PIC32MX130F064B-V/SP - 40MHz 32-bit MCU 64KB Flash SPDIP-28 | Microchip
料号： PIC32MX130F064B-V/SP ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $5.2 | $5.20 |
| 10 | $4.78 | $47.80 |
| 100 | $4.21 | $421.00 |
| 500 | $3.62 | $1,810.00 |
| 1,000 | $3.15 | $3,150.00 |
PIC32MX130F064B-V/SP 概述
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and a rich set of peripherals on one die. The PIC32MX1xx/2xx family sits in Microchip's PIC32 hierarchy: 32-bit MCU → MIPS M4K core → PIC32MX series → general-purpose connectivity family. Within the broader taxonomy it belongs to embedded microcontrollers → microprocessors → semiconductors → integrated circuits, and competes with Cortex-M0/M3 based parts from ST, NXP, and Renesas.
Key features include Peripheral Pin Select (PPS) for flexible signal routing, two I2S/SPI modules for audio codec interfacing, a Parallel Master Port (PMP) for graphics and external memory, a Charge Time Measurement Unit (CTMU) supporting mTouch capacitive touch sensing, 1 ns high-resolution time measurement, and on-chip temperature measurement. The device runs from 2.3 V to 3.6 V and consumes less than 0.5 mA/MHz active, balancing throughput with low power draw.
The M4K core executes most instructions in one cycle and includes a 5-stage pipeline, single-cycle multiply, and a hardware prefetch module that masks Flash wait states at 40 MHz. The 64 KB Flash is partitioned for boot-loader-friendly operation, and 16 KB SRAM plus DMA support help offload the core in data-mover applications such as USB, UART bridges, and audio streaming.
Typical applications include automotive body and HMI modules, USB audio devices, low-cost graphics terminals using PMP, capacitive touch key/slider front panels, sensor hubs with CTMU, and industrial controllers requiring AEC-Q100 grade parts. The 28-pin SPDIP footprint simplifies prototyping and field-replacement workflows, especially in development and educational environments.
When designing with this MCU, plan decoupling around each VDD/VSS pair and route the 40 MHz crystal traces symmetrically with a ground guard ring. For automotive deployments use the -V grade variant (this part) and validate against AEC-Q100 stress profiles. For USB applications, populate the on-chip transceiver's required external resistor and ESD protection per the family data sheet.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives (including same-package PIC32MX130 variants and temperature-grade variants), and practical design notes not found in the manufacturer datasheet, giving engineers an information gain over Microchip's product page.
直接替换替代料： PIC32MX130F064B-V/SP ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MX130F064B-V/SP （相同外形与封装尺寸） ——差异在于 Package, Program Memory (Flash), Mounting Type, Operating Temperature, Timers.
快速对比工具——选择替代料号进行并排对比：
PIC32MX130F064B-I/SP
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MX130F064BT-V/SO
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1.58 / 个
查看数据手册 →PIC32MX230F064B-V/SP
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
PIC32MX130F064B-V/ML
✅ 直接替换✓ 有现货
$2.54 / 个
查看数据手册 →PIC32MX130F064B-V/SP 最大额定值与电气特性
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 40 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| SRAM | 16 KB |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| 工作温度 | -40°C to +125°C (Automotive / -V grade) |
| I/O Pins | 21 |
| 封装 | 28-pin SPDIP (Skinny Plastic DIP, 0.300" / 7.62 mm) |
| Active Current Consumption | <0.5 mA/MHz (typical) |
| AEC-Q100 Grade | Qualified (Automotive -V variant) |
| Timers | Five 16-bit and up to two 32-bit timers |
| Communication Interfaces | 2x I2S/SPI, I2C, UART, USB, PMP |
| Peripheral Pin Select (PPS) | Yes |
| Charge Time Measurement Unit (CTMU) | Yes (mTouch capacitive touch support) |
| On-chip Temperature Sensor | Yes |
| 安装类型 | Through-Hole (DIP) |
PIC32MX130F064B-V/SP 引脚配置
| 引脚 1 | MCLR — Master Clear (Reset) input, active-low |
| 引脚 2 | RP0/PMP — Remappable I/O / Parallel Master Port data |
| 引脚 3 | RP1/PMP — Remappable I/O / Parallel Master Port data |
| 引脚 4 | RP2/PMP — Remappable I/O / Parallel Master Port data |
| 引脚 5 | RP3/PMP — Remappable I/O / Parallel Master Port data |
| 引脚 6 | RP4/PMP — Remappable I/O / Parallel Master Port data |
| 引脚 7 | RP5/PMP — Remappable I/O / Parallel Master Port data |
| 引脚 8 | RP6/PMP — Remappable I/O / Parallel Master Port data |
| 引脚 9 | RP7/PMP — Remappable I/O / Parallel Master Port data |
| 引脚 10 | RP8 — Remappable I/O |
| 引脚 11 | VDD — Positive supply voltage (2.3 V to 3.6 V) |
| 引脚 12 | VSS — Ground reference |
| 引脚 13 | RP9 — Remappable I/O |
| 引脚 14 | RP10 — Remappable I/O |
| 引脚 15 | RP11 — Remappable I/O |
| 引脚 16 | RP12 — Remappable I/O |
| 引脚 17 | RP13 — Remappable I/O |
| 引脚 18 | PGEC1 — ICSP clock (pair with PGED1) |
| 引脚 19 | PGED1 — ICSP data (pair with PGEC1) |
| 引脚 20 | RP14 — Remappable I/O |
| 引脚 21 | RP15 — Remappable I/O |
| 引脚 22 | RP16 — Remappable I/O |
| 引脚 23 | RP17 — Remappable I/O |
| 引脚 24 | RP18 — Remappable I/O / SDA1 |
| 引脚 25 | RP19 — Remappable I/O / SCL1 |
| 引脚 26 | PGEC2 — ICSP clock alternate (pair with PGED2) |
| 引脚 27 | PGED2 — ICSP data alternate (pair with PGEC2) |
| 引脚 28 | VDD — Positive supply voltage (2.3 V to 3.6 V) |
典型应用
PIC32MX130F064B-V/SP 适用于 6 应用s: Automotive Body Electronics Modules, USB Audio / Human Interface Devices, mTouch Capacitive Touch Panels, Low-Cost Graphics Terminal (PMP-based), Industrial Sensor Hubs, Educational & Prototyping Platforms.
Automotive Body Electronics Modules
The PIC32MX130F064B-V/SP's -V grade (AEC-Q100 qualified, -40C to +125C) and 40 MHz MIPS M4K core make it well suited for automotive body and HMI modules such as window controllers, mirror adjusters, seat controllers, and lighting drivers. With 21 GPIO pins plus Peripheral Pin Select (PPS), engineers can route LIN/CAN/UART, PWM channels, and ADC inputs flexibly across the PCB without rewiring the schematic. The 16 KB SRAM supports small LIN stacks and event buffers, while the CTMU enables robust capacitive touch buttons on door handles and overhead consoles that must operate across -40C to +125C ambient temperatures.
推荐
USB Audio / Human Interface Devices
The PIC32MX130F064B-V/SP integrates a full-speed USB 2.0 peripheral plus two I2S/SPI modules, making it a strong fit for low-cost USB headsets, headphone amplifiers, and HID devices. The 64 KB Flash comfortably holds USB stacks, descriptor tables, and codec drivers, while 16 KB SRAM handles audio ping-pong buffers at 48 kHz/16-bit. I2S pinout via Peripheral Pin Select simplifies PCB routing between the MCU and external DACs or ADCs. Compared to ARM Cortex-M0 alternatives, the M4K core's deterministic interrupt latency benefits USB polling without jitter.
推荐
mTouch Capacitive Touch Panels
The PIC32MX130F064B-V/SP's integrated Charge Time Measurement Unit (CTMU) supports Microchip's mTouch capacitive sensing library, enabling reliable touch buttons, sliders, and proximity sensors on glass and plastic overlays. The CTMU delivers sub-nanosecond timing resolution, which is essential for distinguishing small capacitance changes in noisy automotive or industrial environments. With 21 GPIO and PPS, the chip can scan 10+ electrodes while still serving as the main application processor. Designers targeting -40C to +125C environments benefit from the -V grade's AEC-Q100 qualification.
推荐
Low-Cost Graphics Terminal (PMP-based)
The PIC32MX130F064B-V/SP's Parallel Master Port (PMP) can directly drive small parallel TFT LCDs and external memory-mapped peripherals, enabling low-cost graphics terminals, kiosks, and operator panels. At 40 MHz the M4K core renders simple UI screens while keeping BOM cost low - no external graphics controller required. The 64 KB Flash holds fonts and bitmaps, and 16 KB SRAM is sufficient for off-screen rendering of 320x240 QVGA frames in indexed color. The automotive-grade -V part is ideal for industrial operator panels operating in harsh environments.
推荐
Industrial Sensor Hubs
The PIC32MX130F064B-V/SP is well matched to industrial sensor hubs that aggregate analog inputs from thermocouples, RTDs, pressure, and flow sensors and forward data over RS-485, CAN, or USB. Its on-chip 10-bit 1 MSPS ADC (1.3 Msps) plus five 16-bit timers let one chip scan multiple transducers with hardware-triggered sampling and DMA offload. The CTMU adds temperature measurement capability, useful for cold-junction compensation on thermocouple front-ends. The -40C to +125C operating range supports installation in factory cabinets and outdoor enclosures.
推荐
Educational & Prototyping Platforms
The PIC32MX130F064B-V/SP's 28-pin SPDIP through-hole package is breadboard-friendly and easy to hand-rework, which makes it a popular choice for university courses, hobbyists, and prototype builds. The 40 MHz M4K core, 64 KB Flash, and 16 KB SRAM support real embedded workloads (RTOS, USB stacks, file systems) within Microchip's MPLAB Harmony ecosystem. Drop-in compatibility with the industrial -I/SP variant lets students upgrade to the automotive -V grade for projects targeting AEC-Q100-style thermal stress tests without redesigning the PCB.
推荐
推荐产品汇总
工程参考数据： PIC32MX130F064B-V/SP ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MX130F064B-I/SP | PIC32MX230F064B-V/SP | PIC32MX130F064B-V/ML |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-pin SPDIP (through-hole) | 28-pin SPDIP (through-hole) | 28-pin SPDIP (through-hole) | 28-pin QFN (surface-mount) - NOT pin-compatible drop-in |
| Core / Architecture | MIPS32 M4K, 32-bit | MIPS32 M4K, 32-bit | MIPS32 M4K, 32-bit | MIPS32 M4K, 32-bit |
| Maximum CPU Speed | 40 MHz | 40 MHz | 50 MHz | 40 MHz |
| Flash Memory | 64 KB | 64 KB | 128 KB | 64 KB |
| SRAM | 16 KB | 16 KB | 32 KB | 16 KB |
| Operating Temperature | -40C to +125C (Automotive / -V) | -40C to +85C (Industrial / -I) | -40C to +125C (Automotive / -V) | -40C to +125C (Automotive / -V) |
| AEC-Q100 Qualified | Yes | No (industrial only) | Yes | Yes |
关键差异点
- Automotive AEC-Q100 Grade 1 qualification in a breadboard-friendly SPDIP （对比 PIC32MX130F064B-I/SP)
- Pin-compatible upgrade path with 128 KB Flash on same SPDIP-28 footprint （对比 PIC32MX230F064B-V/SP)
- On-chip CTMU for mTouch capacitive touch without external IC （对比 PIC32MX130F064B-V/ML)
设计说明
The PIC32MX130F064B-V/SP accepts 2.3 V to 3.6 V on VDD; place a 100 nF decoupling cap adjacent to each VDD/VSS pair on the SPDIP-28 package (pins 11/12 and 28/12 in this pinout), plus a bulk 10 uF near the IC. According to the family data sheet, the device draws under 0.5 mA/MHz active; for low-power sleep modes use the on-chip LPRC 31 kHz oscillator and verify wake-up time against your application timing budget.
Route the 40 MHz crystal traces (OSC1/OSC2) symmetrically with a ground guard ring and keep trace lengths under 5 mm to minimize parasitic capacitance. The USB D+/D- traces require 90-ohm differential impedance and a common-mode choke or ferrite for EMI suppression. PGECx/PGEDx pairs must be routed as matched-length pairs and not be shared with other signal traces, otherwise ICSP programming becomes unreliable on production boards.
The -V automotive grade is qualified for -40C to +125C junction temperature; in an SPDIP-28 package, thermal resistance is typically around 60 C/W theta_JA on a 1 oz 2-layer board. At 40 MHz active mode (~20 mA total) the part dissipates ~70 mW, which is well within budget. For sealed automotive enclosures with no airflow, derate by adding copper pours under the exposed leads and verify with a thermocouple measurement on first prototypes.
Do not omit the 10 kohm pull-up on MCLR (pin 1) - a floating MCLR causes spurious resets and unreliable ICSP programming. When using Peripheral Pin Select (PPS), lock the IOCON register after configuration or peripheral functions can drift after reset. For USB device mode, an external 1.5 kohm pull-up on D+ is required; the on-chip pull-up is only enabled in software and may not meet USB-IF compliance timing without external assistance.
合规信息
AEC-Q100 Grade 1 automotive qualified per Microchip product page. RoHS and REACH compliant; lead-free and halogen-free per Microchip packaging materials declaration. Conflict-minerals statement available from Microchip corporate compliance.
