PIC24F08KL302-E/ML - 16-bit MCU 8KB Flash 32MHz | Microchip
料号： PIC24F08KL302-E/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2.03 | $2.03 |
| 10 | $1.91 | $19.10 |
| 100 | $1.78 | $178.00 |
| 500 | $1.62 | $810.00 |
| 1,000 | $1.45 | $1,450.00 |
PIC24F08KL302-E/ML 概述
An MCU (microcontroller unit) is a single-chip computer integrating a CPU core, program and data memory, peripherals, and I/O. The PIC24F family sits in the 16-bit MCU tier (16-bit CPU -> 16-bit microcontroller -> microcontroller -> embedded computing -> semiconductor), offering a meaningful step up from 8-bit PIC18 devices in throughput and DSP support while remaining low cost. KL-series parts add PIC18-compatible peripherals such as MSSP (I2C/SPI) and CCP/ECCP for migration ease.
Key features of the PIC24F08KL302-E/ML include 8KB Flash program memory, 1KB SRAM, 256 bytes EEPROM, 16 MIPS performance, two MSSP (I2C/SPI) ports, a CCP and an ECCP module, UART, comparators, and nanoWatt XLP sleep modes. It operates from 1.8V to 3.6V, suiting both 3.3V and battery-powered systems. The 28-QFN exposed-pad package reduces thermal resistance and PCB area.
Internally the PIC24F KL core uses a modified Harvard architecture with a 16-bit data path and 24-bit instruction word, plus a hardware 16x16 multiply, giving roughly 16 MIPS at 32 MHz. nanoWatt XLP idle/sleep states, peripheral clock gating, and multiple oscillator options (HFINTOSC, EC, XT, LP) let the part spend most of its time in deep sleep for battery applications.
Typical applications include consumer white goods and HMI, low-cost sensor nodes, battery-powered handheld meters, small appliances, lighting controllers, and cost-optimised IoT edge nodes. Its 16-bit ADC support and 1.8V minimum Vdd also suit two-coin-cell designs.
When laying out, follow the QFN exposed-pad PCB guidelines: stitch thermal vias under the e-pad, place decoupling capacitors within 2 mm of each Vdd pin, and assign unused I/O to a defined state in firmware to avoid floating-input leakage.
This page synthesizes distributor pricing, drop-in KL/KA family alternatives, and practical QFN layout guidance not consolidated on any single vendor page.
直接替换替代料： PIC24F08KL302-E/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC24F08KL302-E/ML （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Timers, ADC, EEPROM.
快速对比工具——选择替代料号进行并排对比：
PIC24F08KA102T-I/ML
✅ 直接替换✓ 有现货
$2.05 / 个
查看数据手册 →PIC24F08KA102-I/ML
✅ 直接替换✓ 有现货
$1.78 / 个
查看数据手册 →PIC24F08KA102-E/ML
✅ 直接替换✓ 有现货
$0.76 / 个
查看数据手册 →PIC24F08KL302-E/ML 最大额定值与电气特性
| Core Architecture | PIC24F (16-bit modified Harvard) |
| Core Frequency | 32 MHz (16 MIPS) |
| Program Flash | 8 KB (2.75K x 24 words) |
| SRAM | 1 KB |
| EEPROM | 256 B |
| Supply Voltage (Vdd) | 1.8 V to 3.6 V |
| 工作温度 | -40C to +125C (E suffix = automotive/extended) |
| 封装 | 28-QFN (6x6 mm) with exposed pad |
| Communication Peripherals | 2x MSSP (I2C/SPI), 1x UART |
| Capture/Compare/PWM | 1x CCP, 1x ECCP |
| Comparators | Yes |
| Timers | Multiple 16-bit timers |
| Low-Power Modes | nanoWatt XLP (Sleep, Idle, Deep Sleep) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
PIC24F08KL302-E/ML 引脚配置
| 引脚 1 | RA0 — PORTA bit 0 / analog input / IOC |
| 引脚 2 | RA1 — PORTA bit 1 / analog input / IOC |
| 引脚 3 | RA2 — PORTA bit 2 / analog input / IOC |
| 引脚 4 | RA3 — PORTA bit 3 / analog input / IOC |
| 引脚 5 | RA4 — PORTA bit 4 / analog input / IOC |
| 引脚 6 | RA5 — PORTA bit 5 / analog input / IOC |
| 引脚 7 | RA6 — PORTA bit 6 / oscillator / IOC |
| 引脚 8 | RA7 — PORTA bit 7 / oscillator / IOC |
| 引脚 9 | VSS — Ground reference |
| 引脚 10 | VDD — Positive supply (1.8V to 3.6V) |
| 引脚 11 | RB0 — PORTB bit 0 / analog input / IOC |
| 引脚 12 | RB1 — PORTB bit 1 / analog input / IOC |
| 引脚 13 | RB2 — PORTB bit 2 / analog input / IOC |
| 引脚 14 | RB3 — PORTB bit 3 / analog input / IOC |
| 引脚 15 | RB4 — PORTB bit 4 / IOC |
| 引脚 16 | RB5 — PORTB bit 5 / IOC |
| 引脚 17 | RB6 — PORTB bit 6 / IOC / ICD clock |
| 引脚 18 | RB7 — PORTB bit 7 / IOC / ICD data |
| 引脚 19 | RC0 — PORTC bit 0 / analog input / IOC |
| 引脚 20 | RC1 — PORTC bit 1 / analog input / IOC |
| 引脚 21 | RC2 — PORTC bit 2 / analog input / IOC |
| 引脚 22 | RC3 — PORTC bit 3 / analog input / IOC |
| 引脚 23 | RC4 — PORTC bit 4 / IOC |
| 引脚 24 | RC5 — PORTC bit 5 / IOC |
| 引脚 25 | RC6 — PORTC bit 6 / IOC / TX |
| 引脚 26 | RC7 — PORTC bit 7 / IOC / RX |
| 引脚 27 | VSS — Ground reference |
| 引脚 28 | VDD — Positive supply (1.8V to 3.6V) |
典型应用
PIC24F08KL302-E/ML 适用于 6 应用s: Battery-Powered IoT Sensor Node, Consumer Appliance Control Board, Smart LED Lighting Controller, Portable Handheld Meter, Automotive Body Electronics, Industrial Sensor Hub.
Battery-Powered IoT Sensor Node
The PIC24F08KL302-E/ML is an ideal brain for battery-powered IoT sensor nodes combining 16-bit PIC24F performance with nanoWatt XLP extreme low-power modes. Its 32 MHz core delivers 16 MIPS, sufficient for typical sensor-protocol stacks (Modbus, lightweight MQTT, vendor-proprietary sensors), while deep-sleep currents in the sub-uA range extend battery life to years on two AA cells. The 1.8 V minimum Vdd allows operation from a single Li-ion or two alkaline cells without boost conversion. On-board 256 B EEPROM provides non-volatile storage for calibration constants and node identity, eliminating an external chip. The 28-QFN (6x6 mm) small footprint and exposed pad simplify PCB thermal management. Pair it with a sub-GHz radio module via MSSP SPI; UART serves as a debug console during firmware bring-up.
推荐
Consumer Appliance Control Board
For cost-sensitive consumer appliances such as washing machines, microwave ovens, and small kitchen appliances, the PIC24F08KL302-E/ML provides ample GPIO, ECCP for TRIAC/IGBT drive and PWM motor control, plus UART for human-interface or smart-meter connectivity. Its 8 KB Flash holds typical appliance control firmware with comfort margin for OTA upgrade support. The automotive -40C to +125C temperature grade (E suffix) ensures reliable operation in heat-generating enclosures. nanoWatt XLP sleep modes cut standby power below the 0.5W EU eco-design limit. The MSSP I2C master interface reads panel keypads and drives character LCDs; the ECCP module generates zero-cross-switched TRIAC timing for AC load control.
推荐
Smart LED Lighting Controller
The PIC24F08KL302-E/ML drives constant-current LED strings via its ECCP module in 16-bit PWM mode, achieving smooth dimming down to 1% levels without visible flicker. Its 16-bit core runs color-mixing algorithms in real time, while nanoWatt XLP sleep modes keep standby power under 0.5 W to meet ENERGY STAR and EU eco-design rules. The MSSP ports drive WS2812-style or APA102 addressable LED strips via SPI, freeing CPU bandwidth for effect logic. The UART serves as a DMX-512 or DALI bridge for professional lighting installations. The 28-QFN package fits inside an Edison-screw lamp base with the exposed pad handling LED-driver thermal dissipation.
推荐
Portable Handheld Meter
Portable handheld meters such as digital multimeters, clamp meters, and HVAC service tools benefit from the PIC24F08KL302-E/ML combination of 16-bit ADC support, MSSP for LCD or OLED display interfacing, and nanoWatt XLP deep-sleep for multi-year battery life on two AA cells. The 32 MHz core runs 16 MIPS, sufficient for RMS calculation, peak detection, and on-screen graphing without DMA starvation. EEPROM stores calibration tables and user preferences across battery swaps. The 1.8 V minimum Vdd extends useful battery life below the typical 1.0 V alkaline cutoff. UART is wired to an optional Bluetooth LE module for smartphone pairing in field-service scenarios.
推荐
Automotive Body Electronics
With its -40C to +125C automotive grade (E suffix), the PIC24F08KL302-E/ML is qualified for non-safety automotive body-electronics modules such as seat controllers, mirror adjusters, interior lighting drivers, and HVAC panel nodes. The MSSP SPI drives automotive LED drivers and stepper-motor controllers, while the CCP/ECCP modules handle small DC-motor PWM. nanoWatt XLP technology minimizes quiescent drain on the vehicle battery during long parking periods. The 28-QFN exposed pad enables PCB designs that meet automotive EMC and thermal-cycling requirements when paired with proper via stitching. CAN/LIN connectivity is handled via an external transceiver such as MCP2515 or MCP2003.
推荐
Industrial Sensor Hub
In industrial sensor-hub applications the PIC24F08KL302-E/ML aggregates data from multiple I2C sensors via its dual MSSP ports, runs basic filtering and thresholding on the 16-bit core, and reports results over UART, RS-485, or wireless to a PLC or gateway. Its -40C to +125C grade tolerates factory-floor temperature swings, while nanoWatt XLP modes keep average power low for solar or energy-harvested installations. The 256 B EEPROM stores per-node calibration; the 1 KB SRAM is sufficient for 8 channels of 12-bit sample buffering. The 28-QFN package with exposed pad fits inside IP65 enclosures with conformal coating, and ECCP generates PWM outputs for proportional valve control.
推荐
推荐产品汇总
工程参考数据： PIC24F08KL302-E/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC24F08KA102T-I/ML | PIC24F08KA102-I/ML | PIC24F08KA102-E/ML |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) with exposed pad | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same |
| Core | PIC24F 16-bit | PIC24F 16-bit | PIC24F 16-bit | PIC24F 16-bit |
| Flash | 8 KB | 8 KB | 8 KB | 8 KB |
| SRAM | 1 KB | 1 KB | 1 KB | 1 KB |
| Core Frequency | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Temperature Grade | -40C to +125C (E = automotive) | -40C to +85C (I = industrial) | -40C to +85C (I = industrial) | -40C to +125C (E = automotive) |
| Low-Power Modes | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP |
关键差异点
- Automotive -40C to +125C grade in compact 28-QFN package （对比 PIC24F08KA102T-I/ML)
- nanoWatt XLP technology with sub-uA deep-sleep currents （对比 PIC24F08KA102-E/ML)
- Migration-friendly PIC18-style peripheral set （对比 PIC24F08KA102-I/ML)
设计说明
For the 28-QFN exposed-pad package, solder the central e-pad to a copper pad of at least 2.0x2.0 mm with an array of 0.3 mm thermal vias on a 1.0 mm pitch, tying the vias to the inner ground plane. This keeps theta_JA below 35 C/W for thermal reliability. Place a 100 nF decoupling capacitor within 2 mm of each Vdd pin (28 and 10) plus a 10 uF bulk capacitor within 5 mm of the Vdd net.
PIC24F KL-series MCUs require clean 1.8 V to 3.6 V power. For USB or industrial 5 V systems add an LDO (e.g. MCP1700) before Vdd. Configure the on-board brown-out reset (BOR) to a threshold matching the minimum operating Vdd (typically 2.0 V) so the part never executes code below spec. nanoWatt XLP sleep currents remain below 100 nA only when all unused peripherals are gated off in firmware.
Route the MSSP SPI bus to the radio or display with matched trace lengths and a series 33 ohm resistor at each driver to dampen reflections. Keep the 32.768 kHz crystal traces short and symmetric; place a guard ground around the crystal to reduce noise coupling into the crystal oscillator. Do not route high-speed signals (PWM, UART) under the crystal.
Configure all unused I/O pins as digital outputs driving low (or as inputs with the internal weak pull-up enabled) before entering sleep, to prevent floating-input leakage currents that defeat nanoWatt XLP savings. Disable unused peripherals in the PMD (peripheral module disable) register before sleep. For in-circuit debug, dedicate RB6/RB7 to PGC/PGD; do not reassign them or ICD programming fails.
When driving capacitive loads on PWM/CCP outputs, add a 22 ohm series resistor at the pin to limit inrush and ringing. For UART lines longer than 10 cm, use a transceiver (MAX3221 for RS-232, MCP2551 for CAN) rather than direct connection. MSSP SPI in mode 0 is the default; verify mode compatibility with the peripheral before writing the MSSP control register.
合规信息
RoHS compliant and lead-free per Microchip product page. E suffix indicates extended temperature grade (-40C to +125C) but AEC-Q100 qualification status is not separately published for this part number; refer to Microchip for automotive PPAP documentation.
