PIC32MX170F256B-I/ML - 256KB Flash 32-bit MCU, 40MHz | Microchip
料号： PIC32MX170F256B-I/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $5.12 | $5.12 |
| 10 | $4.61 | $46.10 |
| 100 | $4.1 | $410.00 |
| 500 | $3.68 | $1,840.00 |
| 1,000 | $3.25 | $3,250.00 |
PIC32MX170F256B-I/ML 概述
A microcontroller is a single-chip computer that integrates a CPU core, program and data memory, and a rich set of peripheral interfaces on one die. PIC32MX devices sit in the hierarchy: MIPS32 M4K core -> 32-bit MCU -> PIC32 family -> 16/32-bit microcontroller -> embedded computing platform. Compared with 8-bit AVR or PIC16/PIC18 parts, PIC32MX170 devices offer a 32-bit datapath, hardware multiply/divide, deterministic interrupt latency, and USB 2.0 full-speed OTG, while retaining the PIC ecosystem's MPLABX, Harmony, and XC32 toolchain support.
Key features include two I2S/SPI modules for audio codecs, Peripheral Pin Select (PPS) for flexible pin mapping, a Parallel Master Port (PMP) for graphics interfaces, mTouch capacitive touch support, a 10-bit ADC with on-chip temperature measurement, and a high-resolution 1 ns timer/capture. The 28-QFN (6x6) package provides compact board placement and an exposed pad that improves thermal dissipation at higher clock rates.
Typical applications include USB audio peripherals, low-cost graphics HMI with PMP-driven LCDs, capacitive-touch user interfaces, and mixed-signal control nodes. The wide operating voltage (2.3-3.6V) and industrial temp grade (-40C to +85C for the I-suffix) suit battery-powered and industrial designs.
When laying out a board, follow the datasheet's decoupling guidance (one 0.1 uF per VDD pair plus a bulk cap), assign PPS mappings carefully, and use the exposed thermal pad with a continuous ground plane for heat extraction. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： PIC32MX170F256B-I/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MX170F256B-I/ML （相同外形与封装尺寸） ——差异在于 Package, ADC, USB, Operating Temperature, Timers.
快速对比工具——选择替代料号进行并排对比：
PIC32MX170F256B-50I/ML
✅ 直接替换✓ 有现货
$3.46 / 个
查看数据手册 →PIC32MX130F256B-I/ML
✅ 直接替换✓ 有现货
$4.12 / 个
查看数据手册 →PIC32MX154F128B-I/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MX150F256B-I/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MX170F256B-I/MM
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MX170F256B-I/ML 最大额定值与电气特性
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 40 MHz (50 MHz on -50I variants) |
| DMIPS | 83 DMIPS |
| Flash Program Memory | 256 KB |
| SRAM | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Typical Active Current | 0.5 mA/MHz |
| ADC | 10-bit |
| I2S/SPI Modules | 2 |
| Parallel Master Port (PMP) | Yes |
| USB | USB 2.0 Full-Speed OTG |
| Peripheral Pin Select (PPS) | Yes |
| mTouch Capacitive Touch | Supported |
| On-chip Temperature Sensor | Yes |
| High-Resolution Timer | 1 ns capture |
| 封装 | 28-QFN (6x6 mm) with Exposed Pad |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +85C (Industrial) |
| RoHS 状态 | Compliant |
PIC32MX170F256B-I/ML 引脚配置
| 引脚 1 | RB1 — GPIO/AN/PPS-capable pin |
| 引脚 2 | RB0 — GPIO/AN/PPS-capable pin (PGED1/AN0) |
| 引脚 3 | RB2 — GPIO/AN/PPS-capable pin |
| 引脚 4 | RB3 — GPIO/AN/PPS-capable pin |
| 引脚 5 | VSS — Ground reference |
| 引脚 6 | RB4 — GPIO/SDA2/PMP-capable pin |
| 引脚 7 | RB5 — GPIO/SCL2/PMP-capable pin |
| 引脚 8 | RB6 — GPIO/PMP-capable pin |
| 引脚 9 | RB7 — GPIO/PMP-capable pin |
| 引脚 10 | RB8 — GPIO/PMP-capable pin |
| 引脚 11 | RB9 — GPIO/PMP-capable pin |
| 引脚 12 | VSS — Ground reference |
| 引脚 13 | RA5 — GPIO/USB-VBUS-sense (VBUS) |
| 引脚 14 | RA3 — GPIO/SDA1 (I2C1) |
| 引脚 15 | RA2 — GPIO/SCL1 (I2C1) |
| 引脚 16 | RA1 — GPIO/PGEC1/INT1 (programming/ICSP clock) |
| 引脚 17 | RA0 — GPIO/PMP-capable pin |
| 引脚 18 | VDD — Digital supply 2.3-3.6 V |
| 引脚 19 | OSC1 — Crystal oscillator input (primary) |
| 引脚 20 | OSC2 — Crystal oscillator output (primary) |
| 引脚 21 | D+ — USB D+ (USB Full-Speed) |
| 引脚 22 | D- — USB D- (USB Full-Speed) |
| 引脚 23 | VDD — Digital supply 2.3-3.6 V |
| 引脚 24 | RB15 — GPIO/PMP-capable pin |
| 引脚 25 | RB14 — GPIO/PMP-capable pin (SCL1 alt) |
| 引脚 26 | RB13 — GPIO/PMP-capable pin (SDA1 alt) |
| 引脚 27 | RB11 — GPIO/PMP-capable pin |
| 引脚 28 | RB10 — GPIO/PMP-capable pin |
| 引脚 29 | EP — Exposed thermal pad - solder to ground for thermal dissipation |
典型应用
PIC32MX170F256B-I/ML 适用于 6 应用s: USB Audio Peripherals, Low-Cost Graphics HMI with PMP, Capacitive Touch User Interfaces, Battery-Powered Sensor Nodes, Industrial Control and Monitoring, USB Barcode / RFID Readers.
USB Audio Peripherals
The PIC32MX170F256B-I/ML is well suited to USB audio peripherals thanks to its integrated USB 2.0 Full-Speed OTG controller and dual I2S/SPI interfaces. With 256 KB Flash it can hold a USB audio class stack plus codec drivers, while the 64 KB SRAM comfortably buffers stereo 48 kHz 16-bit streams. The two I2S ports connect directly to common codecs such as the WM8731 or SGTL5000 without external glue logic, and the on-chip PLL generates the required 48 MHz USB reference from a low-cost 8 MHz crystal. Typical products include USB headphones, USB microphones, and external USB sound cards.
推荐
Low-Cost Graphics HMI with PMP
The PIC32MX170F256B-I/ML drives low-resolution graphical LCDs through its Parallel Master Port (PMP) peripheral, eliminating the need for an external display controller. With up to 40 MHz CPU performance and 64 KB SRAM, it can refresh small QVGA or character/graphic displays while still running a USB stack for configuration. Peripheral Pin Select (PPS) simplifies the PCB routing of the 8/16-bit PMP data bus on the compact 28-QFN footprint. Typical uses include appliance front panels, portable instrument displays, and battery-powered HMI terminals.
推荐
Capacitive Touch User Interfaces
The PIC32MX170F256B-I/ML supports Microchip's mTouch capacitive touch library for buttons, sliders, and proximity sensors. The 256 KB Flash holds the touch firmware plus a small RTOS or state handler, and the 1 ns high-resolution timer captures precise charge/discharge timings required for noise-immune touch decoding. The exposed thermal pad on the 28-QFN helps with thermals in enclosed touch panels, while PPS allows the touch channels to be remapped to convenient package pins. Typical designs include kitchen appliances, medical handhelds, and industrial control keypads.
推荐
Battery-Powered Sensor Nodes
The PIC32MX170F256B-I/ML fits battery-powered sensor nodes because of its low 0.5 mA/MHz active current, multiple sleep modes (sleep, idle, deep sleep with RTCC), and 2.3-3.6 V wide operating voltage. The 10-bit ADC with on-chip temperature sensor supports direct measurement of battery and environmental parameters, while USB Fast Link and CMSIS-friendly peripherals enable field-updateable firmware. The 28-QFN package with exposed thermal pad keeps the board area small for wearables and remote sensors.
推荐
Industrial Control and Monitoring
The PIC32MX170F256B-I/ML with its industrial -40C to +85C temperature range, USB OTG, and PMP interfaces is well suited to industrial control and monitoring nodes. USB enables in-field configuration and firmware upgrade, while I2S/SPI and UART peripherals support modbus or proprietary industrial protocols. PPS flexibility on the compact 28-QFN simplifies routing when integrating the MCU alongside motor drivers or sensor front-ends. Typical uses include programmable logic controllers, distributed I/O, and industrial data loggers.
推荐
USB Barcode / RFID Readers
The PIC32MX170F256B-I/ML provides the USB host and device endpoints needed for barcode scanners and RFID readers that must enumerate as USB HID or CDC peripherals. The 256 KB Flash supports USB stacks plus symbol decoding libraries, and PPS allows the scanner trigger GPIO and UART lines to be mapped to convenient pins on the 28-QFN. Industrial temperature grade enables use in warehouses and cold-storage facilities. Typical designs include handheld USB barcode wands, RFID scanners, and POS peripherals.
推荐
推荐产品汇总
工程参考数据： PIC32MX170F256B-I/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MX170F256B-50I/ML | PIC32MX130F256B-I/ML | PIC32MX154F128B-I/ML | PIC32MX150F256B-I/ML | PIC32MX170F256B-I/MM |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Maximum CPU Clock | 40 MHz | 50 MHz (+25%) | 40 MHz | 50 MHz (+25%) | 40 MHz | 40 MHz (identical) |
| Flash Memory | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 256 KB | 256 KB (identical) |
| SRAM | 64 KB | 64 KB | 64 KB | 32 KB (-50%) | 64 KB | 64 KB (identical) |
| USB OTG | Yes (USB 2.0 FS) | Yes | No | No | No | Yes (identical) |
| Parallel Master Port (PMP) | Yes | Yes | Yes | Yes | No | Yes (identical) |
| Peripheral Pin Select (PPS) | Yes | Yes | Yes | Yes | Yes | Yes (identical) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Approx. Unit Price (USD) | $5.12 | $5.40 | $4.30 | $3.80 | $4.10 | $5.12 |
关键差异点
- Highest Flash + USB + PMP combination in 28-QFN PIC32MX1xx family （对比 PIC32MX150F256B-I/ML)
- Industrial temperature grade (-40C to +85C) with USB （对比 PIC32MX130F256B-I/ML)
- Peripheral Pin Select flexibility on a 28-QFN footprint （对比 PIC32MX154F128B-I/ML)
设计说明
Place one 0.1 uF decoupling capacitor within 3 mm of each VDD/VSS pin pair, plus a single 10 uF bulk capacitor near the MCU's largest current load pin. According to the Microchip datasheet, the exposed thermal pad (EP) of the 28-QFN package MUST be soldered to a continuous copper ground pour to provide the 24-40 C/W thermal dissipation needed at 40 MHz; otherwise the junction temperature may exceed limits in enclosed industrial housings.
Use 4-layer PCB stackup with a continuous ground plane under the MCU for the USB D+/D- traces to maintain 90 mOhm differential impedance. According to the Microchip datasheet, the USB traces must be length-matched within 150 mil and isolated from switching signals; add a common-mode choke near the connector if EMC compliance is needed.
Do not confuse PIC32MX1xx family letter codes - PIC32MX150 lacks USB and PMP, PIC32MX130 lacks USB, while only PIC32MX170 has both USB OTG and PMP. A common production-line mistake is substituting PIC32MX150F256B-I/ML where USB is required; the silicon boots but USB enumeration will silently fail. Always cross-check the family letter on the BOM against the PIC32MX1xx product family table before release.
Use a low-Iq LDO such as MCP1700 (1.6 uA quiescent) to power the PIC32MX170F256B-I/ML in battery applications. According to the Microchip datasheet, peak active current can exceed 30 mA at 40 MHz, so the LDO must support at least 80 mA continuous with 100 mV dropout headroom for clean 3.3 V regulation under USB load transients.
合规信息
RoHS and REACH compliant per Microchip product page. Industrial temperature grade -40C to +85C (I-suffix). AEC-Q100 not qualified; choose PIC32MX1xx AEC-Q100 grade parts for automotive.
