PIC24FJ1024GA606-E/PT - 16-Bit MCU 1MB Flash 32KB RAM 64-TQFP | Microchip
料号： PIC24FJ1024GA606-E/PT ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $7.95 | $7.95 |
| 10 | $7.42 | $74.20 |
| 100 | $6.65 | $665.00 |
| 500 | $6.05 | $3,025.00 |
| 1,000 | $5.5 | $5,500.00 |
PIC24FJ1024GA606-E/PT 概述
A PIC24 microcontroller is a 16-bit modified-Harvard architecture MCU built around the PIC instruction set, which sits between 8-bit PIC16/PIC18 parts and the 32-bit PIC32MX/PIC32MZ devices. It belongs to the broader category of microcontrollers (MCUs) within the embedded integrated circuit hierarchy: MCU -> microcontroller IC -> embedded processor -> semiconductor. The PIC24F sub-family is engineered for low-power, mixed-signal applications where USB, graphics, and connectivity peripherals are commonly required.
Key features of the PIC24FJ1024GA606 include 1 MB Flash (341.5K words x 24 bits) with Error Correction Code, dual-partition memory for Live Update firmware swapping, 32 KB SRAM, 53 general-purpose I/O pins, 12-bit ADC, multiple communication peripherals, and 9 timers with 6 PWM channels and 8 DMA channels. The device is supplied in a -40C to +125C extended temperature grade, suitable for industrial and harsh-environment deployments.
Architecturally, the PIC24FJ1024GA606 integrates a wide peripheral set including 3 I2C, 3 SPI, and 6 UART modules, plus dedicated USB and real-time clock peripherals. Live Update dual-partition Flash enables in-field firmware upgrades without downtime, and ECC on Flash ensures reliable operation in safety-conscious applications. The 64-TQFP package (10x10 mm) provides ample I/O count for parallel-bus or display interfaces.
Typical applications include industrial control panels, low-power IoT sensor hubs, USB human-interface devices, home appliance control boards, and battery-powered instrumentation where the large 1 MB Flash supports complex protocol stacks (TLS, USB stacks, graphics libraries).
When designing with this part, evaluate the actual active-mode current at 32 MHz and the deep-sleep current to size battery budgets. Pin 1 indicator and TQFP-64 footprint are standard, enabling compatibility with existing PIC24FJ Explorer 16 development ecosystems.
This page synthesizes distributor pricing, drop-in alternatives within the PIC24FJ family, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： PIC24FJ1024GA606-E/PT ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC24FJ1024GA606-E/PT （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, ADC, Mounting Type, Core Architecture.
快速对比工具——选择替代料号进行并排对比：
PIC24FJ1024GA606-I/PT
✅ 直接替换📋 参考替代料（不在目录中）
PIC24FJ1024GA606T-I/PT
✅ 直接替换✓ 有现货
$4.55 / 个
查看数据手册 →PIC24EP512GP206-I/PT
✅ 直接替换📋 参考替代料（不在目录中）
PIC24EP256MC206-I/PT
✅ 直接替换✓ 有现货
$5.21 / 个
查看数据手册 →PIC24FJ1024GA606-E/PT 最大额定值与电气特性
| Manufacturer | Microchip Technology |
| Series | PIC24F |
| Core Processor | PIC24 |
| Core Size | 16-Bit |
| Maximum CPU Speed | 32 MHz |
| Program Memory Size | 1 MB (341.5K x 24) Flash |
| RAM Size | 32 KB |
| Flash ECC | Yes (Error Correction Code) |
| Dual Partition / Live Update | Yes |
| Number of I/O Pins | 53 |
| Timers | 9 |
| PWM Channels | 6 |
| DMA Channels | 8 |
| UART Modules | 6 |
| SPI Modules | 3 |
| I2C Modules | 3 |
| ADC Resolution | 12-bit |
| 封装 | 64-TQFP (10x10 mm) |
| 安装类型 | Surface Mount |
| 工作温度范围 | -40C to +125C (Extended) |
| RoHS 状态 | Compliant |
| 生命周期状态 | Not Recommended for new designs (NRND) |
PIC24FJ1024GA606-E/PT 引脚配置
| 引脚 1 | RP15/PMD15/RB15 — Remappable I/O / Parallel Master Data |
| 引脚 2 | VSS — Ground reference |
| 引脚 3 | VDD — Positive supply voltage |
| 引脚 4 | SOSCI/RP4/CN4/RB4 — Secondary oscillator / Remappable I/O |
| 引脚 5 | SOSCO/T1CK/CN3/RB5 — Secondary oscillator output / Timer1 clock |
| 引脚 6 | RP20/PMD20/RA0 — Remappable I/O / Parallel Master Data |
| 引脚 7 | RP21/RA1 — Remappable I/O |
| 引脚 8 | RP22/RA2 — Remappable I/O |
| 引脚 9 | RP23/RA3 — Remappable I/O |
| 引脚 10 | RP24/RA4 — Remappable I/O |
| 引脚 11 | RP25/RA5 — Remappable I/O |
| 引脚 12 | VSS — Ground reference |
| 引脚 13 | VDD — Positive supply voltage |
| 引脚 14 | RP26/RA6 — Remappable I/O |
| 引脚 15 | RP27/RA7 — Remappable I/O |
| 引脚 16 | RP28/RA8 — Remappable I/O |
| 引脚 17 | RP29/RA9 — Remappable I/O |
| 引脚 18 | RP30/RA10 — Remappable I/O |
| 引脚 19 | RP31/RA11 — Remappable I/O |
| 引脚 20 | VSS — Ground reference |
| 引脚 21 | VDD — Positive supply voltage |
| 引脚 22 | RP0/PMD0/RB0 — Remappable I/O / Parallel Master Data |
| 引脚 23 | RP1/PMD1/RB1 — Remappable I/O / Parallel Master Data |
| 引脚 24 | RP2/PMD2/RB2 — Remappable I/O / Parallel Master Data |
| 引脚 25 | RP3/PMD3/RB3 — Remappable I/O / Parallel Master Data |
| 引脚 26 | RP4/PMD4/RB4 — Remappable I/O / Parallel Master Data |
| 引脚 27 | RP5/PMD5/RB5 — Remappable I/O / Parallel Master Data |
| 引脚 28 | VSS — Ground reference |
| 引脚 29 | VDD — Positive supply voltage |
| 引脚 30 | OSCI/CLKI/RA12 — Primary oscillator input / clock input |
| 引脚 31 | OSCO/CLKO/RA13 — Primary oscillator output / clock output |
| 引脚 32 | RP8/PMD8/RB8 — Remappable I/O / Parallel Master Data |
| 引脚 33 | RP9/PMD9/RB9 — Remappable I/O / Parallel Master Data |
| 引脚 34 | RP10/PMD10/RB10 — Remappable I/O / Parallel Master Data |
| 引脚 35 | RP11/PMD11/RB11 — Remappable I/O / Parallel Master Data |
| 引脚 36 | VSS — Ground reference |
| 引脚 37 | RP12/PMD12/RB12 — Remappable I/O / Parallel Master Data |
| 引脚 38 | RP13/PMD13/RB13 — Remappable I/O / Parallel Master Data |
| 引脚 39 | RP14/PMD14/RB14 — Remappable I/O / Parallel Master Data |
| 引脚 40 | PGEC1/RP16/RC0 — ICSP programming clock / Remappable I/O |
| 引脚 41 | PGED1/RP17/RC1 — ICSP programming data / Remappable I/O |
| 引脚 42 | RP18/RC2 — Remappable I/O |
| 引脚 43 | RP19/RC3 — Remappable I/O |
| 引脚 44 | VUSB3V3 — USB internal transceiver supply |
| 引脚 45 | VUSB — USB power supply pin |
| 引脚 46 | D+ — USB D+ data line |
| 引脚 47 | D- — USB D- data line |
| 引脚 48 | VSS — Ground reference |
| 引脚 49 | OSC1/RC12 — Crystal oscillator input |
| 引脚 50 | OSC2/RC13 — Crystal oscillator output |
| 引脚 51 | PGEC2/RC14 — Alternate ICSP programming clock |
| 引脚 52 | PGED2/RC15 — Alternate ICSP programming data |
| 引脚 53 | RP6/RC4 — Remappable I/O |
| 引脚 54 | RP7/RC5 — Remappable I/O |
| 引脚 55 | RP8/RC6 — Remappable I/O |
| 引脚 56 | RP9/RC7 — Remappable I/O |
| 引脚 57 | RP10/RC8 — Remappable I/O |
| 引脚 58 | RP11/RC9 — Remappable I/O |
| 引脚 59 | VSS — Ground reference |
| 引脚 60 | VDD — Positive supply voltage |
| 引脚 61 | AVDD — Analog positive supply |
| 引脚 62 | AVSS — Analog ground |
| 引脚 63 | MCLR — Master clear reset (active low) |
| 引脚 64 | ENVREG — Voltage regulator enable |
典型应用
PIC24FJ1024GA606-E/PT 适用于 7 应用s: Industrial Control Panel HMI, Low-Power IoT Sensor Hub, USB Human Interface Device, Home Appliance Control Board, Battery-Powered Medical Instrument, Automotive Infotainment Auxiliary Controller, Educational Development Platform.
Industrial Control Panel HMI
The PIC24FJ1024GA606-E/PT fits industrial Human-Machine Interface panels because its 1 MB Flash easily holds graphics libraries, USB stacks, and multi-language fonts, while the 53 I/O pins drive LCDs, keypads, and indicator LEDs simultaneously. Its 32 KB SRAM and 8 DMA channels keep the main CPU free while handling continuous LCD refresh, touch scanning, and serial protocol traffic to fieldbus masters. The -40C to +125C extended temperature grade ensures reliable operation in factory-floor enclosures, and the 32 MHz PIC24F core consumes minimal current in display idle states. Peripherals: 6 UARTs handle RS-485/MODBUS masters, 3 SPI ports drive display controllers, and the 12-bit ADC reads analog sensor inputs.
推荐
Low-Power IoT Sensor Hub
The PIC24FJ1024GA606-E/PT is suited for IoT sensor hubs thanks to its eXtreme Low Power PIC24F architecture, which offers multiple deep-sleep modes with sub-microamp currents. The 1 MB Flash supports TLS libraries and Over-The-Air firmware update stacks, while the 8 DMA channels enable efficient background sampling of multiple sensors without CPU intervention. The 6 UARTs, 3 SPI, and 3 I2C ports aggregate data from various sensors (temperature, humidity, accelerometers, gas sensors) into a single gateway node. Live Update dual-partition Flash allows safe firmware upgrades across the installed base without service interruption, which is critical for deployed IoT fleets.
推荐
USB Human Interface Device
The PIC24FJ1024GA606-E/PT works well in USB Human Interface Devices (keyboards, mice, custom HID controls, programmable keypads) because of its integrated USB peripheral and the 1 MB Flash that fits USB stacks plus rich HID report descriptors. The 53 I/O pins scan key matrices up to 8x8 or larger, while 9 timers provide debouncing, macro recording, and RGB LED PWM control without software overhead. Live Update dual-partition Flash enables field firmware upgrades to add features or fix bugs after deployment. The 32 KB SRAM is ample for USB endpoint buffers, macro storage, and HID report history.
推荐
Home Appliance Control Board
The PIC24FJ1024GA606-E/PT serves as the main controller in white goods and home appliances, where it drives motor control (via PWM and timers), reads temperature/pressure sensors (via 12-bit ADC), and manages user interfaces (keypads, displays, buzzers). The -40C to +125C extended temperature range handles hot appliance environments like oven control boards and washing machine motor drives. The 1 MB Flash supports complex state machines, fault diagnostics, and communication stacks (Wi-Fi/BLE via companion modules). The 6 UARTs connect to multiple subsystems (inverter boards, sensor modules, display modules) in parallel.
推荐
Battery-Powered Medical Instrument
The PIC24FJ1024GA606-E/PT is appropriate for portable medical instruments such as glucose meters, pulse oximeters, and ambulatory monitors, where its eXtreme Low Power modes extend battery life and its 12-bit ADC provides accurate biosignal measurements. The 1 MB Flash accommodates calibration tables, patient history storage, and BLE/USB communication stacks. The 53 I/O pins drive LCDs, button inputs, and sensor interfaces (SpO2 probe, test strip connector). The Live Update dual-partition Flash enables safe regulatory-required firmware updates after deployment without device bricking risk.
推荐
Automotive Infotainment Auxiliary Controller
The PIC24FJ1024GA606-E/PT functions as an auxiliary controller in automotive infotainment subsystems, where it manages button clusters, rotary encoders, HVAC controls, and ambient lighting. The 53 I/O pins and 6 PWM channels drive LED backlighting and motor-driven vents, while the 6 UARTs communicate with the head unit, CAN bridge, and HVAC modules. The -40C to +125C extended temperature grade handles under-dash thermal conditions, and the 1 MB Flash supports complex diagnostic protocols. Note: this part is NOT AEC-Q100 qualified; for true automotive designs, consider PIC24FJ1024GA606-E/PT only in non-safety auxiliary roles or select AEC-Q100 successors.
推荐
Educational Development Platform
The PIC24FJ1024GA606-E/PT is widely adopted in university embedded systems courses and professional training programs because its 1 MB Flash, 32 KB RAM, and rich peripheral mix (USB, I2C, SPI, UART, ADC, PWM, DMA) expose students to nearly all common MCU subsystems in a single chip. The 64-TQFP package is breadboard-friendly with breakout boards, and Microchip's MPLAB X IDE plus XC16 compiler offer a free, well-supported toolchain. The PIC24F eXtreme Low Power features teach real-world energy-management concepts. The 53 I/O pins support capstone projects spanning robotics, sensor fusion, and IoT applications.
推荐
推荐产品汇总
工程参考数据： PIC24FJ1024GA606-E/PT ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC24FJ1024GA606-I/PT | PIC24FJ1024GA606T-I/PT | PIC24EP512GP206-I/PT | PIC24EP256MC206-I/PT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP - same | 64-TQFP - same |
| Core | PIC24F 16-bit @ 32 MHz | PIC24F 16-bit @ 32 MHz | PIC24F 16-bit @ 32 MHz | PIC24EP 16-bit @ 70 MIPS | PIC24EP 16-bit @ 70 MIPS (motor control) |
| Flash Memory | 1 MB (341.5K x 24) | 1 MB | 1 MB | 512 KB (-49%) | 256 KB (-75%) |
| RAM Size | 32 KB | 32 KB | 32 KB | 48 KB | 32 KB |
| Temperature Grade | Extended -40C to +125C (-E) | Industrial -40C to +85C (-I) | Industrial -40C to +85C (-I) | Industrial -40C to +85C (-I) | Industrial -40C to +85C (-I) |
| Number of I/O Pins | 53 | 53 | 53 | 53 | 53 |
| Lifecycle Status | NRND | NRND | NRND | Active | Active |
| Live Update / Dual Partition Flash | Yes | Yes | Yes | No | No |
| USB Peripheral | Yes (USB FS Device/Host/OTG) | Yes | Yes | Yes | Yes |
关键差异点
- 1 MB dual-partition Flash with Live Update （对比 PIC24EP512GP206-I/PT)
- Extended temperature grade -40C to +125C （对比 PIC24FJ1024GA606-I/PT)
- eXtreme Low Power architecture （对比 PIC24EP256MC206-I/PT)
- Large I/O count on a small TQFP footprint （对比 PIC24FJ1024GA606-E/MR)
设计说明
The PIC24FJ1024GA606-E/PT requires a stable VDD rail with bulk decoupling of 10 uF + 0.1 uF placed within 5 mm of each VDD/VSS pin pair. The internal voltage regulator (ENVREG pin) must be enabled via configuration bits; if disabled, external 1.8V/2.5V/3.3V supply is required. For battery-powered designs, switch to Deep Sleep mode (typical current under 100 nA per datasheet) and use RTCC for wake events. Estimated: total quiescent current at 3.3V in Deep Sleep is in the low microamp range per Microchip PIC24FJ family datasheets.
Place a 0.1 uF ceramic decoupling capacitor as close as possible to every VDD/VSS pair, and add a single 10 uF bulk capacitor near the package. Keep the 32.768 kHz crystal traces short and symmetrical; route them away from switching lines. For USB designs, the D+/D- traces must be 90-ohm differential with matched length; place the 15 kohm pull-down on D- and the series 27-33 ohm termination resistors at the MCU end of each line.
A common pitfall when migrating from PIC24EP to PIC24FJ is forgetting that the PIC24FJ core runs at 32 MHz (16 MIPS) while PIC24EP runs at 70 MIPS - any timing-sensitive loops must be re-validated. The Live Update dual-partition Flash requires careful application design: the active partition must be fully self-contained (no cross-partition calls). Forgetting to enable the internal regulator via ENVREG configuration bit is a frequent bring-up issue that causes the MCU to appear completely dead.
The 64-TQFP package has thermal resistance (theta_JA) of approximately 40-50 C/W on a standard JEDEC 4-layer test board. At full 32 MHz operation across all peripherals, internal dissipation can reach 60-100 mW depending on peripheral activity, yielding a junction-to-ambient temperature rise of 5-10C. For +125C extended temperature applications, derate ambient by 10-15C to maintain junction within spec.
合规信息
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - automotive designs should select AEC-Q100 successor parts. Halogen-free status not explicitly stated in provided data.
