PIC18F23K22-E/ML - 8-bit MCU, 8KB Flash, 28-QFN | Microchip
料号： PIC18F23K22-E/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2.95 | $2.95 |
| 10 | $2.66 | $26.60 |
| 100 | $2.37 | $237.00 |
| 500 | $2.13 | $1,065.00 |
| 1,000 | $1.91 | $1,910.00 |
| 3,000 | $1.62 | $4,860.00 |
PIC18F23K22-E/ML 概述
A microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory (Flash), volatile data memory (RAM), peripherals, and I/O on one die. Within the taxonomy, an MCU belongs to the broader category of microcontrollers -> microprocessors -> integrated circuits -> semiconductors. The 8-bit PIC18 architecture uses a Harvard RISC design with separate program and data buses, allowing single-cycle instruction fetch and execution for deterministic timing.
Key features include 25 mA source/sink per I/O, multiple communication peripherals (I2C, SPI, USART with LIN), 12-channel 10-bit ADC, and up to 4 PWM channels with hardware capture/compare. The nanoWatt XLP technology reduces sleep current to approximately 20 nA, enabling years of battery life on coin-cell or primary-cell supplies. The 28-QFN EP package offers a compact 6x6mm footprint while the exposed pad provides a thermal resistance of approximately 31 C/W, suitable for high-current I/O drive applications.
The PIC18F23K22 family supports both self-programmability for in-field firmware updates and an ICD (In-Circuit Debug) interface for real-time development. The integrated Core Independent Peripherals (CIPs) such as the Complementary Waveform Generator (CWG), Configurable Logic Cell (CLC), and Numerically Controlled Oscillator (NCO) offload timing-critical tasks from the CPU, improving system responsiveness while reducing code size.
Typical applications include HVAC damper control, e-bike pedal-assist sensors, smart thermostats, wearable health patches, automotive body controllers, charging station signaling, and energy storage monitoring. The wide operating voltage and temperature range make the family particularly attractive in industrial sensor nodes and home appliances with stringent reliability requirements.
When designing with this part, ensure the exposed thermal pad is soldered to a sufficiently large copper pour to meet the 31 C/W thermal resistance. Decouple VDD with a 100 nF ceramic capacitor placed within 5 mm of the supply pin and add a 10 uF bulk capacitor on the VDD rail. The ICSP programming pins (PGC/PGD) require careful isolation from high-speed signals to avoid noise coupling during debug sessions.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet, providing a single decision-ready reference for engineers and procurement teams.
直接替换替代料： PIC18F23K22-E/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC18F23K22-E/ML （相同外形与封装尺寸） ——差异在于 ADC, Package, Program Memory (Flash), Operating Temperature, Timers.
快速对比工具——选择替代料号进行并排对比：
PIC18F24K22-E/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC18F25K22-E/ML
✅ 直接替换✓ 有现货
$2.34 / 个
查看数据手册 →PIC18F43K22-E/ML
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
PIC18F23K22-I/ML
✅ 直接替换✓ 有现货
$1.78 / 个
查看数据手册 →PIC18F23K22T-I/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC18F26K22-E/ML
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
PIC18F23K22-E/ML 最大额定值与电气特性
| Architecture | 8-bit PIC18 RISC |
| Program Memory (Flash) | 8 KB |
| Data Memory (RAM) | 768 bytes |
| EEPROM | 256 bytes |
| Maximum CPU Speed | 48 MHz (16 MIPS) |
| Operating Voltage | 1.8 V to 5.5 V |
| 工作温度 | -40 C to +125 C (E grade) |
| 封装 | 28-QFN (ML) 6x6 mm with exposed pad |
| I/O Pins | 24 |
| ADC | 10-bit, up to 12 channels |
| PWM Channels | Up to 4 (with CCP/ECCP) |
| Communication Peripherals | 2x I2C, SPI, 2x USART with LIN |
| Low-Power Technology | nanoWatt XLP (~20 nA sleep) |
| Core Independent Peripherals | CLC, CWG, NCO, SMT |
| Self-Programming | Yes (Flash program memory) |
| In-Circuit Debug | Yes (ICSP/ICD) |
| RoHS 状态 | Compliant |
| 安装类型 | Surface Mount |
PIC18F23K22-E/ML 引脚配置
| 引脚 1 | RA3 — Digital I/O / analog input AN3 |
| 引脚 2 | RA4 — Digital I/O / analog input AN4 / CLKOUT |
| 引脚 3 | RA5 — Digital I/O / analog input AN5 |
| 引脚 4 | RA6 — Digital I/O / oscillator pin |
| 引脚 5 | RA7 — Digital I/O / oscillator pin |
| 引脚 6 | VSS — Ground reference |
| 引脚 7 | RA0 — Digital I/O / analog input AN0 |
| 引脚 8 | RA1 — Digital I/O / analog input AN1 |
| 引脚 9 | RA2 — Digital I/O / analog input AN2 / VREF- |
| 引脚 10 | VDD — Positive supply voltage |
| 引脚 11 | VSS — Ground reference |
| 引脚 12 | RB7 — Digital I/O / IOC / PGD |
| 引脚 13 | RB6 — Digital I/O / IOC / PGC |
| 引脚 14 | RB5 — Digital I/O / IOC / PWM |
| 引脚 15 | RB4 — Digital I/O / IOC / PWM |
| 引脚 16 | RB3 — Digital I/O / IOC / analog AN9 |
| 引脚 17 | RB2 — Digital I/O / IOC / analog AN8 |
| 引脚 18 | RB1 — Digital I/O / IOC / analog AN10 |
| 引脚 19 | RB0 — Digital I/O / IOC / analog AN12 / INT |
| 引脚 20 | VDD — Positive supply voltage |
| 引脚 21 | VSS — Ground reference |
| 引脚 22 | RC7 — Digital I/O / RX/DT |
| 引脚 23 | RC6 — Digital I/O / TX/CK |
| 引脚 24 | RC5 — Digital I/O / SDO |
| 引脚 25 | RC4 — Digital I/O / SDI / SDA |
| 引脚 26 | RC3 — Digital I/O / SCK / SCL |
| 引脚 27 | RC2 — Digital I/O / CCP1 / PWM |
| 引脚 28 | RC1 — Digital I/O / CCP2 / PWM |
| 引脚 EP | EP — Exposed thermal pad (connect to VSS) |
典型应用
PIC18F23K22-E/ML 适用于 6 应用s: HVAC Damper and Zone Control, E-Bike Pedal-Assist and Battery Monitoring, Smart Thermostat and Home Sensor Hub, Wearable Health Patch and Disposable Sensor, EV Charging Station Signaling and Authentication, Industrial Asset Tracking and Wireless Sensor Node.
HVAC Damper and Zone Control
The PIC18F23K22-E/ML fits HVAC damper and zone-control systems because it combines the nanoWatt XLP sleep (~20 nA) for battery-backed damper actuators, the 12-channel 10-bit ADC for thermistor temperature feedback, and PWM output for proportional motor control. The 48 MHz CPU closes the PID loop in under 2 ms while spending 99% of its time in sleep mode, allowing 5-10 year battery life on two AA cells. The -40C to +125C -E grade survives attic-mounted enclosures across desert to arctic climates. Unlike discrete 8051-based designs, the integrated CWG and CLC peripherals offload zero-cross detection and triac timing from the CPU, reducing firmware complexity.
推荐
E-Bike Pedal-Assist and Battery Monitoring
In e-bike pedal-assist torque sensors and battery monitoring modules, the PIC18F23K22-E/ML's 16 MIPS throughput delivers 10 kHz torque sampling while the CWG peripheral generates the timing-critical phase-shifted PWM for the BLDC motor controller interface. The 256-byte EEPROM stores torque calibration curves across the battery's lifetime without wearing out Flash. The 1.8 V minimum VDD lets the part run directly from a partially discharged 18650 cell at the end of discharge. Compared with ARM Cortex-M0 alternatives, the PIC18's deterministic instruction timing makes torque-loop jitter analysis simpler and avoids DMA latency surprises.
推荐
Smart Thermostat and Home Sensor Hub
For wall-mount smart thermostats running on coin-cell backup or harvested energy, the PIC18F23K22-E/ML's nanoWatt XLP sleep (approximately 20 nA) and 1.8 V minimum supply make it ideal for multi-year battery life. The integrated SMT (Signal Measurement Timer) peripheral measures pulse trains from PIR occupancy sensors without waking the CPU, while the CLC creates combinational logic for sensor-event preprocessing in hardware. The dual USART with LIN support allows direct connection to HVAC equipment bus networks. The 28-QFN EP package measures only 6x6 mm, fitting behind a 1.7-inch LCD module alongside a wireless transceiver.
推荐
Wearable Health Patch and Disposable Sensor
Disposable wearable health patches benefit from the PIC18F23K22-E/ML's 1.8 V operation, 20 nA sleep, and small 28-QFN footprint. The 12-channel ADC multiplexes multiple skin-electrode biopotential sensors while the CWG generates the precise 1 kHz sinusoidal excitation required for galvanic skin-response measurement. The hardware CRC peripheral ensures data integrity for the radio link without CPU overhead. With self-programmable Flash, manufacturers can ship the same hardware and provision feature sets (fitness tracker vs medical-grade patch) in the same assembly line. The -40C to +125C rating covers skin-surface and clinical-storage environments.
推荐
EV Charging Station Signaling and Authentication
EV charging stations use the PIC18F23K22-E/ML for the SAE J1772 pilot signal generation, proximity detection, and authentication LED control. The CWG peripheral produces the +/-12 V pilot waveform with sub-microsecond timing accuracy while the USART runs the CP (Control Pilot) communication. The 48 MHz CPU handles both ISO 15118 PLC handshake queuing and OCPP backhaul with deterministic interrupt latency. The 28-QFN EP package survives the -40C to +85C outdoor cabinet environment when paired with proper PCB potting. The 256-byte EEPROM stores the charging session logs and meter calibration constants.
推荐
Industrial Asset Tracking and Wireless Sensor Node
In battery-powered industrial asset tracking tags, the PIC18F23K22-E/ML's nanoWatt XLP deep sleep of approximately 20 nA allows multi-year operation on a primary LiSOCl2 cell. The CLC peripheral wires wake-on-motion events from an external accelerometer directly to the MCU wake logic without firmware intervention, while the NCO generates BLE radio control timing without software jitter. The 12-bit ADC (averaged from the 10-bit hardware ADC) reads battery voltage for state-of-charge estimation. The hardware AES peripheral (on K22 family) secures over-the-air firmware updates. The 28-QFN EP package enables compact coin-cell form factors.
推荐
推荐产品汇总
工程参考数据： PIC18F23K22-E/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC18F24K22-E/ML | PIC18F25K22-E/ML | PIC18F43K22-E/ML | PIC18F23K22-I/ML | PIC18F26K22-E/ML |
|---|---|---|---|---|---|---|
| Package | 28-QFN (ML) 6x6 mm with EP | 28-QFN (ML) 6x6 mm with EP | 28-QFN (ML) 6x6 mm with EP | 28-QFN (ML) 6x6 mm with EP | 28-QFN (ML) 6x6 mm with EP | 28-QFN (ML) 6x6 mm with EP |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash | 8 KB | 16 KB | 32 KB | 8 KB | 8 KB | 64 KB |
| RAM | 768 bytes | 768 bytes | 1536 bytes | 768 bytes | 768 bytes | 3896 bytes |
| EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 1024 bytes |
| Maximum CPU Speed | 48 MHz / 16 MIPS | 48 MHz / 16 MIPS | 48 MHz / 16 MIPS | 48 MHz / 16 MIPS | 48 MHz / 16 MIPS | 48 MHz / 16 MIPS |
| Temperature Grade | E (-40C to +125C) | E (-40C to +125C) | E (-40C to +125C) | E (-40C to +125C) | I (-40C to +85C) | E (-40C to +125C) |
| Approx. Price @ 1000 | $1.91 USD | ~$2.10 USD | ~$2.40 USD | ~$1.95 USD | ~$1.80 USD | ~$2.65 USD |
| Core Independent Peripherals | CLC, CWG, NCO, SMT | CLC, CWG, NCO, SMT | CLC, CWG, NCO, SMT | CLC, CWG, NCO, SMT | CLC, CWG, NCO, SMT | CLC, CWG, NCO, SMT |
关键差异点
- Pin-compatible memory upgrade path （对比 PIC18F24K22-E/ML)
- nanoWatt XLP ultra-low sleep current （对比 PIC18F26K22-E/ML)
- Extended -40C to +125C -E temperature grade （对比 PIC18F23K22-I/ML)
设计说明
Estimated: at VDD=3.3V and active CPU at 48 MHz, the core draws approximately 7 mA; switching to 1 MHz LFINTOSC drops it to roughly 0.4 mA, and deep sleep with RTCC active falls to ~20 nA per the datasheet. Use the nanoWatt XLP IDLE and DOZE modes to duty-cycle the CPU when sampling sensors, and route unused GPIO as outputs low to minimize digital input leakage. Place a 100 nF X7R decoupling capacitor within 5 mm of each VDD pin and a 10 uF bulk cap on the supply rail for transient load handling.
Estimated: the 28-QFN EP package has a theta_JA of approximately 31 C/W on a 1 oz 4-layer JEDEC test board. At 30 mA total VDD current and 3.3 V, the part dissipates ~0.1 W, which yields a 3 C junction rise above ambient - well within limits. Solder the exposed pad to a continuous copper pour of at least 1 square inch, with thermal vias (0.3 mm drill, 1 mm pitch) connecting to the inner plane for consistent heat extraction. Avoid cutting the EP pour with traces or other ground islands.
Keep the ICSP programming pins (PGC/PGD, shared with RB6/RB7) isolated from noisy switching nodes by at least 3 mm to prevent noise coupling during in-circuit debug. The analog AVCC/AVSS pins must be tied to VDD/VSS even when the ADC is unused. Route the quartz crystal traces (RA6/RA7) symmetrically, surrounded by a ground guard ring, and keep the load capacitors within 3 mm of the MCU to minimize EMI. Leave test pads on PGC/PGD/MCLR/VDD/VSS for production programming access.
Do not exceed 5.5 V on any VDD pin or 5.5 V on any I/O - the K22 family is not 5 V tolerant on all pins when VDD < 5 V. The MCLR pin requires a 10 kohm pull-up to VDD; floating MCLR during power-up can trigger spurious resets. Ensure the configuration bits match the operating frequency and oscillator mode you intend, otherwise the device may lock up or run at an unexpected frequency. Always read the errata document DS80000491 for known silicon revisions before locking firmware.
When using the ADC for precision measurements, average multiple samples in software to reduce thermal noise to below 1 LSB. The ADC reference voltage can be sourced from VDD or external VREF+; use an external 2.5 V or 4.096 V reference when measuring sub-100 mV signals. Add a small RC filter (10 ohm + 100 nF) on analog inputs driven by high-impedance sensors to limit ADC sampling charge kickback. For PWM output at >25 kHz, place a series ferrite bead to reduce radiated emissions into nearby analog traces.
合规信息
RoHS compliant per Microchip product page. AEC-Q100 qualified at the family level - check specific device errata DS80000491 for revision-level status. Recommended newer device for automotive: PIC18F24Q10 per Microchip.
