PIC24FJ256GB606T-I/MR - 16-Bit 32MHz USB MCU 256KB Flash | Microchip
料号： PIC24FJ256GB606T-I/MR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.5 | $4.50 |
| 10 | $4.05 | $40.50 |
| 100 | $3.61 | $361.00 |
| 500 | $3.25 | $1,625.00 |
| 1,000 | $2.92 | $2,920.00 |
PIC24FJ256GB606T-I/MR 概述
A 16-bit microcontroller (MCU) is a single-chip computer whose data path and arithmetic logic unit operate on 16-bit words, sitting hierarchically between 8-bit MCUs (e.g., PIC16, AVR) and 32-bit MCUs (e.g., PIC32, ARM Cortex-M). The PIC24F family uses a modified Harvard architecture with a 16-bit instruction word and 24-bit fixed instruction length, offering higher code density than typical 16-bit MCUs and a rich peripheral set for mixed-signal embedded designs.
Key differentiating features include 7 timers, 6 PWM channels, 3 analog comparators, 8 DMA channels, 6 UART modules, 3 SPI interfaces, 3 I2C interfaces, a 16-channel 10-bit ADC, an RTCC with calendar mode, and the previously mentioned integrated USB 2.0 Full-Speed OTG controller with on-chip transceiver. The dual-partition Flash architecture combined with Live Update makes the part uniquely suited for in-field firmware updates without service interruption.
The device operates from 2.0V to 3.6V, supports industrial temperatures of -40C to +85C, and is qualified to Microchip's standard commercial/industrial reliability flow. The USB peripheral, dual-partition Flash, and large SRAM are the architecture's three pillars; together they enable battery-powered or bus-powered designs that must communicate with a host, store telemetry, and survive long deployment in the field.
Typical applications include USB HID peripherals, battery-powered medical/fitness devices, portable data loggers, industrial sensor nodes, and consumer accessories. The wide GPIO count and abundant DMA channels let designers attach displays, sensors, and communication stacks without external logic.
When designing with this part, allocate the dual-partition Flash wisely so that each partition can hold the full firmware image plus a small bootloader; this is what enables Live Update. Decoupling must include 100nF on every VDD/VSS pair close to the MCU, plus a 4.7uF bulk capacitor on the main rail to handle USB inrush current.
This page synthesizes distributor pricing, pin-compatible same-family alternatives, application-specific design notes, and a parameter comparison table that are not present in the manufacturer datasheet alone.
直接替换替代料： PIC24FJ256GB606T-I/MR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC24FJ256GB606T-I/MR （相同外形与封装尺寸） ——差异在于 ADC, Package, Core Architecture, Operating Temperature, Timers.
快速对比工具——选择替代料号进行并排对比：
PIC24FJ128GB606T-I/MR
✅ 直接替换✓ 有现货
$4.1 / 个
查看数据手册 →PIC24FJ1024GB606T-I/MR
✅ 直接替换✓ 有现货
$3.72 / 个
查看数据手册 →PIC24FJ256GB606-I/MR
✅ 直接替换✓ 有现货
$2.65 / 个
查看数据手册 →PIC24FJ256GA606T-I/MR
✅ 直接替换✓ 有现货
$2.95 / 个
查看数据手册 →PIC24FJ1024GA606T-I/MR
✅ 直接替换✓ 有现货
$4.78 / 个
查看数据手册 →PIC24FJ256GB606T-I/MR 最大额定值与电气特性
| Core Architecture | PIC24F (16-bit modified Harvard RISC) |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Flash Memory | 256 KB (85.5K x 24 words), dual-partition |
| SRAM | 32 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| I/O Pins (Maximum) | 53 |
| USB Interface | USB 2.0 Full-Speed OTG with on-chip transceiver |
| ADC | 10-bit, 16 channels |
| Timers | 7 |
| PWM Channels | 6 |
| Analog Comparators | 3 |
| DMA Channels | 8 |
| UART Modules | 6 |
| SPI Modules | 3 |
| I2C Modules | 3 |
| 工作温度范围 | -40 C to +85 C (Industrial) |
| 封装 | 64-pin QFN (9x9 mm) with exposed pad |
| 安装类型 | Surface Mount |
| MSL 等级 | 3 (168 hours) |
| Lead-Free / RoHS | Yes / Compliant |
PIC24FJ256GB606T-I/MR 引脚配置
| 引脚 1 | RP5/RB5 — Remappable I/O, PPS I/O port B5 |
| 引脚 2 | RP6/RB6 — Remappable I/O, PPS I/O port B6 |
| 引脚 3 | RP7/RB7 — Remappable I/O, PPS I/O port B7 |
| 引脚 4 | RP8/RB8 — Remappable I/O, PPS I/O port B8 |
| 引脚 5 | RP9/RB9 — Remappable I/O, PPS I/O port B9 |
| 引脚 6 | VSS — Ground reference |
| 引脚 7 | VDD — Positive supply, 2.0V-3.6V |
| 引脚 8 | RP10/RB10 — Remappable I/O, PPS I/O port B10 |
| 引脚 9 | RP11/RB11 — Remappable I/O, PPS I/O port B11 |
| 引脚 10 | RP12/RB12 — Remappable I/O, PPS I/O port B12 |
| 引脚 11 | RP13/RB13 — Remappable I/O, PPS I/O port B13 |
| 引脚 12 | RP14/RB14 — Remappable I/O, PPS I/O port B14 |
| 引脚 13 | VSS — Ground reference |
| 引脚 14 | VDD — Positive supply, 2.0V-3.6V |
| 引脚 15 | OSC1/CLKI/RA1 — Crystal input or external clock |
| 引脚 16 | OSC2/CLKO/RA2 — Crystal output or clock out |
| 引脚 17 | AN0/RA0 — Analog input 0 / digital I/O |
| 引脚 18 | AN1/RA1 — Analog input 1 / digital I/O |
| 引脚 19 | VREF-/CVREF-/RA2 — ADC negative reference |
| 引脚 20 | VREF+/CVREF+/RA3 — ADC positive reference |
| 引脚 21 | AN4/RA4 — Analog input 4 / digital I/O |
| 引脚 22 | AN5/RA5 — Analog input 5 / digital I/O |
| 引脚 23 | AN6/RA6 — Analog input 6 / digital I/O |
| 引脚 24 | AN7/RA7 — Analog input 7 / digital I/O |
| 引脚 25 | VSS — Ground reference |
| 引脚 26 | VDD — Positive supply, 2.0V-3.6V |
| 引脚 27 | D+/RC4 — USB D+ data line |
| 引脚 28 | D-/RC5 — USB D- data line |
| 引脚 29 | VBUS/RC6 — USB VBUS detect |
| 引脚 30 | RC7 — Digital I/O |
| 引脚 31 | RC8 — Digital I/O |
| 引脚 32 | RC9 — Digital I/O |
| 引脚 33 | VSS — Ground reference |
| 引脚 34 | VDD — Positive supply, 2.0V-3.6V |
| 引脚 35 | RC10 — Digital I/O |
| 引脚 36 | RC11 — Digital I/O |
| 引脚 37 | RC12 — Digital I/O |
| 引脚 38 | RC13 — Digital I/O |
| 引脚 39 | RC14 — Digital I/O |
| 引脚 40 | RC15 — Digital I/O |
| 引脚 41 | VSS — Ground reference |
| 引脚 42 | VDD — Positive supply, 2.0V-3.6V |
| 引脚 43 | RD0 — Digital I/O port D0 |
| 引脚 44 | RD1 — Digital I/O port D1 |
| 引脚 45 | RD2 — Digital I/O port D2 |
| 引脚 46 | RD3 — Digital I/O port D3 |
| 引脚 47 | RD4 — Digital I/O port D4 |
| 引脚 48 | RD5 — Digital I/O port D5 |
| 引脚 49 | RD6 — Digital I/O port D6 |
| 引脚 50 | RD7 — Digital I/O port D7 |
| 引脚 51 | VSS — Ground reference |
| 引脚 52 | VDD — Positive supply, 2.0V-3.6V |
| 引脚 53 | RD8 — Digital I/O port D8 |
| 引脚 54 | RD9 — Digital I/O port D9 |
| 引脚 55 | RD10 — Digital I/O port D10 |
| 引脚 56 | RD11 — Digital I/O port D11 |
| 引脚 57 | RD12 — Digital I/O port D12 |
| 引脚 58 | RD13 — Digital I/O port D13 |
| 引脚 59 | RD14 — Digital I/O port D14 |
| 引脚 60 | RD15 — Digital I/O port D15 |
| 引脚 61 | VSS — Ground reference |
| 引脚 62 | VDD — Positive supply, 2.0V-3.6V |
| 引脚 63 | RF0 — Digital I/O port F0 |
| 引脚 64 | RF1 — Digital I/O port F1 |
典型应用
PIC24FJ256GB606T-I/MR 适用于 6 应用s: USB HID Peripherals and Dongles, Battery-Powered Medical and Fitness Devices, Portable Industrial Sensor Nodes, USB Data Loggers and Test Instruments, Consumer Audio and Infotainment Accessories, IoT Edge Devices and Smart Home Hubs.
USB HID Peripherals and Dongles
The PIC24FJ256GB606T-I/MR's integrated USB 2.0 Full-Speed OTG controller with on-chip transceiver eliminates the need for an external USB PHY, which lowers BOM cost and PCB area for HID peripherals such as keyboards, mice, game controllers, custom input devices, and USB dongles. The 256KB dual-partition Flash supports Live Update, enabling fail-safe firmware upgrades over USB without bricking the device. With 53 GPIO and PPS (Peripheral Pin Select), designers can route USB plus multiple UART/SPI/I2C endpoints to a single QFN. The 32KB SRAM is sufficient for USB HID class drivers plus a custom protocol stack.
推荐
Battery-Powered Medical and Fitness Devices
Battery-powered medical and fitness devices benefit from the PIC24FJ256GB606T-I/MR's low-power PIC24F architecture, with multiple sleep modes and a wide 2.0V-3.6V supply range that supports direct Li-ion battery connection without an LDO. The integrated USB enables charging and tethered data sync, while 256KB Flash stores months of telemetry logs and the 32KB SRAM buffers real-time sensor streams. The 10-bit ADC and 3 analog comparators handle bio-sensor front ends such as heart-rate and pulse-oximetry. The exposed thermal pad on the 64-QFN aids heat dissipation during high-rate USB data transfer.
推荐
Portable Industrial Sensor Nodes
Industrial sensor nodes that communicate over USB or serial benefit from the PIC24FJ256GB606T-I/MR's 53 GPIO and abundant communication peripherals (6 UART, 3 SPI, 3 I2C), enabling multi-bus sensor aggregation in a single chip. The 256KB dual-partition Flash allows the device to run a full Modbus or proprietary protocol stack plus a sensor calibration library with Live Update for field upgrades. Industrial -40C to +85C temperature range supports outdoor enclosures and factory-floor deployment. The 64-QFN package's small 9x9 mm footprint keeps PCB size small for embedded sensor modules.
推荐
USB Data Loggers and Test Instruments
USB-connected data loggers and bench test instruments require large Flash for sample storage and USB for tethered dump, which is exactly the PIC24FJ256GB606T-I/MR's design sweet spot. The 32KB SRAM accommodates high-speed DMA-driven sampling buffers while the 8 DMA channels offload ADC-to-memory transfers without CPU intervention. The 256KB Flash stores configuration plus a substantial on-device log partition. The integrated USB enables real-time streaming to a host PC without an external bridge IC.
推荐
Consumer Audio and Infotainment Accessories
Consumer audio accessories and infotainment peripherals (USB speakers, headsets, gaming controllers, MIDI devices) leverage the PIC24FJ256GB606T-I/MR's integrated USB Audio class support, PWM channels for tone generation or LED feedback, and large SRAM for audio buffering. The 6 PWM outputs can drive RGB status LEDs without external drivers. The 256KB Flash holds USB class drivers plus application code, and Live Update lets manufacturers push firmware improvements to shipped products. The QFN package's low profile enables slim enclosure designs.
推荐
IoT Edge Devices and Smart Home Hubs
IoT edge devices and smart-home hubs need USB for commissioning, multiple serial buses for sensor aggregation, and dual-partition Flash for safe OTA updates - exactly the PIC24FJ256GB606T-I/MR's feature set. The 6 UARTs can bridge Zigbee, LoRa, and Wi-Fi modules simultaneously, while 3 SPI and 3 I2C ports connect to environmental sensors and displays. The 256KB dual-partition Flash with Live Update is critical for OTA reliability in deployed devices. The wide 2.0V-3.6V supply range supports battery or USB-bus-powered designs.
推荐
推荐产品汇总
工程参考数据： PIC24FJ256GB606T-I/MR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC24FJ128GB606T-I/MR | PIC24FJ1024GB606T-I/MR | PIC24FJ256GB606-I/MR | PIC24FJ256GA606T-I/MR | PIC24FJ1024GA606T-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 256 KB dual-partition | 128 KB dual-partition | 1 MB dual-partition | 256 KB dual-partition | 256 KB dual-partition | 1 MB dual-partition |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| USB Peripheral | USB 2.0 FS OTG with on-chip transceiver | USB 2.0 FS OTG with on-chip transceiver | USB 2.0 FS OTG with on-chip transceiver | USB 2.0 FS OTG with on-chip transceiver | No USB peripheral | No USB peripheral |
| Maximum CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| GPIO (Maximum) | 53 | 53 | 53 | 53 | 53 | 53 |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Packaging Format | Tape and Reel | Tape and Reel | Tape and Reel | Tray | Tape and Reel | Tape and Reel |
关键差异点
- Only 256KB-density GB606 USB variant in standard tape-and-reel packaging （对比 PIC24FJ128GB606T-I/MR)
- 256KB Flash with integrated USB versus GA606 sibling without USB （对比 PIC24FJ256GA606T-I/MR)
- 256KB dual-partition Flash versus 1MB Flash for cost-optimized designs （对比 PIC24FJ1024GB606T-I/MR)
设计说明
Place a 100nF ceramic decoupling capacitor on every VDD/VSS pair of the PIC24FJ256GB606T-I/MR within 1-2mm of the package pad, and add a 4.7uF bulk capacitor on the main 3.3V rail to handle USB inrush current. According to the Microchip datasheet, the USB peripheral draws stepped current during bus attach events and the bulk capacitor prevents VDD droop that can reset the MCU. If powering from a Li-ion cell, route the cell through a low-Iq LDO such as MCP1700 before the MCU VDD pin.
The 64-QFN package on PIC24FJ256GB606T-I/MR exposes a central thermal pad that MUST be soldered to a copper pad on the PCB with multiple thermal vias for heat dissipation. According to the Microchip package outline, the exposed pad is the primary thermal path; without proper soldering the junction-to-ambient thermal resistance rises dramatically, risking thermal shutdown at high USB data rates. A minimum 1 square inch of 1-oz copper pour is recommended for continuous USB Full-Speed traffic.
For USB signal integrity on PIC24FJ256GB606T-I/MR, route the D+ and D- lines as a 90-ohm differential pair with matched length within 150 mil tolerance, and place the 15k pull-down resistor on D- as required by USB Full-Speed specification. According to the Microchip datasheet, the USB peripheral requires a series ferrite bead on VBUS to suppress bus-induced transients. Keep the differential pair away from switching regulators or high-current traces.
Do not allocate the dual-partition Flash incorrectly on PIC24FJ256GB606T-I/MR: each partition must be large enough to hold the full firmware image plus a small bootloader, otherwise Live Update will fail mid-upgrade and brick the device. According to the Microchip PIC24FJ GB6 family datasheet, the partition boundary is configured in the configuration bits and cannot be changed at runtime, so it must be planned during firmware architecture. Always test the Live Update recovery path before deploying products to the field.
合规信息
RoHS and lead-free per Microchip product page; halogen-free status not explicitly stated in web data. Industrial temperature grade -40C to +85C; not AEC-Q100 qualified (consumer/industrial, not automotive).
