PIC16LF18855-E/MV - 8-Bit MCU, 14KB Flash, 32MHz | Microchip
料号： PIC16LF18855-E/MV ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2.1 | $2.10 |
| 10 | $1.89 | $18.90 |
| 100 | $1.65 | $165.00 |
| 500 | $1.42 | $710.00 |
| 1,000 | $1.18 | $1,180.00 |
PIC16LF18855-E/MV 概述
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory, volatile data memory, and configurable peripherals on one die. PIC microcontrollers use a Harvard RISC architecture with separate program and data buses, executing one instruction per cycle (excluding branches) which yields deterministic throughput and predictable interrupt latency. This part belongs to the broader PIC16F188xx family of mid-range 8-bit MCUs that target sensor interfacing, human-machine interfaces, and battery-powered edge nodes.
Key features include 25 digital I/O pins, peripheral touch controller support, a 10-bit ADC with computation (ADC2), a 5-bit DAC, Core Independent Peripherals (CIPs) such as CRC/SCAN and Hardware Limit Timer (HLT), windowed watchdog timer (WWDT), and the Data Stream Modulator (DSM) peripheral. Microchip's eXtreme Low-Power (XLP) technology provides nanoWatt sleep currents suitable for Energy Harvesting and always-on sensor duty-cycled applications.
The device is fabricated in CMOS technology and integrates eXtreme Low-Power techniques, including deep sleep modes with peripheral retention, a dedicated 32kHz LF oscillator, and a Windowed Watchdog Timer (WWDT) for safety-critical applications. Its deterministic instruction execution makes it suitable for real-time control loops, while CIPs offload repetitive tasks from the CPU.
Typical applications include IoT sensor nodes with battery or energy harvesting power, low-power wireless sensor networks using protocols such as LoRa or Sub-GHz, industrial automation controllers with safety-integrity requirements, automotive body and interior lighting modules, consumer appliance control boards, and medical wearable monitors. The 4x4mm UQFN package is well-suited to space-constrained PCB layouts.
When selecting this part, ensure your toolchain supports MPLAB X IDE with XC8 compiler, and consider the exposed thermal pad requirement for PCB land pattern. Designers should also evaluate the PIC16LF18855-I/MV variant for higher-volume production if the -E (extended) temperature grade is not required.
This page consolidates distributor pricing, same-family drop-in alternatives, and practical design notes that synthesize the datasheet into a single-source reference for procurement and design engineers.
直接替换替代料： PIC16LF18855-E/MV ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC16LF18855-E/MV （相同外形与封装尺寸） ——差异在于 ADC, DAC, Operating Temperature, Package, Core Architecture.
快速对比工具——选择替代料号进行并排对比：
PIC16LF18855-I/MV
✅ 直接替换📋 参考替代料（不在目录中）
PIC16LF18855-E/ML
✅ 直接替换✓ 有现货
$1.05 / 个
查看数据手册 →PIC16F18855-E/MV
✅ 直接替换📋 参考替代料（不在目录中）
PIC16LF18854-E/MV
✅ 直接替换✓ 有现货
$1.05 / 个
查看数据手册 →PIC16LF18855-E/MV 最大额定值与电气特性
| Core Architecture | PIC16 8-bit RISC |
| Program Memory | 14 KB (8K x 14) Flash |
| Data RAM | 1 KB |
| Data EEPROM | 256 bytes |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage Range | 1.8 V to 3.6 V |
| Digital I/O Pins | 25 |
| ADC | 10-bit with Computation (ADC2) |
| DAC | 5-bit |
| 封装 | 28-UQFN (4x4 mm) with Exposed Pad |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +125C (Extended, -E suffix) |
| Low-Power Technology | XLP (eXtreme Low Power) |
| Core Independent Peripherals | CRC/SCAN, HLT, WWDT, DSM |
PIC16LF18855-E/MV 引脚配置
| 引脚 1 | VDD — Positive supply voltage |
| 引脚 2 | RA7 — Bidirectional I/O with interrupt and DAC output |
| 引脚 3 | RA6 — Bidirectional I/O with interrupt and DAC output |
| 引脚 4 | RA5 — Bidirectional I/O with interrupt, ADC input, DAC |
| 引脚 5 | RA4 — Bidirectional I/O with interrupt and ADC input |
| 引脚 6 | RA3 — Bidirectional I/O with interrupt and ADC input |
| 引脚 7 | RA2 — Bidirectional I/O with interrupt and DAC output |
| 引脚 8 | VSS — Ground reference |
| 引脚 9 | RA1 — Bidirectional I/O with interrupt, ADC input, DAC |
| 引脚 10 | RA0 — Bidirectional I/O with interrupt and ADC input |
| 引脚 11 | RC7 — Bidirectional I/O, EUSART RX |
| 引脚 12 | RC6 — Bidirectional I/O, EUSART TX |
| 引脚 13 | RC5 — Bidirectional I/O with interrupt |
| 引脚 14 | RC4 — Bidirectional I/O with interrupt |
| 引脚 15 | RC3 — Bidirectional I/O with interrupt and PWM |
| 引脚 16 | RC2 — Bidirectional I/O with interrupt and PWM |
| 引脚 17 | RC1 — Bidirectional I/O with interrupt and PWM |
| 引脚 18 | RC0 — Bidirectional I/O with interrupt |
| 引脚 19 | RB7 — Bidirectional I/O with interrupt |
| 引脚 20 | RB6 — Bidirectional I/O with interrupt and ICD |
| 引脚 21 | RB5 — Bidirectional I/O with interrupt and ADC |
| 引脚 22 | RB4 — Bidirectional I/O with interrupt and ADC |
| 引脚 23 | RB3 — Bidirectional I/O with interrupt and ADC |
| 引脚 24 | RB2 — Bidirectional I/O with interrupt and ADC |
| 引脚 25 | RB1 — Bidirectional I/O with interrupt and ADC |
| 引脚 26 | RB0 — Bidirectional I/O with interrupt |
| 引脚 27 | VSS — Ground reference |
| 引脚 28 | VDD — Positive supply voltage |
典型应用
PIC16LF18855-E/MV 适用于 6 应用s: Battery-Powered IoT Sensor Nodes, Industrial Automation Controllers, Automotive Body and Interior Modules, Consumer Appliance Control Boards, Low-Power Wireless Sensor Networks, Medical Wearable Health Monitors.
Battery-Powered IoT Sensor Nodes
The PIC16LF18855-E/MV is engineered for IoT sensor nodes operating from coin-cell or 2xAA batteries. The XLP nanoWatt sleep modes deliver typical currents below 100 nA with full RAM retention and peripheral wake from interrupt, while the 10-bit ADC2 with Computation offloads sensor threshold checks from the CPU. With 14KB Flash sufficient for LoRaWAN or Sub-GHz stacks and the 28-UQFN fitting on a 5x5mm PCB footprint, this MCU enables multi-year node lifetime on a single CR2032.
推荐
Industrial Automation Controllers
The PIC16LF18855-E/MV fits compact industrial control modules such as analog front-end aggregators, valve drivers, and panel meters. The Device Information Area (DIA) stores calibration constants, the Windowed Watchdog Timer (WWDT) detects software faults, and CRC/SCAN computes memory integrity checks. The -40C to +125C extended temperature grade handles factory-floor environments. The 28-UQFN package requires a small PCB land pattern, ideal for miniaturized DIN-rail-mount controllers.
推荐
Automotive Body and Interior Modules
The PIC16LF18855-E/MV (or its AEC-Q100-qualified sibling) targets automotive body controllers for seat adjusters, mirror modules, lighting controllers, and HVAC blend-door drivers. The Peripheral Touch Controller (PTC) interfaces with capacitive switches, while the Hardware Limit Timer (HLT) implements hardware-only overcurrent/overvoltage detection without CPU intervention. CAN/LIN support via the EUART and CCP/ECCP peripherals enables body-network connectivity. The 28-UQFN fits behind miniature switch bezels.
推荐
Consumer Appliance Control Boards
The PIC16LF18855-E/MV drives main control boards in white-goods, kitchen appliances, and HVAC thermostats. Its mTouch PTC enables sleek touch-button interfaces without mechanical keys, the 10-bit ADC2 reads thermistor temperature sensors with averaging and oversampling, and the 5-bit DAC controls LED brightness directly. The CRC/SCAN peripheral performs safety integrity checks required by IEC 60730 Class B compliance for unattended appliance operation.
推荐
Low-Power Wireless Sensor Networks
The PIC16LF18855-E/MV is a strong choice for end nodes in Sub-GHz, LoRa, or proprietary wireless sensor networks where battery replacement costs dominate. Sleep currents under 100nA extend node lifetime past 5 years on 2xAA cells. The MSSP peripheral interfaces with popular Sub-GHz transceivers over SPI, while the Device Information Area stores unique network keys securely without external EEPROM. The exposed pad on the 28-UQFN provides RF ground reference and thermal dissipation for the radio companion.
推荐
Medical Wearable Health Monitors
The PIC16LF18855-E/MV can serve wearable health monitor wearables such as continuous glucose monitoring patches, pulse oximeters, and activity trackers. The XLP nanoWatt sleep between sensor readings limits average current consumption to single-digit microamps, while the 10-bit ADC2 with Computation filters noisy biopotential signals on-chip. The 28-UQFN 4x4mm package allows wristband integration, and the JTAG/ICSP debug interface accelerates firmware validation against IEC 62304 medical-device lifecycle requirements.
推荐
推荐产品汇总
工程参考数据： PIC16LF18855-E/MV ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC16LF18855-I/MV | PIC16LF18855-E/ML | PIC16F18855-E/MV | PIC16LF18854-E/MV |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-UQFN (4x4) | 28-UQFN (4x4) - same footprint | 28-QFN (6x6) - different footprint | 28-UQFN (4x4) - same footprint | 28-UQFN (4x4) - same footprint |
| Flash Memory | 14 KB | 14 KB | 14 KB | 14 KB | 7 KB (-50%) |
| Data RAM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| Operating Voltage | 1.8V to 3.6V | 1.8V to 3.6V | 1.8V to 3.6V | 2.3V to 5.5V (extended) | 1.8V to 3.6V |
| Maximum Clock | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Digital I/O Pins | 25 | 25 | 25 | 25 | 25 |
| Temperature Grade | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +125C (Extended) |
| ADC Resolution | 10-bit ADC2 | 10-bit ADC2 | 10-bit ADC2 | 10-bit ADC2 | 10-bit ADC2 |
| Data EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
关键差异点
- Highest-density 4x4mm package option for the PIC16F18855 family （对比 PIC16LF18855-E/ML)
- Industrial extended temperature grade for outdoor/harsh environments （对比 PIC16LF18855-I/MV)
- Extended voltage range to 5.5V for legacy industrial buses （对比 PIC16F18855-E/MV)
- Larger Flash memory (14KB) with full CIP peripheral set （对比 PIC16LF18854-E/MV)
设计说明
The 28-UQFN (4x4 mm) package requires a properly sized exposed pad (EP) land pattern that must be soldered to a corresponding copper pour on the top layer. The EP should connect to VSS through at least 4 thermal vias to the inner/ground plane. Without the EP soldered, the device will not dissipate heat correctly and the VSS connection may float, causing erratic behavior. Microchip's package drawing in the datasheet provides recommended land pattern dimensions.
Place a 100nF X7R decoupling capacitor as close as physically possible to each VDD pin (pins 1 and 28). Add a bulk 1uF to 10uF capacitor near the MCU for handling peak current demands during internal Flash programming. For battery-powered designs, route VDD through a ferrite bead to suppress noise from RF peripherals and prevent supply collapse during TX/RX events.
Estimated: At 32MHz operation, the device requires VDD >= 2.3V; below this threshold the CPU frequency is derated and code will execute incorrectly. Do not enable the internal 32MHz HF oscillator before verifying VDD is in spec. Also, when migrating from PIC16LF18855 to PIC16F18855, verify that your VDD range covers 2.3V-5.5V; legacy designs running at 3.3V are unaffected, but those using 5V rails need the F variant only.
合规信息
Standard -E (extended) grade is not AEC-Q100 qualified; for AEC-Q100 automotive applications, source the PIC16F18855-E/MVVAO or PIC16LF18855-E/MVVAO automotive-grade part number from Microchip. RoHS and lead-free compliance per Microchip product environmental compliance program.
