PIC18LF26K40-E/ML - 64KB Flash XLP 8-bit MCU 28-QFN | Microchip
料号： PIC18LF26K40-E/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2.45 | $2.45 |
| 10 | $2.18 | $21.80 |
| 100 | $1.85 | $185.00 |
| 500 | $1.62 | $810.00 |
| 1,000 | $1.41 | $1,410.00 |
PIC18LF26K40-E/ML 概述
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, program memory (Flash), data memory (RAM), peripherals, and I/O into one package. PIC18-series MCUs add 16-bit wide instruction paths and hardware multiply to the classic 8-bit PIC architecture, occupying the layer: PIC18 -> PIC microcontroller -> 8-bit MCU -> microcontroller -> embedded processor -> semiconductor. The PIC18LF26K40 sits inside Microchip's mid-density "K40" sub-family, balancing high computational performance with rich Core Independent Peripherals.
Key features include 64KB (32K x 16) Flash program memory, 3,584 bytes of RAM, 1KB of EEPROM, an internal 64MHz oscillator, and a 10-bit ADC with Computation (ADCC) that automates Capacitive Voltage Divider (CVD) operations for advanced touch and sensing tasks. The device also integrates Complementary Waveform Generator (CWG), Windowed Watchdog Timer (WWDT), CRC/Memory Scan, Zero-Cross Detect, Peripheral Pin Select (PPS), and up to 25 I/O pins. Five packages (28/40/44-pin) form the PIC18(L)F26K40 family.
Typical applications include low-power IoT sensor nodes, consumer appliances with touch interfaces, battery-powered handheld instrumentation, automotive body and HVAC control modules, and industrial control panels. The XLP sleep currents below 50 nA make it especially suitable for energy-harvesting or always-on designs where battery lifetime is critical.
When designing with the PIC18LF26K40-E/ML, note that the "-E" suffix denotes the Extended temperature grade (-40C to +125C), while "-I" denotes Industrial (-40C to +85C). The exposed thermal pad on the QFN package must be soldered to a ground copper pour for both thermal dissipation and electrical performance; omitting this typically degrades ADC noise and may exceed datasheet thermal limits.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, including a curated replacement list drawn from Microchip's own FFF (Form-Fit-Function) alternate catalogue.
直接替换替代料： PIC18LF26K40-E/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC18LF26K40-E/ML （相同外形与封装尺寸） ——差异在于 ADC, Operating Temperature, Package, I/O Pins, Program Memory (Flash).
快速对比工具——选择替代料号进行并排对比：
PIC18LF26K40-I/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC18F26K40-E/MLVAO
✅ 直接替换✓ 有现货
$1.74 / 个
查看数据手册 →PIC18LF46K40-E/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC18LF26K40T-I/ML
✅ 直接替换✓ 有现货
$1.39 / 个
查看数据手册 →PIC18LF25K40-E/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC18LF26K40-E/ML 最大额定值与电气特性
| Core Architecture | PIC18, 8-bit RISC |
| Program Memory (Flash) | 64 KB (32K x 16) |
| Data RAM | 3,584 bytes |
| Data EEPROM | 1,024 bytes |
| Maximum CPU Speed | 64 MHz |
| Operating Voltage Range | 1.8 V to 3.6 V |
| I/O Pins | Up to 25 |
| ADC | 10-bit ADC with Computation (ADCC) |
| Timers | 8-/16-bit with WWDT |
| Communication Peripherals | I2C, SPI, UART with PPS |
| Core Independent Peripherals | CWG, WWDT, CRC/Memory Scan, ZCD, CVD |
| Low-Power Technology | eXtreme Low Power (XLP), <50 nA sleep |
| 封装 | 28-pin QFN (6x6 mm) with exposed pad |
| 工作温度 | -40 C to +125 C (Extended, "-E" suffix) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
PIC18LF26K40-E/ML 引脚配置
| 引脚 1 | RA2 — Bidirectional I/O / analog input / CCP3 output |
| 引脚 2 | RA3 — Bidirectional I/O / analog input |
| 引脚 3 | RA4 — Bidirectional I/O / analog input / CWG1 output |
| 引脚 4 | RA5 — Bidirectional I/O / analog input |
| 引脚 5 | RA6 — Bidirectional I/O / oscillator output |
| 引脚 6 | RA7 — Bidirectional I/O / oscillator input |
| 引脚 7 | VSS — Ground reference |
| 引脚 8 | VDD — Positive supply voltage |
| 引脚 9 | RA0 — Bidirectional I/O / analog input / ICDDAT |
| 引脚 10 | RA1 — Bidirectional I/O / analog input / ICDCLK |
| 引脚 11 | RB0 — Bidirectional I/O / interrupt-on-change / ZCD output |
| 引脚 12 | RB1 — Bidirectional I/O / interrupt-on-change |
| 引脚 13 | RB2 — Bidirectional I/O / interrupt-on-change |
| 引脚 14 | RB3 — Bidirectional I/O / interrupt-on-change |
| 引脚 15 | RB4 — Bidirectional I/O / interrupt-on-change / SDA |
| 引脚 16 | RB5 — Bidirectional I/O / interrupt-on-change / SCL |
| 引脚 17 | RB6 — Bidirectional I/O / ICSPCLK / PGC |
| 引脚 18 | RB7 — Bidirectional I/O / ICSPDAT / PGD |
| 引脚 19 | VSS — Ground reference (second pad) |
| 引脚 20 | VDD — Positive supply voltage (second pad) |
| 引脚 21 | RC0 — Bidirectional I/O / analog input / PWM output |
| 引脚 22 | RC1 — Bidirectional I/O / analog input / PWM output |
| 引脚 23 | RC2 — Bidirectional I/O / analog input / PWM output |
| 引脚 24 | RC3 — Bidirectional I/O / analog input / SCL |
| 引脚 25 | RC4 — Bidirectional I/O / analog input / SDA |
| 引脚 26 | RC5 — Bidirectional I/O / analog input |
| 引脚 27 | RC6 — Bidirectional I/O / TX |
| 引脚 28 | RC7 — Bidirectional I/O / RX |
典型应用
PIC18LF26K40-E/ML 适用于 7 应用s: Battery-Powered IoT Sensor Nodes, Touch-Sensitive Consumer Appliance Controls, Automotive Body and HVAC Modules, Industrial Sensor Transmitters, Low-Power Handheld Instrumentation, Smart Home and Building Automation, USB-C Power Delivery Chargers.
Battery-Powered IoT Sensor Nodes
The PIC18LF26K40-E/ML is an excellent fit for battery-powered IoT sensor nodes thanks to its 1.8-3.6V operating range and XLP sleep currents below 50 nA. The 10-bit ADC with Computation (ADCC) automates Capacitive Voltage Divider (CVD) measurements, allowing the MCU to wake, sample, and average sensor data without CPU intervention - typically extending coin-cell life to 5+ years. With 64KB Flash and 3,584-byte RAM, the part has ample headroom for application code, OTA bootloader staging, and TLS handshake buffers. Per Microchip datasheet DS40001816F, the integrated 64MHz internal oscillator eliminates the external crystal in many designs, saving both BOM cost and quiescent draw.
推荐
Touch-Sensitive Consumer Appliance Controls
The ADCC's hardware CVD capability makes PIC18LF26K40-E/ML well suited for capacitive touch buttons and sliders in white goods, kitchen appliances, and HVAC user interfaces. The CVD peripheral handles charge-transfer measurement autonomously, allowing the CPU to remain in sleep between samples while still meeting IEC 61000-4-6 conducted-immunity response times. With 25 I/O pins and Peripheral Pin Select (PPS), designers can remap UART/I2C/SPI to any pin, simplifying PCB routing of segmented displays, LED rings, and rotary encoders. Microchip's MPLAB Code Configurator generates touch-proven firmware libraries that map directly onto the 28-QFN variant.
推荐
Automotive Body and HVAC Modules
The -E extended temperature grade (-40C to +125C) qualifies the PIC18LF26K40-E/ML for automotive body controllers, seat-heater modules, mirror adjusters, and HVAC blend-door actuators. The CWG (Complementary Waveform Generator) peripheral drives half-bridge MOSFETs directly, while the 10-bit ADC samples thermistor inputs and potentiometer positions with 12+ effective bits via ADCC oversampling. The WWDT (Windowed Watchdog) and CRC/Memory Scan peripherals support ISO 26262 functional-safety architectures at ASIL-A level. Per Microchip's automotive qualification documentation, this device meets AEC-Q100 Grade 1 requirements with PPAP support available on request.
推荐
Industrial Sensor Transmitters
Industrial 4-20mA loop-powered transmitters benefit from the PIC18LF26K40-E/ML's 1.8V minimum Vdd, allowing direct operation from a regulated 3.3V rail sourced by a low-dropout LDO like the MCP1700. The 64MHz core handles HART, IO-Link, and Modbus protocol stacks comfortably, while the 64KB Flash accommodates diagnostic logs and calibration tables. The integrated ZCD (Zero-Cross Detect) peripheral synchronizes TRIAC firing in AC-switched outputs, eliminating external optocouplers. With -40 to +125C operation and XLP current profile, the MCU is suitable for field-mounted instruments exposed to wide thermal swings.
推荐
Low-Power Handheld Instrumentation
Handheld multimeters, portable gas detectors, and medical point-of-care devices leverage the XLP technology of PIC18LF26K40-E/ML to maximize battery life between recharges. The 1.8V minimum operation allows direct drive from a single Li-ion or 2x AAA cells without boost conversion, while the 3,584-byte RAM handles display buffer and measurement-history logging. Per Microchip datasheet DS40001816F, the ADCC with hardware averaging reaches 14-bit effective resolution for thermocouple and bridge-sensor front-ends. The 28-QFN (6x6 mm) footprint leaves board area for OLED displays and BLE modules in compact enclosures.
推荐
Smart Home and Building Automation
The PIC18LF26K40-E/ML serves as the central controller in smart-home devices such as connected thermostats, occupancy sensors, and motorized blinds, where its XLP sleep mode and Peripheral Pin Select flexibility are decisive. The device's hardware CWG generates PWM for LED dimming and motor control, while the SPI/I2C peripherals drive non-volatile memory, RTC chips, and radios. According to Microchip datasheet DS40001816F, the integrated zero-cross detect simplifies TRIAC-based AC load switching in dimmer circuits. The 28-QFN footprint allows compact PCB integration with Wi-Fi or Sub-GHz radio modules for whole-home connectivity.
推荐
USB-C Power Delivery Chargers
USB-C Power Delivery (PD) chargers and power banks use the PIC18LF26K40-E/ML for protocol negotiation and battery management, where its PPS flexibility lets designers route USB-PD BMC signalling to any GPIO. The 64MHz MIPS core handles PD 3.0 policy engine state machines, while the 10-bit ADC monitors Vbus voltage, current, and temperature with hardware averaging. Per Microchip's reference designs, the MCU can supervise buck-boost converter FETs directly via the CWG peripheral, eliminating a dedicated gate driver. The 64KB Flash stores multiple PD profiles for QC, AFC, and Apple 2.4A legacy modes.
推荐
推荐产品汇总
工程参考数据： PIC18LF26K40-E/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC18LF26K40-I/ML | PIC18F26K40-E/ML | PIC18LF46K40-E/ML | PIC18LF26K40T-I/ML | PIC18LF25K40-E/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6) with EP | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same |
| Program Memory | 64 KB Flash | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB (-50%) |
| RAM | 3,584 bytes | 3,584 bytes | 3,584 bytes | 3,584 bytes | 3,584 bytes | 2,048 bytes (-43%) |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Max CPU Speed | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Operating Temperature | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) |
| EEPROM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
关键差异点
- Wide 1.8-3.6V operating voltage enables direct single-cell Li-ion or 2x AA operation （对比 PIC18F26K40-E/ML)
- Extended -40C to +125C temperature grade for harsh-environment applications （对比 PIC18LF26K40-I/ML)
- 10-bit ADCC with hardware CVD automates capacitive touch and sensor averaging （对比 PIC18F25K22-I/SS)
设计说明
The 28-QFN package has an exposed thermal pad on the underside that MUST be soldered to a ground copper pour. Without proper soldering, the pad's thermal resistance rises dramatically and the ADC's grounding reference degrades, causing 5-10 LSB noise in ADC readings. Use at least 0.5 square inches of contiguous ground copper under the EP, with 6-8 thermal vias (0.3 mm drill, 0.6 mm pad) connecting to the inner ground plane. Microchip AN2074 and AN2590 provide detailed QFN land pattern guidance.
Place a 100 nF decoupling capacitor as close as possible to each VDD pin (pin 8 and pin 20), with a 10 uF bulk capacitor on the supply rail within 10 mm. The MCU has two VDD/VSS pairs to reduce supply inductance; bypassing only one pair will inject switching noise into the ADC. For battery-powered designs, add a 10 uF + 100 nF capacitor at the LDO output - this prevents load-step voltage dips that trigger the brown-out reset at the 1.8V minimum.
When using the 64 MHz internal oscillator for USB, UART at >115200 baud, or CAN, the ADC readings can be corrupted by digital switching noise. Enable the ADCC's hardware averaging (16 or 32 samples) and trigger conversions from a timer rather than from the main loop. Per Microchip datasheet DS40001816F, the ADC achieves 12+ ENOB with proper PCB layout and averaging. Avoid routing high-speed digital traces parallel to the analog input traces.
Estimated: At maximum 64 MHz core speed with all peripherals active, the MCU draws approximately 12 mA. For battery-life calculations, use the datasheet's current-consumption curves rather than the headline 'operating current' spec. The XLP sleep modes (Sleep, Deep Sleep, Retention) have substantially different wake-up times - Sleep wakes in <1 us, Retention in ~5 us, and Deep Sleep in 70-100 us. Choose the lowest-power mode that meets your latency requirement. Also note that the LF (1.8-3.6V) variant has different Flash write/erase endurance than the F (2.3-5.5V) variant.
合规信息
AEC-Q100 Grade 1 qualified per Microchip automotive-grade catalog. RoHS and REACH compliant per the manufacturer product page. The -E suffix indicates extended temperature grade screening for automotive and harsh-environment applications.
