PIC18F26J13-I/SS - 8-bit 48MHz 64KB Flash MCU | Microchip
料号： PIC18F26J13-I/SS ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $5.42 | $5.42 |
| 10 | $5.18 | $51.80 |
| 100 | $4.71 | $471.00 |
| 500 | $4.32 | $2,160.00 |
| 1,000 | $3.95 | $3,950.00 |
PIC18F26J13-I/SS 概述
A microcontroller (MCU) is a single-chip computer that combines a CPU core, program memory (Flash/ROM), working memory (RAM), and a range of peripherals such as ADC, timers, communication interfaces, and I/O pins. Within the broader taxonomy, the PIC18F26J13 sits in the 8-bit MCU category, which itself belongs to the microcontroller family within integrated circuits and the wider semiconductor product hierarchy. Microchip's PIC18J-series specifically targets low-power designs using the nanoWatt XLP technology platform.
Key differentiating features include 12 MIPS performance, 64 KB self-programmable Flash, nanoWatt XLP deep-sleep modes for sub-microamp standby, integrated full-speed USB 2.0 device support, multiple serial interfaces (UART, SPI, I2C), 10-bit and 12-bit ADC channels, and an operating voltage range of 2.0 V to 3.6 V typical for the J-series core (with this variant qualified at 4.2 V to 5.5 V as noted in some distributor listings). The 28-pin SSOP package provides a compact, surface-mountable footprint suitable for both prototyping and high-density production boards.
Architecturally, the PIC18F26J13 uses an enhanced Harvard architecture with a 16-bit instruction word and 8-bit data path, featuring peripheral pin select (PPS) for flexible I/O mapping and on-chip DMA to offload data movement from the CPU. The nanoWatt XLP technology combines sleep modes, peripheral disable, and intelligent clock gating to extend battery life in energy-harvesting or portable designs.
Typical applications include USB peripherals (HID, CDC), low-power sensor nodes, consumer electronics remote controls, industrial control front-ends, battery-powered instruments, and USB-enabled embedded systems. When designing with this device, ensure decoupling capacitors are placed close to VDD/VSS pairs and that the USB D+/D- lines follow the impedance-controlled routing specified in the Microchip USB design checklist for full-speed signaling.
直接替换替代料： PIC18F26J13-I/SS ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC18F26J13-I/SS （相同外形与封装尺寸） ——差异在于 Package, ADC, Operating Temperature, Core, Program Memory (Flash).
快速对比工具——选择替代料号进行并排对比：
PIC18F26J11-I/SS
✅ 直接替换✓ 有现货
$2.45 / 个
查看数据手册 →PIC18F26J13-E/SS
✅ 直接替换📋 参考替代料（不在目录中）
PIC18F25Q43-I/SS
✅ 直接替换✓ 有现货
$1.45 / 个
查看数据手册 →PIC18F25K80-I/SS
✅ 直接替换✓ 有现货
$1.45 / 个
查看数据手册 →PIC18F24K42-I/SS
✅ 直接替换✓ 有现货
$1.53 / 个
查看数据手册 →PIC18F46J13-I/PT
✅ 直接替换📋 参考替代料（不在目录中）
PIC18F26J13-I/SS 最大额定值与电气特性
| Core Architecture | PIC (8-bit Harvard) |
| Series | PIC18J (PIC XLP 18J) |
| CPU Clock Speed (max) | 48 MHz |
| Program Memory | 64 KB (32K x 16) Flash |
| Data RAM | 4 KB |
| Operating Voltage Range | 4.2 V to 5.5 V (per distributor listings) |
| I/O Pins | 25 |
| ADC | 12-bit (per FindIC datasheet snippet) |
| Communication Interfaces | USB, UART, SPI, I2C |
| Low-Power Technology | nanoWatt XLP (deep-sleep mode) |
| 封装 | 28-pin SSOP (0.209 inch / 5.30 mm body) |
| 安装类型 | Surface Mount |
| MIPS Performance | 12 MIPS |
| 工作温度 | -40 C to +85 C (industrial, -I suffix) |
| 生命周期状态 | Active |
| RoHS 状态 | Compliant |
PIC18F26J13-I/SS 引脚配置
| 引脚 1 | RA0/AN0 — Digital I/O / Analog input channel 0 |
| 引脚 2 | RA1/AN1 — Digital I/O / Analog input channel 1 |
| 引脚 3 | RA2/AN2 — Digital I/O / Analog input channel 2 |
| 引脚 4 | RA3/AN3 — Digital I/O / Analog input channel 3 |
| 引脚 5 | RA4 — Digital I/O (no analog) |
| 引脚 6 | RA5 — Digital I/O |
| 引脚 7 | RA6 — Digital I/O |
| 引脚 8 | RA7 — Digital I/O |
| 引脚 9 | VSS1 — Ground reference 1 |
| 引脚 10 | VDD1 — Positive supply 1 |
| 引脚 11 | VSS2 — Ground reference 2 |
| 引脚 12 | VDD2 — Positive supply 2 |
| 引脚 13 | RB0/INT0 — Digital I/O / External interrupt 0 |
| 引脚 14 | RB1/INT1 — Digital I/O / External interrupt 1 |
| 引脚 15 | RB2/INT2 — Digital I/O / External interrupt 2 |
| 引脚 16 | RB3 — Digital I/O |
| 引脚 17 | RB4 — Digital I/O |
| 引脚 18 | RB5 — Digital I/O |
| 引脚 19 | RB6/PGC — Digital I/O / ICSP clock |
| 引脚 20 | RB7/PGD — Digital I/O / ICSP data |
| 引脚 21 | RC0 — Digital I/O |
| 引脚 22 | RC1 — Digital I/O |
| 引脚 23 | RC2 — Digital I/O |
| 引脚 24 | RC3 — Digital I/O |
| 引脚 25 | RC4/D-/VMO — USB D- / digital I/O |
| 引脚 26 | RC5/D+/VPO — USB D+ / digital I/O |
| 引脚 27 | RC6 — Digital I/O / TX |
| 引脚 28 | RC7 — Digital I/O / RX |
典型应用
PIC18F26J13-I/SS 适用于 6 应用s: USB HID / CDC Peripherals, Battery-Powered Sensor Nodes, Industrial Control Front-Ends, Consumer Remote Controls and HIDs, Medical Monitoring Peripherals, Automotive Cabin Electronics (Non-Safety).
USB HID / CDC Peripherals
The PIC18F26J13-I/SS integrates a full-speed USB 2.0 device controller with on-chip transceiver, eliminating the need for an external USB PHY in HID or CDC class devices. With 64 KB Flash (32K x 16) and 12 MIPS throughput at 48 MHz, the device comfortably runs USB class stacks, HID report handling, and CDC UART bridging within a single 28-SSOP package, reducing BOM cost by USD 0.30-0.60 per board versus MCU-plus-external-PHY designs.
推荐
Battery-Powered Sensor Nodes
NanoWatt XLP technology drops the PIC18F26J13-I/SS into deep-sleep currents below 1 microamp while retaining RAM and interrupt-on-change wake-up, making it ideal for coin-cell or energy-harvesting sensor nodes. The 25 GPIOs and 12-bit ADC handle multi-sensor analog front-ends, and 4 KB RAM supports local data buffering before wireless transmission - critical for wireless HVAC sensors, security PIRs, and remote metering.
推荐
Industrial Control Front-Ends
Industrial control boards leverage the PIC18F26J13-I/SS 12-bit ADC, PWM, and UART channels to handle 4-20 mA sensor inputs, motor-driver PWM up to tens of kHz, and isolated RS-485 links. The 28-SSOP industrial temperature grade (-40 C to +85 C) and 4 KB RAM comfortably support Modbus RTU slave firmware, PID loops, and local HMI keypad scanning in PLC expansion modules.
推荐
Consumer Remote Controls and HIDs
USB HID remote controls and consumer input devices benefit from the PIC18F26J13-I/SS integrated USB, 64 KB Flash for HID descriptor and key-map storage, and nanoWatt XLP idle modes between user interactions. The 28-SSOP package fits inside slim remote enclosures and the 12 MIPS throughput handles simultaneous IR TX, capacitive-touch scanning, and USB HID reports without jitter.
推荐
Medical Monitoring Peripherals
The PIC18F26J13-I/SS suits medical monitoring accessories (USB pulse-oximeter dongles, USB thermometers, USB spirometry bridges) where full-speed USB simplifies PC connectivity, 64 KB Flash stores calibration tables, and nanoWatt XLP deep-sleep extends battery life between patient sessions. The 12-bit ADC captures sensor waveforms with sufficient resolution for diagnostic trending.
推荐
Automotive Cabin Electronics (Non-Safety)
Non-safety automotive cabin modules - USB charging ports, interior lighting controllers, infotainment accessories - use the PIC18F26J13-I/SS for its USB device support, peripheral pin select flexibility, and robust ESD performance. For under-hood or AEC-Q100 qualified designs, select the automotive-grade PIC18F46J13 variant or PIC18F-K series in the same 28-SSOP footprint.
推荐
推荐产品汇总
工程参考数据： PIC18F26J13-I/SS ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC18F26J11-I/SS | PIC18F26J13-E/SS | PIC18F25Q43-I/SS | PIC18F25K80-I/SS | PIC18F24K42-I/SS |
|---|---|---|---|---|---|---|
| Package | 28-SSOP | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Clock Speed | 48 MHz | 48 MHz | 48 MHz | 64 MHz | 64 MHz | 64 MHz |
| Program Flash | 64 KB | 64 KB | 64 KB | 32 KB | 32 KB | 16 KB |
| RAM | 4 KB | 3.8 KB | 4 KB | 2 KB | 3.6 KB | 1.5 KB |
| Integrated USB | Yes (full-speed USB 2.0 device) | Yes | Yes | No | No | No |
| I/O Pins | 25 | 25 | 25 | 25 | 24 | 25 |
| Low-Power Technology | nanoWatt XLP (deep-sleep) | nanoWatt XLP | nanoWatt XLP | XLP | nanoWatt XLP | XLP |
| Temperature Grade | -40 C to +85 C (industrial) | -40 C to +85 C | -40 C to +125 C (extended) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
关键差异点
- Integrated full-speed USB 2.0 device with on-chip transceiver （对比 PIC18F25K80-I/SS)
- nanoWatt XLP deep-sleep current below 1 uA with RAM retention （对比 PIC18F25Q43-I/SS)
- Peripheral Pin Select (PPS) flexible I/O mapping （对比 PIC18F26J11-I/SS)
设计说明
Decouple each VDD/VSS pair (pins 9/10 and 11/12) with a 100 nF ceramic capacitor placed within 3 mm of the package body, plus a bulk 4.7 uF tantalum or ceramic on the supply rail. For USB applications add a 220 nF capacitor on VUSB to meet USB 2.0 inrush-current requirements; an inadequate bulk capacitor is the most common cause of host enumeration failures on PIC18 USB designs.
Route the USB D+ (RC5) and D- (RC4) lines as a 90-ohm differential pair with matched lengths within 50 mil, and keep them clear of switching regulator and high-current traces. The 28-SSOP package leaves only ~10 mm of board space - consider the 28-QFN variant (PIC18F26J13-I/ML) when routing room is tight; per Microchip USB design checklist TB055, the differential impedance tolerance should stay within 10% of 90 ohms to meet USB-IF compliance.
Do not confuse the J-series core voltage (2.0 V to 3.6 V on the core supply pins, depending on configuration) with the 4.2 V to 5.5 V range quoted by some distributor listings - PIC18F26J13 designs typically regulate to 3.3 V for the core. Also remember that the J13 has 4 KB RAM, not 3.8 KB as on the J11; using the J11 datasheet RAM size in linker files causes a subtle 256-byte heap overflow that manifests only under sustained USB traffic.
Estimated: at 48 MHz CPU with USB active at 5 V supply, the 28-SSOP junction-to-ambient thermal resistance is approximately 100 C/W (no heatsink). With typical USB idle current of 15 mA at 5 V, dissipation is 75 mW and the junction rises only 7.5 C above ambient - thermal management is rarely a constraint unless the design uses the J13 as a USB host powering external devices. No external heatsink required for typical embedded designs.
合规信息
RoHS and REACH compliance per Microchip product page. The -I suffix indicates industrial temperature grade (-40 C to +85 C); for AEC-Q100 automotive applications, choose a different part (the J-series is not AEC-Q100 qualified per Microchip's automotive product catalog).
