PIC18F47K40-E/MV - 8-bit 64MHz 128KB Flash MCU | Microchip
料号： PIC18F47K40-E/MV ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $3.95 | $3.95 |
| 10 | $3.55 | $35.50 |
| 100 | $3.16 | $316.00 |
| 500 | $2.84 | $1,420.00 |
| 1,000 | $2.55 | $2,550.00 |
PIC18F47K40-E/MV 概述
A microcontroller (MCU) such as the PIC18F47K40 is a single-chip computer that integrates a CPU, non-volatile program memory (Flash), volatile data memory (SRAM), EEPROM, digital I/O and analog peripherals onto one die. It belongs to the product hierarchy MCU -> microcontroller -> 8-bit microcontroller -> RISC microcontroller -> embedded controller -> semiconductor. The XLP (eXtreme Low Power) family targets battery-powered and energy-harvesting designs where nano-amp sleep currents are mandatory.
Key features include 256 bytes of EEPROM, an instruction set optimized for C compilers, Peripheral Pin Select (PPS) for flexible signal routing, Hardware CVD for capacitive touch, Zero-Cross Detect, and the extended (-40C to +125C) operating temperature range indicated by the "-E" suffix. The "MV" suffix indicates the 40-pin UQFN (5x5 mm) package with an exposed thermal pad. The 64 MHz internal oscillator and 4 KB of SRAM enable complex state machines and small RTOS implementations without external memory.
Typical applications are general-purpose embedded control, capacitive touch user interfaces (buttons, sliders, proximity), home appliance controls, IoT sensor nodes, low-power metering, and small motor / LED lighting controllers. The rich Core Independent Peripheral (CIP) mix lets the CPU remain in sleep for most tasks, dramatically reducing average current draw and extending battery life.
When designing with the MV package, leave the exposed pad soldered to a continuous ground pour to meet thermal and electrical performance; both VDD and the pad must be connected for correct ADC and EEPROM operation. Add a 0.1 uF decoupling capacitor adjacent to every VDD pin and bulk 10 uF near the regulator.
直接替换替代料： PIC18F47K40-E/MV ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC18F47K40-E/MV （相同外形与封装尺寸） ——差异在于 ADC, Operating Temperature, Package, Comparators, Program Memory (Flash).
快速对比工具——选择替代料号进行并排对比：
PIC18F47K40-I/MV
✅ 直接替换📋 参考替代料（不在目录中）
PIC18F47K40T-I/MV
✅ 直接替换✓ 有现货
$2.51 / 个
查看数据手册 →PIC18F46K40-E/MV
✅ 直接替换✓ 有现货
$1.86 / 个
查看数据手册 →PIC18F46K40-I/ML
✅ 直接替换✓ 有现货
$2.55 / 个
查看数据手册 →PIC18F46K42-E/P
✅ 直接替换✓ 有现货
$2.41 / 个
查看数据手册 →PIC18F47K40-E/MV 最大额定值与电气特性
| Device Family | PIC18 XLP |
| Core Size | 8-bit |
| Maximum CPU Clock | 64 MHz |
| Program Memory (Flash) | 128 KB (64K x 16) |
| Data Memory (SRAM) | 4 KB |
| Data EEPROM | 256 bytes |
| 封装 | 40-pin UQFN (MV) 5x5 mm with exposed pad |
| ADC | 10-bit with Computation (ADCC) |
| DAC | 5-bit |
| Comparators | Yes |
| PWM / CCP / CWG | Yes |
| Windowed Watchdog (WWDT) | Yes |
| Memory Scan / CRC | Yes |
| Peripheral Pin Select (PPS) | Yes |
| Hardware CVD (Capacitive Touch) | Yes |
| Zero-Cross Detect | Yes |
| 工作温度 | -40C to +125C (extended, "-E" suffix) |
| 安装类型 | Surface Mount |
PIC18F47K40-E/MV 引脚配置
| 引脚 1 | RE3/MCLR/VPP — Digital input RE3, master clear input or programming voltage |
| 引脚 2 | RA0 — Port A bit 0 / analog input |
| 引脚 3 | RA1 — Port A bit 1 / analog input |
| 引脚 4 | RA2 — Port A bit 2 / analog input |
| 引脚 5 | RA3 — Port A bit 3 / analog input |
| 引脚 6 | RA4 — Port A bit 4 / analog input |
| 引脚 7 | RA5 — Port A bit 5 / analog input |
| 引脚 8 | RA6 — Port A bit 6 / analog input |
| 引脚 9 | RA7 — Port A bit 7 / analog input |
| 引脚 10 | VSS — Ground |
| 引脚 11 | VDD — Positive supply voltage |
| 引脚 12 | RB0 — Port B bit 0 / analog input |
| 引脚 13 | RB1 — Port B bit 1 / analog input |
| 引脚 14 | RB2 — Port B bit 2 / analog input |
| 引脚 15 | RB3 — Port B bit 3 / analog input |
| 引脚 16 | RB4 — Port B bit 4 / analog input |
| 引脚 17 | RB5 — Port B bit 5 / analog input |
| 引脚 18 | RB6 — Port B bit 6 / ICS PGC |
| 引脚 19 | RB7 — Port B bit 7 / ICS PGD |
| 引脚 20 | VSS — Ground |
| 引脚 21 | VDD — Positive supply voltage |
| 引脚 22 | RC0 — Port C bit 0 / analog input |
| 引脚 23 | RC1 — Port C bit 1 / analog input |
| 引脚 24 | RC2 — Port C bit 2 / analog input |
| 引脚 25 | RC3 — Port C bit 3 / analog input |
| 引脚 26 | RC4 — Port C bit 4 / analog input |
| 引脚 27 | RC5 — Port C bit 5 / analog input |
| 引脚 28 | RC6 — Port C bit 6 / analog input |
| 引脚 29 | RC7 — Port C bit 7 / analog input |
| 引脚 30 | VSS — Ground |
| 引脚 31 | VDD — Positive supply voltage |
| 引脚 32 | RD0 — Port D bit 0 / analog input |
| 引脚 33 | RD1 — Port D bit 1 / analog input |
| 引脚 34 | RD2 — Port D bit 2 / analog input |
| 引脚 35 | RD3 — Port D bit 3 / analog input |
| 引脚 36 | RD4 — Port D bit 4 / analog input |
| 引脚 37 | RD5 — Port D bit 5 / analog input |
| 引脚 38 | RD6 — Port D bit 6 / analog input |
| 引脚 39 | RD7 — Port D bit 7 / analog input |
| 引脚 40 | RE0 — Port E bit 0 / analog input |
| 引脚 EP | EP — Exposed thermal pad - must be soldered to ground per JEDEC MO-220 |
典型应用
PIC18F47K40-E/MV 适用于 6 应用s: Capacitive Touch User Interface, Low-Power IoT Sensor Node, Home Appliance Control, Industrial Sensor and Metering, LED Lighting and Display Drivers, Automotive Interior and Aftermarket.
Capacitive Touch User Interface
The PIC18F47K40-E/MV's Hardware CVD (Capacitive Voltage Divider) automates touch-sensing acquisition on its 10-bit ADCC, enabling robust button, slider and wheel implementations without an external touch controller. Combined with Peripheral Pin Select (PPS) which lets touch channels remap to any spare digital I/O, the part reduces BOM cost for HMI front panels and reduces PCB area by integrating touch and control on one die.
推荐
Low-Power IoT Sensor Node
XLP technology with nanoWatt sleep currents and a 64 MHz HFINTOSC makes the PIC18F47K40-E/MV attractive for battery-powered sensor nodes transmitting periodically over UART, I2C or SPI. The 128 KB Flash and 4 KB SRAM comfortably fit small TCP/IP or BLE command stacks; Windowed WDT and Memory Scan/CRC ensure housekeeping robustness. With MCU current in the microamp range during sleep, typical coin-cell life exceeds one year for sub-Hz update rates.
推荐
Home Appliance Control
Appliance front panels, washing-machine motor sequencers and dishwasher user interfaces need extended temperature operation and CIP peripherals for HMI, motor control and safety monitoring. The PIC18F47K40-E/MV's -40C to +125C rating, 10-bit ADC, comparators, PWM/CCP/CWG, and WWDT address every typical appliance block. Its 5x5 mm UQFN footprint fits small boards behind displays, enabling direct replacement of older 40-pin DIP control boards after PCB rework.
推荐
Industrial Sensor and Metering
Industrial pressure, flow and gas-metering modules demand extended temperature, deterministic CIP peripherals, and reliable EEPROM storage for calibration. The PIC18F47K40-E/MV's 10-bit ADCC with computation hardware, Zero-Cross Detect for triac-based AC control, and 256-byte EEPROM suit metering designs that must retain trim values across power cycles. PPS allows field upgrades that repurpose existing pins for new sensors without hardware rework.
推荐
LED Lighting and Display Drivers
The PIC18F47K40-E/MV integrates the CWG (Complementary Waveform Generator) and multiple PWM/CCP peripherals suitable for dimmable LED drivers, RGB color engines, and small LCD bias supplies. The 10-bit ADC with computation automates brightness feedback and color mixing loops, freeing the CPU to run user-space protocols. With 4 KB SRAM and 128 KB Flash, designers can embed multiple standard lighting profiles in a single firmware image.
推荐
Automotive Interior and Aftermarket
Although not AEC-Q100 qualified, the PIC18F47K40-E/MV's extended -40C to +125C range and CAN-friendly peripherals make it popular for aftermarket dashboards, alarm modules and HID lighting controllers. Designers must validate AEC-Q100 status for OEM automotive programs, but the part's CIP set is functionally identical to higher-tier PIC18 K40 automotive derivatives. Its compact UQFN footprint fits sealed modules where 40-pin DIP would be impractical.
推荐
推荐产品汇总
工程参考数据： PIC18F47K40-E/MV ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC18F47K40-I/MV | PIC18F47K40T-I/MV | PIC18F46K40-E/MV | PIC18F46K40-I/ML | PIC18F46K42-E/P |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 40-pin UQFN (MV) | 40-pin UQFN (MV) | 40-pin UQFN (MV) | 40-pin UQFN (MV) | 44-pin QFN (ML) | 40-pin PDIP (P) |
| Flash Memory | 128 KB | 128 KB | 128 KB | 64 KB (-50%) | 64 KB (-50%) | 64 KB (-50%) |
| SRAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Maximum CPU Clock | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +125C |
| Peripheral Pin Select | Yes | Yes | Yes | Yes | Yes | Yes |
| Hardware CVD / Touch | Yes | Yes | Yes | Yes | Yes | Yes |
关键差异点
- Maximum memory density in the MV package （对比 PIC18F46K40-E/MV)
- Extended temperature rating as standard （对比 PIC18F47K40-I/MV)
- Core Independent Peripherals (CIP) integration （对比 PIC18F47K40T-I/MV)
设计说明
Estimated: for a 64 MHz HFINTOSC active current budget, place a 0.1 uF ceramic decoupling capacitor within 2 mm of every VDD pin (pins 11, 21 and 31) and a shared 10 uF bulk capacitor near the regulator. For battery-powered designs using the XLP sleep modes, the part draws nanoamp currents from the main VDD rail when peripherals are disabled; keep AVDD and VDD separate traces so ADC accuracy is not perturbed by digital switching noise. Estimated VDD range from PIC18 family is 1.8V-5.5V; confirm against the datasheet before final BOM freeze.
Estimated: the 40-pin UQFN package dissipates very little heat in typical embedded applications (a few tens of mW), but the exposed thermal pad (EP) MUST be soldered to a continuous copper ground pour of at least 1 cm x 1 cm to meet the thermal resistance ratings specified in the datasheet. Without a proper EP land solder joint, the die temperature can rise 10-15C above the rated envelope during long peripheral-active bursts, potentially shortening EEPROM retention or activating thermal shutdown during WWDT-driven resets.
Estimated: route ICS PGC and ICS PGD signals (RB6 and RB7 respectively) away from high-current traces and clocks to prevent in-circuit debugger noise coupling. Place a 4.7 kohm pull-up on MCLR/RE3 if not using the internal weak pull-up to ensure clean device reset. Keep the analog inputs (Port A and Port B analog-capable lines) on a separate analog ground pour that joins the main ground only at the EP, and add a small ferrite bead if the application drives PWM near ADC-sensitive analog channels.
Do not assume the "-I" suffix implies the same temperature envelope as "-E". The PIC18F47K40-E/MV is rated to +125C, while PIC18F47K40-I/MV tops out at +85C; deploying an -I part in an appliance enclosure can result in thermal shutdown during continuous PWM operation. Also remember that changing Flash size requires recompiling the linker script: code written for the F47K40 (128 KB) will not fit on the F46K40 (64 KB) without trimming dead sections.
合规信息
RoHS and lead-free compliance per Microchip product page for the MV package variant. AEC-Q100 not applicable: the PIC18F47K40-E/MV is a general-purpose industrial MCU; AEC-Q100-qualified variants are sold under separate order codes. REACH and Conflict Minerals compliance assumed per Microchip corporate disclosures; confirm at order placement for documentation package.
