PIC18LF24K22-I/ML - 16KB Flash 8-bit XLP MCU | Microchip
料号： PIC18LF24K22-I/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.67 | $4.67 |
| 10 | $4.2 | $42.00 |
| 100 | $3.75 | $375.00 |
| 500 | $3.32 | $1,660.00 |
| 1,000 | $2.98 | $2,980.00 |
PIC18LF24K22-I/ML 概述
A PIC18 microcontroller is an 8-bit Harvard-architecture MCU built around an enhanced RISC core with hardware multiplier, prioritized interrupts, and a peripheral set optimized for mixed-signal embedded designs. The PIC18 family sits above the baseline PIC10/12/16 families in Microchip's portfolio, targeting applications that require more memory, more peripherals, and C-compilable code while retaining the deterministic instruction set of the classic PIC architecture. Within the power-management IC hierarchy, the PIC18LFxxK22 series specifically targets low-voltage, low-power products where battery life and standby current dominate the design.
Key features of the PIC18LF24K22 include 16 KB self-write Flash, 768 bytes SRAM, 256 bytes EEPROM, an internal 16 MHz oscillator (selectable up to 64 MHz via PLL), 10-bit ADC with computation, up to 5 PWM modules, three 8/16-bit timer/counters, two comparators, two Enhanced USART, two MSSP (SPI/I2C), and an ICD/ICSP debug interface accessible through two I/O pins. The QFN-28 (ML) package exposes the die thermal pad for improved θJA in compact designs.
Typical applications include portable medical and wellness wearables, sensor nodes for IoT building automation, remote controls and consumer HMI, industrial battery-backed instrumentation, and low-power RF transmitter front-ends. The XLP nanoWatt features make the LF24K22 especially well suited to products that spend most of their lives in Sleep mode and wake briefly for measurement or communication. When designing, ensure the device remains within the 1.8V-3.6V LF supply window; substituting the PIC18F24K22 (F variant) allows operation up to 5.5V on the identical QFN-28 footprint.
This page synthesizes Microchip datasheet specifications, current distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in a single manufacturer resource.
直接替换替代料： PIC18LF24K22-I/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC18LF24K22-I/ML （相同外形与封装尺寸） ——差异在于 ADC, Package, Communication, Timers, I/O Pins.
快速对比工具——选择替代料号进行并排对比：
PIC18F24K22-I/ML
✅ 直接替换✓ 有现货
$2.55 / 个
查看数据手册 →PIC18LF25K22-I/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC18LF24K22-I/MV
✅ 直接替换✓ 有现货
$1.9 / 个
查看数据手册 →PIC18LF23K22-I/ML
✅ 直接替换✓ 有现货
$2.2 / 个
查看数据手册 →PIC18LF24K22-E/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC18LF24K22-I/ML 最大额定值与电气特性
| Family | PIC18LFxxK22 (XLP nanoWatt) |
| Core | PIC18 8-bit enhanced RISC |
| Program Memory (Flash) | 16 KB (8K x 16) |
| Data EEPROM | 256 bytes |
| Data SRAM | 768 bytes |
| Maximum CPU Speed | 64 MHz (16 MIPS) |
| Supply Voltage (LF) | 1.8 V to 3.6 V |
| I/O Pins | 25 |
| ADC | 10-bit, up to 17 channels |
| Comparators | 2 |
| PWM Channels | Up to 5 (ECCP + CCP) |
| Timers | 4 (8/16-bit) |
| Communication | 2x EUSART, 2x MSSP (SPI/I2C) |
| 封装 | 28-pin QFN (6 x 6 mm) with exposed pad |
| 工作温度 | -40C to +85C (industrial) |
| MSL 等级 | 3 (per JEDEC J-STD-020) |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
| Debug Interface | ICD/ICSP via 2 I/O pins |
| Internal Oscillator | 31 kHz LF + 16 MHz HF, PLL to 64 MHz |
PIC18LF24K22-I/ML 引脚配置
| 引脚 1 | RA2 — Bidirectional I/O / analog input |
| 引脚 2 | RA3 — Bidirectional I/O / analog input |
| 引脚 3 | RA4 — Bidirectional I/O / analog input |
| 引脚 4 | RA5 — Bidirectional I/O / analog input |
| 引脚 5 | RA6 — Bidirectional I/O / analog input |
| 引脚 6 | RA7 — Bidirectional I/O / analog input |
| 引脚 7 | VSS — Ground reference |
| 引脚 8 | VDD — Positive supply (1.8V-3.6V) |
| 引脚 9 | RA1 — Bidirectional I/O / analog input |
| 引脚 10 | RA0 — Bidirectional I/O / analog input |
| 引脚 11 | RB7 — Bidirectional I/O / programming clock (PGC) |
| 引脚 12 | RB6 — Bidirectional I/O / programming data (PGD) |
| 引脚 13 | RB5 — Bidirectional I/O |
| 引脚 14 | RB4 — Bidirectional I/O |
| 引脚 15 | RB3 — Bidirectional I/O |
| 引脚 16 | RB2 — Bidirectional I/O |
| 引脚 17 | RB1 — Bidirectional I/O |
| 引脚 18 | RB0 — Bidirectional I/O / interrupt-on-change |
| 引脚 19 | RC7 — Bidirectional I/O / EUSART RX |
| 引脚 20 | RC6 — Bidirectional I/O / EUSART TX |
| 引脚 21 | RC5 — Bidirectional I/O |
| 引脚 22 | RC4 — Bidirectional I/O |
| 引脚 23 | RC3 — Bidirectional I/O / MSSP SCL |
| 引脚 24 | RC2 — Bidirectional I/O / MSSP SDA |
| 引脚 25 | RC1 — Bidirectional I/O |
| 引脚 26 | RC0 — Bidirectional I/O |
| 引脚 27 | VSS — Ground reference |
| 引脚 28 | VDD — Positive supply (1.8V-3.6V) |
典型应用
PIC18LF24K22-I/ML 适用于 6 应用s: Battery-Powered IoT Sensor Nodes, Portable Medical and Wellness Devices, Remote Controls and Consumer HMI, Industrial Battery-Backed Instrumentation, Smart Home Sensor and Actuator Hubs, Low-Power RF Transmitter Front-Ends.
Battery-Powered IoT Sensor Nodes
The PIC18LF24K22-I/ML fits wireless sensor nodes because its XLP nanoWatt Sleep current under 100 nA typical enables multi-year battery life on a single coin cell. The 64 MHz CPU provides enough MIPS for sensor sampling and protocol handling, while the 17-channel 10-bit ADC accommodates multiple transducers. The 1.8V-3.6V LF supply directly matches a single CR2032 or 2xAA stack without regulator overhead, and the QFN-28 (6x6 mm) keeps the PCB area small. Compared to 32-bit Cortex-M0+ alternatives in this footprint class, the PIC18's deterministic interrupt latency benefits event-driven sensor timing.
推荐
Portable Medical and Wellness Devices
For wearables and portable medical monitoring, the PIC18LF24K22-I/ML offers the precision and low-noise analog needed for biosignal acquisition. The 10-bit ADC (up to 17 channels) supports multi-electrode acquisition, while the integrated comparators enable threshold detection on body-coupled signals without external op-amps. The LF variant's 1.8V minimum allows direct operation from a single alkaline or silver-oxide battery, and the XLP Sleep modes extend wearable runtime between charges. The exposed thermal pad aids heat spreading when the device is continuously active during measurement windows.
推荐
Remote Controls and Consumer HMI
Battery-powered remote controls benefit from the PIC18LF24K22-I/ML's Sleep current and rapid wake behavior. The 25 I/O pins drive key-matrix scanning, IR or RF transmitters, and LED indicators without external logic, while the 2x EUSART and 2x MSSP peripherals support multi-protocol HMI bridges (IR + BLE/SubGHz radio). At 16 MIPS, button debounce and protocol encoding are handled easily, and the 16KB Flash stores IR library codes. The 1.8V-3.6V supply aligns with two AAA cells, and the QFN-28 keeps total BOM small for ultra-thin remotes.
推荐
Industrial Battery-Backed Instrumentation
In industrial environments, the PIC18LF24K22-I/ML drives 4-20 mA loop-powered transmitters, wirelessHART sensor interfaces, and battery-backed data loggers. The extended -40C to +85C industrial range covers most cabinet installations, and the LF variant's 1.8V minimum enables operation from supercapacitor backup rails. The 16KB Flash accommodates Modbus or wirelessHART protocol stacks, and the 256-byte EEPROM stores calibration constants and tamper logs without external memory. The 28-QFN footprint offers better thermal performance than the SOIC variant in sealed enclosures.
推荐
Smart Home Sensor and Actuator Hubs
The PIC18LF24K22-I/ML is well suited to smart-home edge nodes such as battery-powered door/window sensors, thermostats, and motorized valve controllers. Its 17 ADC channels handle temperature, humidity, and light sensing; its ECCP module controls small brushless DC motors or PWM dimming; and its 2x EUSART + 2x MSSP host LoRa, Sub-GHz RF, or BLE co-processors via UART/SPI. The XLP Sleep mode draws under 100 nA, allowing coin-cell operation for years in door sensors. The 28-QFN (6x6 mm) package fits even compact smart-lock modules.
推荐
Low-Power RF Transmitter Front-Ends
As the host MCU for low-power RF transmitter front-ends (LoRa, Sub-GHz proprietary, BLE beacons), the PIC18LF24K22-I/ML provides reliable control and housekeeping. The 16 MIPS CPU handles packetization, encryption, and sensor preprocessing before the radio transmission event. The 1.8V-3.6V LF supply directly drives modern RF front-ends without LDO insertion, reducing BOM cost and quiescent loss. With XLP Sleep under 100 nA and rapid 5 us wake time, the LF24K22 enables long beacon intervals on coin cells. The 28-QFN footprint accommodates the radio daughter board stack-up.
推荐
推荐产品汇总
工程参考数据： PIC18LF24K22-I/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC18F24K22-I/ML | PIC18LF25K22-I/ML | PIC18LF24K22-I/MV | PIC18LF23K22-I/ML | PIC18LF24K22-E/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | UQFN-28 (4x4 mm) - smaller | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Program Memory (Flash) | 16 KB | 16 KB | 32 KB | 16 KB | 8 KB | 16 KB |
| Data RAM | 768 bytes | 768 bytes | 1.5 KB | 768 bytes | 512 bytes | 768 bytes |
| Maximum CPU Speed | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) |
| Supply Voltage Range | 1.8V to 3.6V (LF) | 1.8V to 5.5V (F) | 1.8V to 3.6V (LF) | 1.8V to 3.6V (LF) | 1.8V to 3.6V (LF) | 1.8V to 3.6V (LF) |
| Operating Temperature | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) |
关键差异点
- Low-voltage qualification 1.8V-3.6V （对比 PIC18F24K22-I/ML)
- Smaller UQFN-28 (MV) package option exists （对比 PIC18LF24K22-I/MV)
- Extended temperature grade option (-40C to +125C) （对比 PIC18LF24K22-E/ML)
- More memory in same footprint (32KB Flash option) （对比 PIC18LF25K22-I/ML)
设计说明
Decouple both VDD pins (8 and 28) with a 100 nF ceramic capacitor placed within 3 mm of each pin. Add a bulk 1 uF-10 uF tantalum or ceramic capacitor at the supply entry point. The PIC18LF24K22-I/ML includes internal POR (Power-On Reset) and BOR (Brown-Out Reset) but external decoupling is required to meet the XLP Sleep current specification. Failure to decouple adequately can increase Sleep current by 10-100x and degrade ADC accuracy.
The 28-QFN (ML) package has an exposed thermal pad (EP) on the bottom that must be soldered to a PCB ground plane for electrical and thermal performance. A ground plane of at least 1 square inch of 2 oz copper under the device reduces thermal resistance by approximately 30% versus the SOIC equivalent. Skipping the EP solder connection can cause erratic ADC readings and reduced operating temperature margin per the Microchip datasheet recommendation.
Route the ICSP signals (PGD on pin 12, PGC on pin 11) with traces short and direct to a programming header or test pad, kept away from switching power and high-frequency clock traces. Keep ADC inputs (ANx pins) on a separate analog ground island joined at the device VSS pin. Maintain a 5 mm keep-out under the QFN exposed pad for thermal relief; use 0.4 mm via array connecting EP to inner ground plane for best thermal and electrical performance.
Do not exceed 3.6V on VDD - the LF variant has no internal voltage clamp above this. Use the PIC18F24K22-I/ML (F variant) for 5V systems. Do not load port pins above 25 mA source or sink per pin or 200 mA total across ports. Do not leave unused I/O pins floating; configure them as outputs driving low or inputs with the internal weak pull-up enabled to minimize Sleep leakage. Avoid driving VUSB-related pins without proper consideration; this part does not include USB.
The 10-bit ADC on the PIC18LF24K22 achieves 1 LSB linearity only when the source impedance is below 2.5 kΩ per the datasheet. Add a 100 nF ceramic bypass capacitor (C_HOLD equivalent) close to analog inputs for signals above 10 kHz. For the internal voltage reference (FVR), enable it at least 1 ms before the ADC conversion begins to avoid settling errors.
合规信息
RoHS and REACH compliant per Microchip product page. The LF24K22 is industrial-grade (I); not AEC-Q100 qualified - select PIC18F24K22-E/ML or PIC18LF24K22-E/ML for automotive. Halogen-free status not explicitly stated in provided data.
