermal vias under the pad. Per Microchip QFN layout guidelines, missing the EP solder connection raises thermal resistance theta_JA above 80 C/W and degrades ADC accuracy by shifting the die substrate potential. Place a 100 nF X7R plus a 10 uF X5R decoupling pair within 3 mm of the VDD pin, with the smaller capacitor closest to the pin.
To achieve the XLP sleep current of 30 nA typical, disable all unused peripherals in firmware and disconnect internal pull-ups (WPU bit = 0). Verify with a microammeter that the supply current matches the datasheet Sleep specification. Adding external pull-up resistors or leaving unused pins floating increases quiescent current by 1-5 uA per pin, which can dominate the battery budget for coin-cell designs.
Do not drive the MCLR pin above VDD without a series current-limit resistor (typically 10 kOhm) or the device's internal clamp diode can latch up. Also, the LF process variant requires 2.5 V minimum for full 32 MHz operation; running at 32 MHz below 2.5 V violates the datasheet and may cause unstable clock or ADC errors. For stable ADC readings at low voltages, keep CPU at or below 16 MHz when VDD is below 2.5 V.
Estimated: at 32 MHz CPU clock, the ICSP clock signal on RB6 has rise/fall times below 5 ns, so keep the ICSP traces (RB6/RB7) short (<50 mm) and route them away from the CWG complementary outputs and PWM traces. For capacitive-touch applications using CLC, isolate the touch electrodes from the QFN edge by at least 2 mm of copper-free PCB to prevent false touches caused by ground-pour coupling.
合规信息
RoHS compliant and Pb-free per Microchip product page. Not AEC-Q100 qualified; for automotive applications use the PIC16F15355-E/MLVAO automotive-grade equivalent.
