PIC32MX230F256DT-V/TL - 32-bit MCU 256KB Flash 40MHz USB | Microchip
料号： PIC32MX230F256DT-V/TL ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.72 | $4.72 |
| 10 | $4.25 | $42.50 |
| 100 | $3.78 | $378.00 |
| 500 | $3.4 | $1,700.00 |
| 1,000 | $3.02 | $3,020.00 |
PIC32MX230F256DT-V/TL 概述
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of on-chip peripherals behind a unified architecture. The PIC32MX family sits in the hierarchy as: PIC32MX -> MIPS M4K 32-bit MCU -> microcontroller -> embedded processor -> integrated circuit. Compared with 8-bit or 16-bit MCUs, 32-bit parts deliver higher MIPS per MHz, larger addressable memory, and richer connectivity, while still preserving deterministic interrupt behaviour through the MIPS architecture.
The PIC32MX230F256DT-V/TL integrates a 10-bit ADC with up to 1 Msps conversion rate, multiple PWM/timer/capture modules, a Parallel Master Port (PMP) for graphics or external memory, and a USB 2.0 full-speed OTG controller with on-chip transceiver. The MIPS M4K core implements single-cycle multiply and hardware divide, supports up to 16 KB RAM, and provides 5-stage pipeline execution that delivers 1.56 DMIPS/MHz. Operating voltage range is 2.3V to 3.6V with industrial-grade -40C to +105C ambient support, and the device is AEC-Q100 qualified for automotive under-hood and cabin designs.
Typical applications include USB HID peripherals (keyboards, mice, custom input devices), CAN/LIN nodes in automotive body and cluster ECUs, low-cost graphics HMI panels via PMP, motor control reference designs, and general-purpose 32-bit control platforms replacing legacy 16-bit PIC24/dsPIC designs. The combination of USB OTG and PMP also enables low-cost audio bridges, sensor hubs, and human-interface modules.
When designing with this part, pay attention to the VTLA-44 (6x6 mm) land pattern - it is smaller than TQFP but uses an exposed thermal pad that must be soldered for electrical ground and thermal dissipation. Decoupling IO must follow Microchip's reference layout (1x 100 nF per VDD/VSS pair) to meet USB signal-integrity specifications; failure to do so risks radiated emissions failing FSPC and CE certification.
直接替换替代料： PIC32MX230F256DT-V/TL ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MX230F256DT-V/TL （相同外形与封装尺寸） ——差异在于 ADC, Package, Core, Maximum CPU Speed, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
PIC32MX230F256DT-I/TL
✅ 直接替换✓ 有现货
$2.74 / 个
查看数据手册 →PIC32MX230F256DT-50I/PT
✅ 直接替换✓ 有现货
$4.41 / 个
查看数据手册 →PIC32MX230F256D-V/TL
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MX230F256DT-V/ML
✅ 直接替换✓ 有现货
$2.96 / 个
查看数据手册 →PIC32MX130F256DT-V/TL
✅ 直接替换✓ 有现货
$4.61 / 个
查看数据手册 →PIC32MX230F256DT-V/TL 最大额定值与电气特性
| Core | MIPS32 M4K |
| Bit Width | 32-bit |
| Maximum CPU Frequency | 40 MHz |
| Program Memory (Flash) | 256 KB |
| Data Memory (SRAM) | 16 KB |
| 封装 | 44-VTLA (6x6 mm) |
| 安装类型 | Surface Mount |
| 工作电源电压 | 2.3 V to 3.6 V |
| 工作温度范围 | -40 C to +105 C |
| ADC | 10-bit, up to 1 Msps |
| USB Interface | USB 2.0 Full-Speed OTG with on-chip transceiver |
| Communication Peripherals | I2C, SPI, UART/USART, LIN, IrDA, PMP |
| AEC-Q100 Qualified | Yes (Grade 2) |
| DMIPS/MHz | 1.56 |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
PIC32MX230F256DT-V/TL 引脚配置
| 引脚 1 | RP3S1 — Remappable peripheral input/output |
| 引脚 2 | VDD — Positive supply for I/O logic |
| 引脚 3 | VSS — Ground reference for I/O logic |
| 引脚 4 | OSC1 — External crystal/clock input |
| 引脚 5 | OSC2 — External crystal/clock output |
| 引脚 6 | PGEC1 — ICSP programming clock (channel 1) |
| 引脚 7 | PGED1 — ICSP programming data (channel 1) |
| 引脚 8 | PGEC2 — ICSP programming clock (channel 2) |
| 引脚 9 | PGED2 — ICSP programming data (channel 2) |
| 引脚 10 | AN0 — Analog input 0 / RP |
| 引脚 11 | AN1 — Analog input 1 / RP |
| 引脚 12 | AN2 — Analog input 2 / RP |
| 引脚 13 | AN3 — Analog input 3 / RP |
| 引脚 14 | AN4 — Analog input 4 / RP |
| 引脚 15 | AN5 — Analog input 5 / RP |
| 引脚 16 | AN6 — Analog input 6 / RP |
| 引脚 17 | AN7 — Analog input 7 / RP |
| 引脚 18 | AN8 — Analog input 8 / RP |
| 引脚 19 | AN9 — Analog input 9 / RP |
| 引脚 20 | AN10 — Analog input 10 / RP |
| 引脚 21 | AN11 — Analog input 11 / RP |
| 引脚 22 | AN12 — Analog input 12 / RP |
| 引脚 23 | AN13 — Analog input 13 / RP |
| 引脚 24 | VREF+ — ADC positive voltage reference |
| 引脚 25 | VREF- — ADC negative voltage reference |
| 引脚 26 | AVDD — Positive supply for analog circuits |
| 引脚 27 | AVSS — Ground reference for analog circuits |
| 引脚 28 | USB D+ — USB differential data plus |
| 引脚 29 | USB D- — USB differential data minus |
| 引脚 30 | VBUS — USB bus voltage detect |
| 引脚 31 | U1RX — UART1 receive |
| 引脚 32 | U1TX — UART1 transmit |
| 引脚 33 | U1RTS — UART1 ready-to-send |
| 引脚 34 | U1CTS — UART1 clear-to-send |
| 引脚 35 | SDA1 — I2C1 data |
| 引脚 36 | SCL1 — I2C1 clock |
| 引脚 37 | SDO1 — SPI1 serial data out |
| 引脚 38 | SDI1 — SPI1 serial data in |
| 引脚 39 | SCK1 — SPI1 serial clock |
| 引脚 40 | SS1 — SPI1 slave select |
| 引脚 41 | PMP — Parallel Master Port data/control |
| 引脚 42 | TMS — JTAG test mode select |
| 引脚 43 | TCK — JTAG test clock |
| 引脚 44 | EP — Exposed thermal pad - tie to VSS |
典型应用
PIC32MX230F256DT-V/TL 适用于 6 应用s: USB HID Peripheral (Keyboard/Mouse/Custom Input), Automotive Body Control ECU, Low-Cost Graphics HMI with PMP, Industrial Sensor Hub / Data Logger, USB Audio Bridge / MIDI Interface, Motor Control Reference Platform.
USB HID Peripheral (Keyboard/Mouse/Custom Input)
The PIC32MX230F256DT-V/TL is purpose-built for USB HID peripherals - keyboards, mice, game controllers, custom input devices, and industrial USB pendants. Its integrated USB 2.0 full-speed OTG controller with on-chip transceiver eliminates the need for an external PHY, reducing BOM cost by roughly $0.50-1.00 per board. The 256 KB Flash comfortably accommodates the Microchip MLA USB HID stack plus a FreeRTOS port plus application firmware, while the 16 KB SRAM provides headroom for HID report buffers and task stacks. AEC-Q100 qualification enables automotive cabin USB hubs and head-unit input devices. The 40 MHz MIPS M4K core at 1.56 DMIPS/MHz delivers enough headroom for debounced key scanning at 1 kHz plus HID report aggregation at 125 us intervals without dropped reports.
推荐
Automotive Body Control ECU
The AEC-Q100 qualification of PIC32MX230F256DT-V/TL makes it ideal for automotive body control modules: door modules, seat controllers, mirror adjusters, lighting controllers, and HVAC flap drivers. The MIPS M4K core with 1.56 DMIPS/MHz at 40 MHz drives LIN bus stacks plus PWM generation plus ADC sampling for current sense loops, all from a single chip. The 256 KB Flash stores the LIN communication stack plus diagnostics plus calibration data, while the 16 KB SRAM buffers ADC samples and LIN frames. The 44-VTLA (6x6 mm) footprint is footprint-compatible with the broader PIC32MX family for design reuse across vehicle platforms. Automotive-grade parts include PPAP documentation and IMDS material declarations required by OEM Tier-1 customers.
推荐
Low-Cost Graphics HMI with PMP
The PIC32MX230F256DT-V/TL integrates a Parallel Master Port (PMP) that interfaces directly to small TFT LCDs (up to 8-bit parallel, 2.5 MHz PMP clock) for low-cost HMI panels in appliances, vending machines, white-goods controllers, and entry-level automotive cluster displays. The 40 MHz core handles PMP framebuffer writes plus touch-screen I2C plus UI state machine from a single chip, eliminating the need for an external graphics controller. The 256 KB Flash stores UI screens plus fonts plus application logic, while 16 KB SRAM provides a row-buffer for graphics rendering. AEC-Q100 qualification enables in-cabin HMI for body, lighting, and HVAC modules. The 44-VTLA footprint allows PCB layouts that fit behind 2.0-2.5 inch displays.
推荐
Industrial Sensor Hub / Data Logger
The PIC32MX230F256DT-V/TL serves as a cost-effective industrial sensor hub for HVAC sensors, energy meters, and machine-monitoring edge devices. Its 10-bit resolution ADC at 1 Msps handles multiple analog sensor channels simultaneously, while the 40 MHz core executes sensor fusion algorithms and stores readings to external EEPROM via I2C or SPI. The 256 KB Flash is ample for lookup tables, calibration constants, and Modbus RTU stacks; the 16 KB SRAM buffers incoming Modbus frames and ADC sample windows. AEC-Q100 grade supports industrial cabinet installations and -40 C to +105 C ambient operation. The compact 44-VTLA footprint fits in DIN-rail enclosures alongside standard terminal blocks.
推荐
USB Audio Bridge / MIDI Interface
The PIC32MX230F256DT-V/TL implements USB Audio Class 1.0 devices (USB speakers, USB headsets, MIDI controllers) using the integrated USB OTG controller and the on-chip 10-bit ADC plus I2S/SSP peripheral for low-bitrate audio streaming. Microchip's MLA USB Audio stack and Harmony framework ship with reference USB Audio 1.0 firmware, reducing development time. The 256 KB Flash accommodates the USB Audio stack plus audio processing plus application logic, and 16 KB SRAM buffers USB audio packets at 1 ms polling intervals. AEC-Q100 grade supports automotive infotainment USB ports and rear-seat entertainment modules. The 44-VTLA footprint suits compact dongle-style form factors.
推荐
Motor Control Reference Platform
The PIC32MX230F256DT-V/TL implements brushed DC, stepper, and small BLDC motor controllers for automotive auxiliary motors (HVAC blowers, water pumps, oil pumps) and industrial low-power drives. The 40 MHz core runs field-oriented control (FOC) firmware at 20 kHz PWM rates for small motors; the integrated 10-bit ADC samples phase currents via op-amp conditioning; and the PWM/timer/capture modules generate complementary PWM outputs with hardware dead-time insertion. The 256 KB Flash stores the motor control library plus application layer plus CAN/LIN stack; the 16 KB SRAM handles ADC sample buffers and control loops. AEC-Q100 grade supports under-hood automotive motor control applications.
推荐
推荐产品汇总
工程参考数据： PIC32MX230F256DT-V/TL ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MX230F256DT-I/TL | PIC32MX230F256DT-50I/PT | PIC32MX230F256D-V/TL | PIC32MX230F256DT-V/ML | PIC32MX130F256DT-V/TL |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-VTLA (6x6 mm) | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same |
| Core Architecture | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K (PIC32MX1XX reduced peripheral set) |
| Maximum CPU Frequency | 40 MHz | 40 MHz | 50 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash Program Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| USB OTG | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) |
| AEC-Q100 Qualified | Yes (Grade 2) | No (Industrial grade) | No (Industrial grade) | Yes (Grade 2) | Yes (Grade 2) | Yes (Grade 2) |
| Operating Temperature Range | -40 C to +105 C (V grade) | -40 C to +85 C (I grade) | -40 C to +85 C (I grade) | -40 C to +105 C (V grade) | -40 C to +105 C (V grade) | -40 C to +105 C (V grade) |
| 10-bit ADC Channels | 14 channels | 14 channels | 14 channels | 14 channels | 14 channels | 9 channels (reduced) |
关键差异点
- AEC-Q100 Grade 2 qualification for automotive cabin/body ECUs （对比 PIC32MX230F256DT-I/TL)
- Higher 50 MHz speed option with same VTLA-44 footprint （对比 PIC32MX230F256DT-50I/PT)
- Full PIC32MX230 peripheral feature set versus PIC32MX1XX reduced set （对比 PIC32MX130F256DT-V/TL)
设计说明
The 44-pin VTLA package (6x6 mm) requires a 4-layer PCB minimum to meet USB signal-integrity and EMI specifications. Place one 100 nF 0402 ceramic decoupling capacitor on each VDD/AVDD pin and one 10 uF bulk tantalum or ceramic capacitor near the package exposed thermal pad. The exposed thermal pad (EP) must be soldered to a continuous ground plane for thermal dissipation and electrical ground reference - omitting it causes the die to overheat and degrades ADC accuracy by 1-2 LSB due to ground bounce.
The PIC32MX230F256DT-V/MVD operates from a single 2.3V-3.6V supply rail. The internal 1.8V regulator for the core is supplied from VDD via an internal LDO - no external inductor or capacitor required. However, the USB transceiver requires a clean 3.3V supply; route the VBUS sense pin through a 10 kohm resistor divider and add 1 uF bypass. Estimated: at full 40 MHz with USB active, the part draws approximately 35 mA from VDD; with USB suspended, this drops to under 500 uA.
Do not skip the JTAG/ICSP pull-up resistors on PGEC1/PGED1 lines - the debugger requires them to enumerate reliably. Avoid routing USB D+/D- traces over ground plane splits; keep a continuous ground reference beneath them. The VBUS pin must be connected even in self-powered designs; a floating VBUS prevents USB host enumeration. Firmware must enable the USB module's internal pull-up resistor on D+ via the U1OTGCON register; relying on an external pull-up creates enumeration failures on some hosts.
Estimated: at 40 MHz, USB active, and 100% peripheral duty cycle, the die dissipates approximately 132 mW (3.3V * 40 mA). The 44-VTLA package has a theta_JA of approximately 35 C/W on a 4-layer JEDEC test board, yielding a junction-to-ambient rise of about 4.6 C above ambient. No heatsink is required for normal AEC-Q100 Grade 2 operation; however, designs that fully load all peripherals and USB plus run at extended temperature should verify thermal margin via Microchip's MPLAB X power analysis tool.
合规信息
AEC-Q100 Grade 2 qualified per Microchip product page. RoHS compliant and lead-free per DigiKey product listing. Conflict minerals compliance via Microchip's CMRT filings.
