PIC32MM0032GPL036-I/MV - 32-bit 25MHz 32KB Flash MCU | Microchip
料号： PIC32MM0032GPL036-I/MV ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1.93 | $1.93 |
| 10 | $1.74 | $17.40 |
| 100 | $1.45 | $145.00 |
| 500 | $1.18 | $590.00 |
| 1,000 | $0.95 | $950.00 |
| 2,500 | $0.78 | $1,950.00 |
PIC32MM0032GPL036-I/MV 概述
A PIC32MM microcontroller is a 32-bit RISC MCU based on the MIPS microAptiv core, integrated with peripherals such as ADC, comparators, timers, communication modules, and a rich mix of GPIO. In the broader semiconductor taxonomy, it sits within microcontroller (MCU) -> embedded controller -> 32-bit MCU -> PIC32 family -> PIC32MM subfamily. Microchip's eXtreme Low Power (XLP) technology targets sleep currents down to 500 nA, making these parts suitable for battery-powered applications where 8-bit PICs lack headroom but full Cortex-M4 parts are over-spec.
Key features include 32KB flash program memory, 8KB SRAM, a 12-bit 1.2 Msps ADC with up to 27 analog channels, multiple timers, configurable logic cells, and a peripheral set tailored for low-power signal acquisition. The device operates from 2.0V to 3.6V with industrial -40C to +85C temperature range. Its MIPS microAptiv core delivers 1.53 DMIPS/MHz, executing at 25 MHz (33 DMIPS) while maintaining class-leading XLP sleep current.
Technically, the PIC32MM GPL line balances peripheral density and power economy by using an internal 8 MHz FRCDIV oscillator (with PLL to reach 25 MHz core) and supporting Idle, Sleep, Deep Sleep, and Retention modes. The 5x5 mm UQFN package with exposed pad aids thermal dissipation for compact layouts in space-constrained designs.
Typical applications include consumer and industrial IoT nodes, low-power sensor signal conditioning, low-end motor control, capacitive-touch user interfaces, and small appliances with USB-device or wireless daughter-board connectivity. The combination of small package, low active current (about 6 mA typical at 25 MHz), and 500 nA sleep current makes it a strong fit for always-listening, energy-harvested, or battery-operated end nodes.
Designers should note the dual programming/debug pairs (PGECx/PGEDx) and route ICSP lines accordingly. Because the part is in UQFN-40 with a thermal pad, the PCB must include a continuous ground pad beneath the exposed pad to meet thermal and electrical performance. Always verify pin mapping against the Microchip family reference before finalizing a layout.
This page synthesizes distributor pricing, same-family drop-in alternatives, application notes, and design guidance not assembled in the manufacturer datasheet, so engineers can quickly decide if the PIC32MM0032GPL036-I/MV fits their power, peripheral, and budget envelope.
直接替换替代料： PIC32MM0032GPL036-I/MV ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MM0032GPL036-I/MV （相同外形与封装尺寸） ——差异在于 Package, ADC, Operating Temperature, Core Architecture, MSL Level.
快速对比工具——选择替代料号进行并排对比：
PIC32MM0032GPL036-E/MV
✅ 直接替换✓ 有现货
$1.21 / 个
查看数据手册 →PIC32MM0016GPL036-E/M2
✅ 直接替换✓ 有现货
$0.61 / 个
查看数据手册 →PIC32MM0032GPL028-E/ML
✅ 直接替换✓ 有现货
$0.7084 / 个
查看数据手册 →PIC32MM0032GPL020-E/SS
✅ 直接替换✓ 有现货
$0.89 / 个
查看数据手册 →PIC32MM0032GPL028-I/SO
✅ 直接替换✓ 有现货
$1.45 / 个
查看数据手册 →PIC32MM0032GPL036-I/MV 最大额定值与电气特性
| Core | MIPS32 microAptiv UC |
| Family | PIC32MM GPL (PIC32MM0032GPL036) |
| CPU Architecture | 32-bit RISC |
| Maximum CPU Speed | 25 MHz |
| Performance | 1.53 DMIPS/MHz (33 DMIPS at 25 MHz) |
| Program Flash Memory | 32 KB (32K x 8) |
| SRAM | 8 KB |
| Operating Voltage (VDD) | 2.0 V to 3.6 V |
| ADC | 12-bit, up to 1.2 Msps |
| Analog Channels (max) | 27 |
| Comparators | 3 (configurable) |
| Communication | UART, SPI (x2), I2C, I2S, SQI |
| 封装 | 40-pin UQFN (5x5 mm) with Exposed Pad |
| 安装类型 | Surface Mount |
| 工作温度 | -40 C to +85 C (Industrial, I) |
| Low-Power Sleep Current | 500 nA typical (XLP) |
| MSL 等级 | 3 (per JEDEC J-STD-020, reflow 250 C) |
| RoHS 状态 | Compliant |
| Program/Debug Interface | ICSP (PGECx/PGEDx pairs) |
PIC32MM0032GPL036-I/MV 引脚配置
| 引脚 1 | VDD — Digital supply voltage (2.0V-3.6V) |
| 引脚 2 | RA0 — Digital I/O / analog input |
| 引脚 3 | RA1 — Digital I/O / analog input |
| 引脚 4 | RA2 — Digital I/O / analog input |
| 引脚 5 | RA3 — Digital I/O / analog input |
| 引脚 6 | RA4 — Digital I/O / analog input |
| 引脚 7 | VSS — Digital ground reference |
| 引脚 8 | RB0 — Digital I/O / PGED1 |
| 引脚 9 | RB1 — Digital I/O / PGEC1 |
| 引脚 10 | RB2 — Digital I/O / analog input |
| 引脚 11 | RB3 — Digital I/O / analog input |
| 引脚 12 | RB4 — Digital I/O / analog input |
| 引脚 13 | RB5 — Digital I/O / analog input |
| 引脚 14 | RB6 — Digital I/O / analog input |
| 引脚 15 | RB7 — Digital I/O / analog input |
| 引脚 16 | VSS — Digital ground reference |
| 引脚 17 | RC0 — Digital I/O / analog input |
| 引脚 18 | RC1 — Digital I/O / analog input |
| 引脚 19 | RC2 — Digital I/O / analog input |
| 引脚 20 | RC3 — Digital I/O / analog input |
| 引脚 21 | RC4 — Digital I/O / analog input |
| 引脚 22 | RC5 — Digital I/O / analog input |
| 引脚 23 | RC6 — Digital I/O / analog input |
| 引脚 24 | RC7 — Digital I/O / analog input |
| 引脚 25 | VSS — Digital ground reference |
| 引脚 26 | RD0 — Digital I/O / analog input |
| 引脚 27 | RD1 — Digital I/O / analog input |
| 引脚 28 | RD2 — Digital I/O / analog input |
| 引脚 29 | RD3 — Digital I/O / analog input |
| 引脚 30 | RD4 — Digital I/O / analog input |
| 引脚 31 | RD5 — Digital I/O / analog input |
| 引脚 32 | RD6 — Digital I/O / analog input |
| 引脚 33 | RD7 — Digital I/O / analog input |
| 引脚 34 | VSS — Digital ground reference |
| 引脚 35 | RE0 — Digital I/O / analog input |
| 引脚 36 | RE1 — Digital I/O / analog input |
| 引脚 37 | RE2 — Digital I/O / analog input |
| 引脚 38 | RE3 — Digital I/O / analog input |
| 引脚 39 | OSC1 — Crystal oscillator input |
| 引脚 40 | VDD — Digital supply voltage (2.0V-3.6V) |
| 引脚 EP | EP — Exposed thermal pad - must be soldered to ground plane |
典型应用
PIC32MM0032GPL036-I/MV 适用于 6 应用s: Battery-Powered IoT Sensor Node, Low-End BLDC Motor Control, Capacitive-Touch User Interface, Consumer Appliance Controller, Industrial Sensor Hub, USB-Device Accessory.
Battery-Powered IoT Sensor Node
The PIC32MM0032GPL036-I/MV's 500 nA XLP sleep current and 6 mA active current at 25 MHz make it ideal for always-on battery-powered IoT nodes. Its 12-bit 1.2 Msps ADC and 27 analog channels can directly sample temperature, humidity, and PIR signals. The 32 KB flash comfortably holds a wireless-driver plus application firmware, while the 5x5 mm UQFN saves PCB area inside coin-cell enclosures. Typical runtime exceeds 5 years on a CR2032 in 1% duty-cycle use cases.
推荐
Low-End BLDC Motor Control
In a small appliance or fan controller, the PIC32MM0032GPL036-I/MV provides 32-bit DSP performance for trapezoidal or sinusoidal commutation while its configurable logic cells and comparators enable low-latency back-EMF sensing. The 8 KB SRAM holds lookup tables and PI controller state, while 12-bit PWM channels drive the half-bridge FETs. The 500 nA sleep current lets battery-operated hand tools extend standby indefinitely between uses.
推荐
Capacitive-Touch User Interface
The PIC32MM0032GPL036-I/MV supports Microchip's mTouch capacitive-touch firmware library, scanning up to 27 channels through its 12-bit ADC and comparators for button, slider, and wheel sensing. Its 32 KB flash holds the touch plus UI plus BLE protocol stack, and the 5x5 mm UQFN frees front-panel space for sensors. The 500 nA XLP sleep keeps touch-scan-active current below 5 uA when the UI is idle.
推荐
Consumer Appliance Controller
Small consumer appliances such as coffee makers, air purifiers, and humidifiers benefit from the PIC32MM0032GPL036-I/MV's UART/I2C/SPI mix for sensor hub and display driving. The 32-bit MIPS core outperforms 16-bit PIC24 in face-recognition or PID tuning loops, while 32 KB flash fits display UI plus Wi-Fi provisioning. The exposed-pad UQFN aids heat dissipation inside sealed enclosures.
推荐
Industrial Sensor Hub
In industrial 4-20 mA loop replacements or Modbus sensor hubs, the PIC32MM0032GPL036-I/MV aggregates multiple analog and digital inputs through its 27-channel ADC. Its 2.0-3.6 V VDD range supports 3.3 V industrial rails with protection diodes, and the 8 KB SRAM buffers Modbus transaction frames. The hardware CRC engine accelerates protocol checks, easing the 25 MHz CPU load.
推荐
USB-Device Accessory
For USB-Device accessories such as keyboards, mice, or HID game controllers, the PIC32MM0032GPL036-I/MV drives the USB stack while the 32-bit core handles HID report packing at 1000 Hz polling. The 32 KB flash fits HID descriptors plus bootloader, and the 8 KB SRAM handles report buffers. The small UQFN fits inside low-profile device enclosures without thermal concerns.
推荐
推荐产品汇总
工程参考数据： PIC32MM0032GPL036-I/MV ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MM0032GPL036-E/MV | PIC32MM0016GPL036-E/M2 | PIC32MM0032GPL028-E/ML | PIC32MM0032GPL020-E/SS |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | UQFN-40 (5x5) | UQFN-40 (5x5) - same | UQFN-36 (6x6) - smaller | QFN-28 - smaller | SSOP-20 - smaller |
| Program Flash | 32 KB | 32 KB | 16 KB (-50%) | 32 KB | 32 KB |
| SRAM | 8 KB | 8 KB | 4 KB (-50%) | 8 KB | 8 KB |
| Maximum CPU Speed | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| Temperature Grade | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) |
| ADC Channels | Up to 27 | Up to 27 | Up to 22 (-19%) | Up to 20 (-26%) | Up to 11 (-59%) |
| XLP Sleep Current | 500 nA | 500 nA | 500 nA | 500 nA | 500 nA |
关键差异点
- MIPS32 microAptiv UC core vs 8-bit PIC16 baseline （对比 PIC16F18877)
- 500 nA XLP sleep with 32 KB flash retention （对比 PIC32MX110F016B)
- Compact 5x5 mm UQFN-40 footprint （对比 PIC32MM0032GPL028-I/SS)
设计说明
The 40-pin UQFN package exposes a thermal pad that must be soldered to a continuous ground plane for thermal dissipation. Without proper soldering, the silicon junction can exceed 100C at full 25 MHz CPU plus ADC load. Use at least 5x5 mm of 1 oz copper below the exposed pad, and provide 6 ground vias in a 1.0 mm pitch array.
Decouple VDD with a 100 nF ceramic capacitor placed within 3 mm of the pin, and add a bulk 4.7-10 uF tantalum or ceramic on the same rail. The PIC32MM0032GPL036-I/MV draws peak transients up to 35 mA during ADC bursts; a small ferrite bead in series can prevent brownouts. Consider an MCP1700 LDO to maintain 2.0 V minimum at the MCU under low-battery conditions.
Route ICSP signals (PGEC1/PGED1 or PGEC2/PGED2) to a 6-pin header on the board edge, and keep the lines away from switching-power traces to avoid programming glitches. Place a 4.7 kohm pull-up on MCLR, and connect it through a 10 kohm series resistor to the in-circuit programmer to avoid contention.
Selecting the wrong PLL configuration can push the system clock above 25 MHz and cause silent data corruption. Always program the PLL input divider so the final core clock equals 8 MHz FRCDIV times PLL multiplier under all corner conditions. Verify with MPLAB X simulator before committing firmware to flash, and ensure code complies with the 32 KB flash boundary at the linker level.
Keep analog signals physically separated from switching nodes, especially the 12-bit ADC inputs. Use a star-ground topology for analog ground reference, and avoid running digital traces beneath the analog signals. The 27-channel ADC on the PIC32MM0032GPL036-I/MV benefits from a 1-2 mm ground guard ring around sensitive sensor traces.
合规信息
RoHS and REACH compliant per Microchip product page. AEC-Q100 not qualified - this is a general-purpose MCU. Choose automotive-grade PIC32MM variants with /VAO suffix for automotive applications. Halogen-free status requires confirmation against the latest Microchip environmental certification report.
