PIC18F1320-H/P - 8KB Flash 25MHz 8-bit MCU | Microchip
料号： PIC18F1320-H/P ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.5 | $4.50 |
| 10 | $4.05 | $40.50 |
| 100 | $3.6 | $360.00 |
| 500 | $3.24 | $1,620.00 |
| 1,000 | $2.88 | $2,880.00 |
PIC18F1320-H/P 概述
Key features include Microchip's nanoWatt Technology with six software-controlled power-managed modes that reduce standby current to as low as 0.1 microamp, and an internal oscillator option that eliminates the need for an external crystal in cost-sensitive designs. The device integrates CCP/ECCP modules, an enhanced USART, an MSSP module for SPI and I2C, and a 10-bit ADC with up to 7 channels. Self-programmability under firmware control, an ICD debug interface, and on-chip debugging support streamline field updates and reduce bill-of-materials cost.
Architecturally, the PIC18F1320 uses an enhanced Harvard RISC core with a hardware multiply routine and 31-level hardware stack, distinguishing it from earlier PIC16 architectures by offering C-compiler-friendly 16-bit instruction words. The 8KB Flash is organized as 4K x 16 words, allowing efficient code density for control loops, sensor processing, and consumer appliances. nanoWatt Technology is the umbrella term for the six sleep, doze, and run modes that orchestrate clock gating, peripheral shutdown, and dynamic oscillator switching under software control.
Typical applications include battery-powered sensor nodes, consumer appliances, low-cost motor control with the ECCP module, USB-to-serial bridges using the USART with an external transceiver, automotive interior accessories in the -40C to +85C range, and industrial control panels that benefit from self-programmability for field firmware upgrades. The internal oscillator option reduces part count and BOM cost in sealed, factory-calibrated products.
When designing with this device, ensure decoupling with a 0.1uF ceramic capacitor placed as close as possible to VDD/VSS, and respect the 5.5V absolute maximum on VDD to prevent latch-up. The 'H' suffix indicates the -40C to +85C industrial temperature range rather than the -40C to +125C extended range of the I-suffix parts; verify the operating envelope before selecting this variant.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not typically found in the manufacturer datasheet alone, giving engineers a fast path from specification to bill-of-materials.
直接替换替代料： PIC18F1320-H/P ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC18F1320-H/P （相同外形与封装尺寸） ——差异在于 Mounting Type, Oscillator, Package, Standby Current.
快速对比工具——选择替代料号进行并排对比：
PIC18F1220-H/P
✅ 直接替换📋 参考替代料（不在目录中）
PIC18F1320-I/P
✅ 直接替换📋 参考替代料（不在目录中）
PIC18F1320-H/P 最大额定值与电气特性
| Core | PIC18 8-bit RISC |
| Program Memory (Flash) | 8 KB (4K x 16) |
| RAM | 256 bytes |
| EEPROM | 256 bytes |
| Max CPU Frequency | 25 MHz |
| Supply Voltage (VDD) | 2.0 V to 5.5 V |
| 工作温度 | -40C to +85C (Industrial, 'H' suffix) |
| Digital I/O Pins | 16 |
| ADC | 10-bit, up to 7 channels |
| 封装 | 18-pin PDIP (0.300 inch / 7.62 mm) |
| Oscillator | Internal and external support |
| Power-Managed Modes | 6 (nanoWatt Technology) |
| Standby Current | as low as 0.1 uA |
| Peripherals | CCP/ECCP, EUSART, MSSP (SPI/I2C) |
| 安装类型 | Through-Hole |
| RoHS 状态 | Compliant |
| MSL 等级 | Not Applicable (through-hole) |
PIC18F1320-H/P 引脚配置
| 引脚 1 | RA2/AN2/VREF- — Bidirectional I/O, ADC input, ADC negative reference |
| 引脚 2 | RA3/AN3/VREF+ — Bidirectional I/O, ADC input, ADC positive reference |
| 引脚 3 | RA4/AN4 — Bidirectional I/O, ADC input, also open-drain option |
| 引脚 4 | RA5/MCLR/VPP — Master Clear reset (input) or programming voltage (input) |
| 引脚 5 | VSS — Ground reference |
| 引脚 6 | RA0/AN0 — Bidirectional I/O, ADC input |
| 引脚 7 | RA1/AN1 — Bidirectional I/O, ADC input |
| 引脚 8 | RB0/INT0 — Bidirectional I/O, external interrupt 0 |
| 引脚 9 | RB1/INT1 — Bidirectional I/O, external interrupt 1 |
| 引脚 10 | RB2/INT2 — Bidirectional I/O, external interrupt 2 |
| 引脚 11 | RB3/CCP1 — Bidirectional I/O, Capture/Compare/PWM output |
| 引脚 12 | RB4 — Bidirectional I/O, interrupt-on-change |
| 引脚 13 | RB5 — Bidirectional I/O, interrupt-on-change |
| 引脚 14 | RB6/PGC — Bidirectional I/O, ICSP clock |
| 引脚 15 | RB7/PGD — Bidirectional I/O, ICSP data |
| 引脚 16 | VDD — Positive supply voltage (2.0V to 5.5V) |
| 引脚 17 | OSC1 — Crystal oscillator input or external clock input |
| 引脚 18 | OSC2 — Crystal oscillator output |
典型应用
PIC18F1320-H/P 适用于 6 应用s: Battery-Powered Sensor Nodes, Consumer Appliance Control, USB-to-Serial Bridge / Cable Replacement, Low-Cost Motor Control (DC and Stepper), Educational / Hobbyist Prototyping, Automotive Interior Accessories.
Battery-Powered Sensor Nodes
The PIC18F1320-H/P's nanoWatt Technology with standby current as low as 0.1 uA makes it ideal for battery-powered sensor nodes that sleep for months and wake intermittently. Operating from 2.0V to 5.5V supports direct 3.3V Li-coin-cell or two-AA battery power. The 8 KB Flash holds sensor calibration and protocol stacks, the 10-bit ADC handles up to 7 analog channels, and the internal oscillator eliminates the external crystal in cost-sensitive designs, reducing BOM and PCB area.
推荐
Consumer Appliance Control
The PIC18F1320-H/P's ECCP module, 16 I/O pins, and self-programmability make it a strong fit for cost-sensitive consumer appliances such as coffee makers, fans, and small kitchen devices. The 8 KB Flash stores menu logic and calibration, while the on-chip 10-bit ADC reads keypad or sensor inputs. Reducing product cycles, the device offers dual-speed startup, internal oscillator for minimal BOM, and AC cycle timing via the EUSART.
推荐
USB-to-Serial Bridge / Cable Replacement
The PIC18F1320-H/P's EUSART module with hardware flow control and the MSSP's SPI mode are well suited for a USB-to-UART bridge when paired with an external USB transceiver. The 8 KB Flash holds the CDC bridge firmware and protocol descriptors, while the 25 MHz core provides ample throughput for 115.2 kbaud UART plus full-speed USB 1.1 HID traffic. Self-programmability enables in-field driver updates, and nanoWatt modes extend laptop battery life when the bridge is idle.
推荐
Low-Cost Motor Control (DC and Stepper)
The PIC18F1320-H/P's ECCP module supports PWM, complementary outputs, and dead-band control for brushed DC and unipolar stepper motors at low power (under 1A). Operating at 25 MHz with hardware multiply and a 31-level stack makes the device capable of trapezoidal commutation loops, while nanoWalt Technology allows idle phases to drop standby current to 0.1 uA for battery-driven toys and pumps. Industrial -40C to +85C rating supports garage-door and HVAC damper actuators.
推荐
Educational / Hobbyist Prototyping
The PIC18F1320-H/P's 18-pin PDIP through-hole package, industry-standard ICSP programming interface, and free MPLAB X toolchain make it a favorite in university curricula and hobbyist projects. The 8 KB Flash comfortably fits bootloader plus student projects, the internal oscillator avoids crystal-handling errors, and the ICD debug interface supports in-circuit debugging with the PICkit 3 or 4. The 16 available I/O line up with common breakout boards such as Arduino-shield clones.
推荐
Automotive Interior Accessories
Within the -40C to +85C industrial range, the PIC18F1320-H/P can drive non-safety automotive interior accessories such as ambient lighting controllers, seat-heater switches, and HVAC knob decoders. The 10-bit ADC reads potentiometer or thermistor inputs for climate feedback, ECCP drives LED strings via PWM, and the EUSART interfaces with vehicle CAN bridges or LIN transceivers. For under-hood -40C to +125C applications, upgrade to the I-suffix variant with the same die and footprint.
推荐
推荐产品汇总
工程参考数据： PIC18F1320-H/P ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC18F1220-H/P | PIC18F1320-I/P | PIC18F1320-H/SS |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | PDIP-18 | PDIP-18 (same) | PDIP-18 (same) | SSOP-20 (different) |
| Program Memory (Flash) | 8 KB | 4 KB | 8 KB | 8 KB |
| RAM | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Max CPU Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C |
| ECCP Module | Yes | No (CCP only) | Yes | Yes |
| Standby Current (nanoWatt) | as low as 0.1 uA | as low as 0.1 uA | as low as 0.1 uA | as low as 0.1 uA |
关键差异点
- Doubles program memory versus PIC18F1220 （对比 PIC18F1220-H/P)
- Industrial temperature range matches automotive interior （对比 PIC18F1320-I/P)
- Through-hole PDIP for hand-prototyping and repair （对比 PIC18F1320-H/SS)
设计说明
Place a 0.1 uF ceramic bypass capacitor directly between VDD (pin 16) and VSS (pin 5), with leads less than 5 mm long to suppress high-frequency switching noise from the internal oscillator. Add a 10 uF bulk capacitor on the same rail if the supply source is more than 25 mm away. For battery applications driving high-current peripherals, monitor the BOR (Brown-Out Reset) threshold so the device does not enter undefined states as VDD droops below 2.0V.
Although the internal oscillator supports 31 kHz to 8 MHz without external components, an external crystal on OSC1/OSC2 (pins 17, 18) is recommended for UART baud-rate stability above 38.4 kbaud at room temperature. Configure the OSCCON register to switch between internal LF and HF modes via software; never leave OSCTUNE in default state for production units because factory-trimmed values are calibrated only at one frequency.
Do not confuse the H-suffix (-40C to +85C) with the I-suffix (-40C to +125C) when this device is used in under-hood or industrial-extended applications; the H variant will fail thermal verification. Always tie MCLR (pin 4) high through a 10 kohm pull-up to VDD, and place the ICSP programming connector so that the 6-pin header does not share analog traces, or analog readings will skew during debug sessions. Disable unused peripherals in firmware to fully benefit from nanoWatt Technology standby current.
For through-hole 18-pin PDIP layouts, use a standard 0.300 inch row spacing with 1 mm through-hole pads for hand-prototyping and repair. Reserve a 6-pin ICSP header footprint (typically a 2x3 0.1 inch header) connected to PGC/PGD/MCLR/VDD/VSS for in-circuit debugging without removing the device. Keep analog ADC traces short and away from the ECCP PWM signals, or place a ground guard ring around the analog pins RA0-RA5 to minimize crosstalk.
合规信息
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified because the H-suffix industrial range targets non-safety applications; for AEC-Q100 automotive, use PIC18F1320-I/P in qualified designs.
