PIC32MX150F256LT-50I/GJX - 50MHz 32-bit MCU, 256KB Flash | Microchip
料号： PIC32MX150F256LT-50I/GJX ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $6.42 | $6.42 |
| 10 | $5.93 | $59.30 |
| 100 | $5.34 | $534.00 |
| 500 | $4.78 | $2,390.00 |
| 1,000 | $4.21 | $4,210.00 |
PIC32MX150F256LT-50I/GJX 概述
A PIC32MX microcontroller belongs to the 32-bit MCU family (hypernym chain: microcontroller -> embedded MCU -> 32-bit MCU -> MIPS-based MCU -> semiconductor IC). The PIC32MX1XX/2XX series is Microchip's mid-range 32-bit family, bridging 8-bit PIC16/PIC18 designs and the higher-end PIC32MZ line. It uses the MIPS32 M4K core with hardware multiply/divide and a 5-stage pipeline, delivering ~1.56 DMIPS/MHz. The on-chip FPU is absent in this family; math-heavy DSP code runs in fixed-point.
Key features of the PIC32MX150F256LT-50I/GJX include 256 KB single-cycle Flash with live update support, 32 KB SRAM, 16-channel 10-bit ADC at 1 Msps, five 16-bit timers, two I2C, two UART, two I2S, four SPI, and a Parallel Master Port. The CTMU (Charge Time Measurement Unit) enables touch sensing and precise time-of-flight measurements. PPS remaps digital peripherals to nearly any I/O pin, simplifying PCB routing.
Architecturally, the device uses a Harvard-style bus with separate Flash and SRAM paths, a prefetch module that mitigates flash wait states at 50 MHz, and a multi-vectored interrupt controller. The PMP peripheral can drive external graphics controllers or SRAM, while DMA offloads I2S, ADC, and UART transfers, leaving the CPU free for application logic.
Typical applications include audio playback/recording with I2S codecs, low-resolution TFT graphics via PMP, USB-less HMI boards, industrial sensor hubs, and cost-sensitive consumer products needing 32-bit performance. The wide peripheral mix suits IoT edge nodes and motor-control front-ends.
Designers should allocate a 2.5 V or 3.3 V LDO with adequate bulk capacitance and route the 50 MHz traces as controlled impedance. For 100-pin TFBGA, use 0.4 mm-pitch escape routing and a 4-layer stack-up with continuous GND pour. Always program the configuration bits (windowed watchdog, oscillator selection) before the first instruction fetch.
This page aggregates distributor pricing, drop-in 100-pin alternatives, and engineering notes that complement the manufacturer datasheet and accelerate your BOM decision.
直接替换替代料： PIC32MX150F256LT-50I/GJX ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MX150F256LT-50I/GJX （相同外形与封装尺寸） ——差异在于 Package, ADC, Core Architecture, Parallel Master Port (PMP), DMA Channels.
快速对比工具——选择替代料号进行并排对比：
PIC32MX150F256LT-I/GJX
✅ 直接替换✓ 有现货
$3.79 / 个
查看数据手册 →PIC32MX170F256LT-50I/GJX
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MX250F256LT-50I/GJX
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MX150F256LT-50I/PT
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MX270F256DT-I/PT
✅ 直接替换✓ 有现货
$3.92 / 个
查看数据手册 →PIC32MX130F256D-50I/PT
✅ 直接替换✓ 有现货
$3.42 / 个
查看数据手册 →PIC32MX150F256LT-50I/GJX 最大额定值与电气特性
| Core Architecture | MIPS32 M4K, 32-bit |
| Maximum CPU Frequency | 50 MHz |
| DMIPS Performance | 83 DMIPS |
| Program Flash | 256 KB (256K x 8) |
| SRAM | 32 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| 工作温度 | -40C to +85C (Industrial) |
| ADC | 10-bit, 16-channel, up to 1 Msps |
| I2S Modules | 2 |
| SPI Modules | 4 |
| UART Modules | 2 |
| I2C Modules | 2 |
| 16-bit Timers | 5 |
| DMA Channels | Yes (8 channels) |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes, dual read/write buffers |
| CTMU | Yes (Charge Time Measurement Unit) |
| 封装 | 100-ball TFBGA, 7x7 mm, 0.4 mm pitch |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
PIC32MX150F256LT-50I/GJX 100-ball tfbga, 7x7 mm, 0.4 mm pitch 引脚配置指南
PIC32MX150F256LT-50I/GJX（100-ball tfbga, 7x7 mm, 0.4 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： PIC32MX150F256LT-50I/GJX.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PIC32MX150F256LT-50I/GJX 适用于 6 应用s: Audio Playback and Recording Systems, Industrial Sensor Hubs and Data Acquisition, Low-Resolution TFT HMI and Graphics Interfaces, USB-less Consumer Embedded Products, IoT Edge Nodes and BLE Bridge Boards, Motor Control and PWM Front-Ends.
Audio Playback and Recording Systems
The PIC32MX150F256LT-50I/GJX suits I2S-based audio products where dual I2S interfaces and DMA offload matter. Its 50 MHz M4K core delivers 83 DMIPS, easily running audio codecs at 48 kHz/16-bit alongside light UI logic, while 32 KB SRAM holds double-buffered PCM frames for glitch-free playback. Designers pair the chip with low-power stereo codecs (e.g., Microchip's WM8904) and route I2S, I2C control, and DMA streams over the Parallel Master Port when a small TFT is added. Compared with 8-bit PIC16/PIC18 devices, this part removes the need for codec pre-mixing in software. Estimated: with VDD = 3.3 V and full DMA utilization, the core stays below 25 mA during stereo 48 kHz playback.
推荐
Industrial Sensor Hubs and Data Acquisition
With a 16-channel 10-bit ADC at 1 Msps, eight DMA channels, and 5x 16-bit timers, the PIC32MX150F256LT-50I/GJX handles multi-sensor aggregation in industrial nodes. The CTMU enables capacitive touch or time-of-flight distance measurement for proximity and level sensing, while 32 KB SRAM buffers sensor frames before UART/SPI uplinks. Industrial -40C to +85C qualification and 2.3 V to 3.6 V operation simplify integration with 3.3 V sensor rails and battery-backed supercaps. Designers typically chain UART to RS-485 transceivers and use PPS to remap peripherals around layout constraints, eliminating trace crossings on dense sensor boards.
推荐
Low-Resolution TFT HMI and Graphics Interfaces
The PIC32MX150F256LT-50I/GJX integrates a Parallel Master Port (PMP) with dual read/write buffers, enabling direct interface to small TFT controllers without external logic. Its 50 MHz core supports typical WQVGA 480x272 panels, refreshing 60 Hz with 16-bit color from 32 KB frame buffer plus tile cache. Peripheral Pin Select routes 8-bit data, sync, and PWM-controlled backlight across any 8 GPIOs, simplifying PCB stackups. For monochrome OLED, the same PMP drives SSD1309 controllers with no extra bus logic. Compared to SPI-only MCUs that struggle past QVGA, this PIC32 part adds headroom for touch scanning and on-screen animations.
推荐
USB-less Consumer Embedded Products
For consumer devices without USB (home appliances, toys, fitness accessories), the PIC32MX150F256LT-50I/GJX delivers strong 32-bit performance at modest cost. Its two UART, two I2C, four SPI, and two I2S cover Bluetooth/BLE daughter modules, MEMS microphones, and segment LCDs. The 256 KB Flash accommodates rich UI logic, BLE state machines, and simple RTOS kernels, while 32 KB SRAM supports message queues. The TFBGA package saves space in slim enclosures; designers verify JTAG/ICSP routing for factory programming and reserve the two I2S interfaces for an external DAC path on premium SKUs.
推荐
IoT Edge Nodes and BLE Bridge Boards
The PIC32MX150F256LT-50I/GJX pairs naturally with a Bluetooth or sub-GHz radio daughter module for IoT edge gateways. Its 4 SPI, 2 UART, and PPS routing allow concurrent connections to BLE modems, sensors, and an external NOR flash. 32 KB SRAM holds TLS/HTTP stacks for cloud-bootstrap sequences, while 256 KB Flash accommodates Over-The-Air update images with rollback. Operating at 2.3 V to 3.6 V, the part works directly from a 3.3 V LDO downstream of a battery charger. Compared to bare 8-bit MCUs, this design frees engineers to implement secure boot, encrypted firmware, and local analytics.
推荐
Motor Control and PWM Front-Ends
The PIC32MX150F256LT-50I/GJX provides five 16-bit timers plus PPS, enough for brushless DC motor commutation, servo control, or stepper sequencing at modest RPMs. The 50 MHz core can run field-oriented control loops for low-power BLDC fans, with the 10-bit ADC sampling back-EMF at the required PWM rate. DMA-driven ADC transfers keep timing jitter minimal, while 32 KB SRAM holds diagnostic buffers. Designers add external gate drivers and current-sense amplifiers because the MCU lacks on-chip high-side drivers. For higher-power three-phase systems, consider PIC32MK devices with built-in PWM modules.
推荐
推荐产品汇总
工程参考数据： PIC32MX150F256LT-50I/GJX ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MX150F256LT-I/GJX | PIC32MX170F256LT-50I/GJX | PIC32MX250F256LT-50I/GJX | PIC32MX270F256DT-I/PT | PIC32MX130F256D-50I/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-ball TFBGA (7x7 mm) | 100-ball TFBGA (7x7 mm) | 100-ball TFBGA (7x7 mm) | 100-ball TFBGA (7x7 mm) | 100-pin TQFP (14x14 mm) | 100-pin TQFP (14x14 mm) |
| Core | MIPS32 M4K, 50 MHz, 83 DMIPS | MIPS32 M4K, 40 MHz, ~66 DMIPS | MIPS32 M4K, 50 MHz, 83 DMIPS | MIPS32 M4K, 50 MHz, 83 DMIPS | MIPS32 M4K, 50 MHz, 83 DMIPS | MIPS32 M4K, 50 MHz, 83 DMIPS |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 32 KB | 32 KB | 64 KB | 128 KB | 64 KB | 16 KB |
| USB 2.0 FS | No | No | Yes | Yes | Yes + CAN | No |
| I2S Modules | 2 | 2 | 2 | 2 | 2 | 2 |
| Peripheral Pin Select (PPS) | Yes | Yes | Yes | Yes | Yes | Yes |
| CTMU | Yes | Yes | Yes | Yes | Yes | No |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
关键差异点
- Mature MIPS32 M4K core with 83 DMIPS at 50 MHz （对比 PIC32MX130F256D-50I/PT)
- Dual I2S plus Parallel Master Port (PMP) for graphics/audio （对比 PIC32MX170F256LT-50I/GJX)
- 100-ball TFBGA in compact 7x7 mm outline （对比 PIC32MX150F256LT-50I/PT)
设计说明
The 100-ball TFBGA (7x7 mm, 0.4 mm pitch) requires 4-layer PCB stack-up with 0.2 mm (8 mil) vias-in-pad and a continuous GND plane under the BGA. Escape route on the top layer uses micro-vias; signal traces fan out on internal layers 2 and 3 with reference to GND/VCC. Use ENIG finish to ensure reliable BGA solder joints and avoid HASL for fine-pitch parts. Estimated: at 0.4 mm pitch, design rule check (DRC) needs 0.075 mm clearance and 0.075 mm trace width.
Power the PIC32MX150F256LT-50I/GJX from a 3.3 V LDO with at least 200 mA headroom; place 0.1 uF ceramic decoupling caps on every VDD pin and a 4.7 uF bulk cap on the regulator output within 10 mm of the BGA. The analog supply AVDD must be filtered through a ferrite bead from VDD, with its own 0.1 uF + 10 uF cap. Estimated: at 50 MHz full-load active mode, the core draws ~25 mA; sleep current drops to <20 uA with all peripherals off.
Always configure the FSOSCEN, FNOSC, and POSC bits in the DEVCFG0/DEVCFG1 configuration words before the first instruction fetch - leaving the device in the default FRC mode can mislead early firmware debugging. Also ensure JTAGEN is disabled in production for security, and add proper BOR (brown-out reset) thresholds matched to your LDO dropout. For TFBGA, watch for cold solder joints on center balls; use X-ray inspection during NPI.
Use Peripheral Pin Select (PPS) to route digital peripherals away from analog signals - keep ADC inputs on dedicated ANx pins whenever possible to avoid switching-noise coupling. Place the 32.768 kHz crystal as close as possible to the SOSCO/SOSCI pins with a ground guard ring. If using I2S, route MCLK, BCLK, and LRCK as length-matched pairs (within 5 mm) to avoid timing drift in audio frames.
合规信息
RoHS compliant per Microchip product page; industrial temperature grade (-40C to +85C). Not AEC-Q100 qualified - for automotive use, select PIC32MX1xx AEC-Q100 variants.
