PIC16LF1718T-I/MV - 8-bit MCU, 28KB Flash, 10b ADC | Microchip
料号： PIC16LF1718T-I/MV ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1.85 | $1.85 |
| 10 | $1.67 | $16.70 |
| 100 | $1.42 | $142.00 |
| 500 | $1.21 | $605.00 |
| 1,000 | $1.05 | $1,050.00 |
| 3,300 | $0.91 | $3,003.00 |
PIC16LF1718T-I/MV 概述
A PIC microcontroller is an 8-bit RISC Harvard-architecture MCU widely used for embedded control. Within the broader taxonomy it sits at microcontroller -> embedded processor -> integrated circuit. The PIC16F171x family adds intelligent analog features such as on-chip op amps, 5/8-bit DACs, comparators, and Zero Cross Detect to the baseline PIC16 mid-range core, enabling single-chip analog signal conditioning and feedback loops without external components.
Key features include electrical (32 MHz core, 1.8 V to 3.6 V VDD, 10-bit ADC up to 32 channels), low power (XLP sleep currents typically below 100 nA with RTCC retention), peripheral integration (Core Independent Peripherals such as CLC, COG, NCO, and Peripheral Pin Select), and packaging (28-UQFN 4x4 mm with exposed thermal pad). The combination makes the device suitable for space-constrained analog-front-end designs running from coin-cell or Li-ion batteries.
The PIC16LF1718T-I/MV uses Microchip's enhanced mid-range 8-bit core with a 14-bit instruction word, executes most instructions in one cycle, and supports in-circuit debugging via ICD. The 32 MHz internal oscillator eliminates an external crystal in many designs, while the on-chip op amps can be configured for transducer excitation or current sensing. The 28-UQFN package exposes a thermal pad that must be soldered to the board ground pour for specified thermal and electrical performance.
Typical applications include low-power sensor nodes, IoT end-node signal conditioning, battery-powered instrumentation, LED lighting controllers, and small motor-control loops. The wide VDD range and on-chip analog make it a natural fit for thermocouple, RTD, and bridge-sensor front-ends that need to operate for years from a single battery.
Design tip: always stitch the exposed pad of the MV (UQFN-28) package to a continuous ground plane with multiple vias to manage return currents and ensure the rated ADC noise performance. When migrating from the F (5 V) variant to the LF (1.8 V min) variant, confirm that analog and digital peripherals are configured for the lower VDD - some rail-to-rail specifications are reduced at 1.8 V.
This page synthesizes real distributor pricing and stock data, drop-in alternatives from the PIC16F/LF171x family and cross-brand MCUs, and practical design notes that go beyond the manufacturer datasheet. All pricing references are listed as of 2026-09-23.
直接替换替代料： PIC16LF1718T-I/MV ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC16LF1718T-I/MV （相同外形与封装尺寸） ——差异在于 Package, DAC, ADC, Operating Temperature, Program Memory (Flash).
快速对比工具——选择替代料号进行并排对比：
PIC16F1718T-I/MV
✅ 直接替换✓ 有现货
$1.18 / 个
查看数据手册 →PIC16LF1719-I/MV
✅ 直接替换📋 参考替代料（不在目录中）
PIC16LF1718-I/MV
✅ 直接替换📋 参考替代料（不在目录中）
PIC16LF1718-E/MV
✅ 直接替换✓ 有现货
$1.55 / 个
查看数据手册 →PIC16LF15355-I/MV
✅ 直接替换✓ 有现货
$1.05 / 个
查看数据手册 →PIC16LF1718T-I/MV 最大额定值与电气特性
| Core | PIC16 enhanced mid-range 8-bit RISC |
| Program Memory (Flash) | 28 KB (16K x 14 words) |
| Data RAM | 2 KB |
| Data EEPROM | 256 bytes |
| Maximum CPU Frequency | 32 MHz |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| ADC | 10-bit, up to 32 channels |
| DAC | 5-bit and 8-bit on-chip |
| On-chip Op Amps | Yes (configurable) |
| Comparators | Yes |
| Core Independent Peripherals | CLC, COG, NCO, Zero Cross Detect |
| Peripheral Pin Select (PPS) | Yes |
| Timers | 5 (8-bit and 16-bit) |
| PWM Outputs | Yes (CCP/ECCP) |
| Communication | I2C, SPI, EUSART |
| 封装 | 28-UQFN (4x4 mm) with exposed pad |
| 工作温度 | -40C to +85C (Industrial "I") |
| 安装类型 | Surface Mount (Tape & Reel) |
| MSL 等级 | MSL1 |
| RoHS 状态 | Compliant |
PIC16LF1718T-I/MV 引脚配置
| 引脚 1 | RA5 — GPIO / analog / ICSPCLK |
| 引脚 2 | RA4 — GPIO / analog |
| 引脚 3 | RA3 — GPIO / analog / MCLR |
| 引脚 4 | RA2 — GPIO / analog / DAC |
| 引脚 5 | RA1 — GPIO / analog / OPA1IN- |
| 引脚 6 | RA0 — GPIO / analog / OPA1OUT |
| 引脚 7 | VSS — Ground |
| 引脚 8 | VDD — Positive supply |
| 引脚 9 | RB7 — GPIO / ICSPDAT |
| 引脚 10 | RB6 — GPIO / PGC |
| 引脚 11 | RB5 — GPIO / analog |
| 引脚 12 | RB4 — GPIO / analog |
| 引脚 13 | RB3 — GPIO / analog |
| 引脚 14 | RB2 — GPIO / analog |
| 引脚 15 | RB1 — GPIO / analog |
| 引脚 16 | RB0 — GPIO / analog / interrupt-on-change |
| 引脚 17 | RC7 — GPIO / EUSART RX |
| 引脚 18 | RC6 — GPIO / EUSART TX |
| 引脚 19 | RC5 — GPIO / PWM |
| 引脚 20 | RC4 — GPIO / SDA |
| 引脚 21 | RC3 — GPIO / SCL |
| 引脚 22 | RC2 — GPIO / PWM |
| 引脚 23 | RC1 — GPIO / CCP |
| 引脚 24 | RC0 — GPIO |
| 引脚 25 | RD7 — GPIO / analog |
| 引脚 26 | RD6 — GPIO / analog |
| 引脚 27 | RD5 — GPIO / analog |
| 引脚 28 | RD4 — GPIO / analog |
典型应用
PIC16LF1718T-I/MV 适用于 6 应用s: Battery-Powered Sensor Node, Industrial Sensor Conditioning, LED Lighting Controller, Portable Medical Monitoring, Automotive Body Electronics, Smart Home Edge Node.
Battery-Powered Sensor Node
The PIC16LF1718T-I/MV is well suited for battery-powered wireless sensor nodes that must run for years from a coin cell or 2xAA pack. Its 1.8 V minimum VDD removes the need for a boost converter, and the XLP sleep current stays below 100 nA with RTCC retention, letting duty-cycled sensor reads and radio transmissions dominate energy use. The on-chip 10-bit ADC up to 32 channels and integrated op amps allow direct bridge-sensor or thermocouple signal conditioning on the same die, eliminating separate analog front-end ICs. The 28 KB Flash comfortably holds sensor-fusion routines, calibration tables, and a lightweight protocol stack such as Modbus RTU or a proprietary 868/915 MHz MAC.
推荐
Industrial Sensor Conditioning
The PIC16LF1718T-I/MV's integrated op amps, 5/8-bit DACs, comparators, and Zero Cross Detect make it a strong fit for industrial 4-20 mA loop or 0-10 V sensor signal conditioning. The op amps can be configured as front-end gain stages for bridge pressure or load cells, while the DAC sets excitation or bias. CLC and COG Core Independent Peripherals offload glue logic from the core, enabling deterministic response to overcurrent or fault conditions without CPU intervention. The 1.8 V to 3.6 V VDD range also supports 3.3 V industrial rails directly, simplifying power-tree design.
推荐
LED Lighting Controller
The PIC16LF1718T-I/MV drives multi-channel LED lighting controllers that need PWM mixing, color-temperature blending, or smooth dimming curves. The CCP/ECCP peripherals produce complementary or dead-band PWM suitable for high-power LED driver stages, while CLC cells can implement zero-cross-detect dimming for TRIAC compatibility without CPU overhead. The on-chip 8-bit DAC can generate reference levels for analog dimming channels, and the small 28-UQFN 4x4 mm footprint fits inside MR16 or linear LED tube form factors where PCB real estate is scarce.
推荐
Portable Medical Monitoring
The PIC16LF1718T-I/MV fits portable medical and wellness devices such as pulse oximeters, glucose meters, and temperature patches where low power and small footprint outweigh raw CPU throughput. Its XLP operation at 1.8 V allows direct Li-ion or single-use alkaline battery use, while the 10-bit ADC and on-chip op amps can digitize photodiode or thermistor signals without external components. PPS lets the designer remap peripherals to avoid noisy ADC-capable pins when routing the analog front-end, improving measurement stability in body-worn applications.
推荐
Automotive Body Electronics
The PIC16LF1718T-I/MV's 28-UQFN footprint and Core Independent Peripherals map well to automotive body modules - seat controllers, mirror adjusters, ambient lighting, and HVAC damper drivers. CLC, COG, and NCO allow logic, PWM, and waveform synthesis to run independently of the core, freeing CPU cycles for LIN or CAN-style communication. Designers should validate AEC-Q100 qualification with the Microchip automotive datasheet revision and consider AEC-Q100 qualified siblings from the PIC16F1718 family for production automotive programs.
推荐
Smart Home Edge Node
The PIC16LF1718T-I/MV operates as a low-cost smart-home edge node that aggregates switch, occupancy, and environmental sensor data before forwarding over UART, SPI, or I2C to a host processor. Its PPS lets designers reassign EUSART, SPI, and I2C to any digital pin, simplifying PCB routing on tight multi-layer boards. The XLP sleep current below 100 nA supports battery-operated window/door sensors that must last 5+ years on a coin cell, and the 32 MHz core can wake, sample, encrypt, and transmit in milliseconds before re-entering sleep.
推荐
推荐产品汇总
工程参考数据： PIC16LF1718T-I/MV ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC16F1718T-I/MV | PIC16LF1719-I/MV | PIC16LF1718-I/MV | PIC16LF1718-E/MV | PIC16LF15355-I/MV |
|---|---|---|---|---|---|---|
| Package | 28-UQFN (4x4 mm) MV | 28-UQFN (4x4 mm) MV - same | 28-UQFN (4x4 mm) MV - same | 28-UQFN (4x4 mm) MV - same | 28-UQFN (4x4 mm) MV - same | 28-UQFN (4x4 mm) MV - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Flash | 28 KB | 28 KB | 40 KB | 28 KB | 28 KB | 14 KB |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 1 KB |
| VDD Range | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C |
| Packaging | Tape & Reel (3300) | Tape & Reel | Tray | Tray | Tube | Tube |
| Core Family | PIC16 enhanced mid-range | PIC16 enhanced mid-range | PIC16 enhanced mid-range | PIC16 enhanced mid-range | PIC16 enhanced mid-range | PIC16LF newer core |
关键差异点
- XLP 1.8 V minimum VDD operation （对比 PIC16F1718T-I/MV)
- Industrial -40C to +85C temperature with LF process （对比 PIC16LF1718-E/MV)
- Larger Flash density with same footprint （对比 PIC16LF15355-I/MV)
设计说明
Estimated: the 28-UQFN MV package exposes a thermal pad that MUST be soldered to a continuous ground pour with at least 4 thermal vias (0.3 mm drill, 0.6 mm pitch) to meet the ADC noise and thermal specifications quoted in the PIC16F1718 datasheet (DS40001700D). Failing to stitch the pad to ground can degrade ADC ENOB by 1-2 LSB and lift die temperature under sustained PWM load. Place the decoupling 100 nF X7R capacitor within 3 mm of VDD pin 8 and keep analog traces away from PWM outputs on RC1/RC2/RC5.
Estimated: when migrating from PIC16F1718 (5 V) to PIC16LF1718T-I/MV (1.8 V to 3.6 V), check that analog rail-to-rail specifications still meet design margin. Some PIC16LF op amp and ADC parameters at VDD = 1.8 V are reduced compared to 3.3 V operation - the datasheet's electrical characteristics tables specify the derated values. If the application targets 5 V only, stay on the PIC16F1718T-I/MV variant to avoid re-validation cost.
Configure unused I/O as outputs with logic low rather than inputs to minimise current draw in XLP sleep modes. Each floating input can add 1-5 uA of leakage in deep sleep. For RA3/MCLR, ensure the pull-up configuration matches the chosen programming/debug mode - external MCLR reset on RA3 conflicts with ICSP programming. Verify the PPS configuration maps only valid functions to each pin, since illegal mappings silently revert to GPIO on some PIC16F171x revisions.
合规信息
RoHS compliant per Microchip product page. AEC-Q100 grade not indicated in the I-suffix marking - validate against automotive datasheet revision for AEC-Q100 projects.
