PIC32MX270F256D-50I/ML - 32-bit MCU 50MHz 256KB Flash | Microchip
料号： PIC32MX270F256D-50I/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $5.92 | $5.92 |
| 10 | $5.45 | $54.50 |
| 100 | $4.78 | $478.00 |
| 500 | $4.21 | $2,105.00 |
| 1,000 | $3.74 | $3,740.00 |
PIC32MX270F256D-50I/ML 概述
A PIC32MX microcontroller is a 32-bit MIPS-based embedded processor from Microchip's PIC32 family, sitting between 8-bit PIC16/PIC18 MCUs and 32-bit Cortex-M parts. PIC32MX parts run at higher clock speeds than PIC16/PIC18, offer more memory and peripherals than 8-bit PICs, and use the MIPS32 instruction set instead of ARM Cortex-M. The MX1XX/2XX sub-family is positioned for cost-sensitive USB, audio, and graphics applications.
Key features include 0.5 mA/MHz typical active current, 10-bit 1 Msps ADC, mTouch capacitive touch support, 1 ns resolution capture timer, and on-chip 1.5 KB USB RAM. The QFN-44 (ML) package provides a compact 8x8 mm footprint with thermal pad for improved dissipation. PPS allows remapping of digital peripherals to most I/O pins, simplifying PCB layout and reducing pin conflicts in mixed-function designs.
The architecture combines a 5-stage MIPS32 M4K pipeline with Harvard bus structure, prefetch cache, and tightly-coupled SRAM, delivering deterministic interrupt response needed for USB, audio I2S, and PMP graphic streaming. The integrated USB 2.0 full-speed PHY eliminates external transceivers for HID, CDC, and audio class devices.
Typical applications include Bluetooth audio docks and headsets (PIC32MX Bluetooth Audio Dev Kit), USB audio devices, HMI panels with PMP-driven LCDs, capacitive touch user interfaces, and industrial control with USB diagnostics. The 256 KB Flash accommodates full USB stacks plus application logic, while 64 KB RAM supports double-buffered audio and graphics framebuffers.
When designing with this part, place the decoupling network within 3 mm of the VDD pins, expose the QFN thermal pad with a 4x4 thermal via array to an inner ground plane, and use the PPS registry to route I2S, SPI, and UART signals around the PCB to ease routing on dense boards.
This page synthesizes distributor pricing, drop-in PIC32MX alternatives, and practical layout/design notes not found in the manufacturer datasheet alone.
直接替换替代料： PIC32MX270F256D-50I/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MX270F256D-50I/ML （相同外形与封装尺寸） ——差异在于 Package, ADC, Operating Temperature, Operating Temperature Range, Parallel Master Port (PMP).
快速对比工具——选择替代料号进行并排对比：
PIC32MX270F256DT-50I/ML
✅ 直接替换✓ 有现货
$4.61 / 个
查看数据手册 →PIC32MX270F256D-50I/PT
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MX230F256D-50I/ML
✅ 直接替换✓ 有现货
$3.96 / 个
查看数据手册 →PIC32MX270F256D-I/ML
✅ 直接替换✓ 有现货
$4.18 / 个
查看数据手册 →PIC32MX250F256H-50I/MR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3.05 / 个
查看数据手册 →PIC32MX270F256D-50I/ML 最大额定值与电气特性
| Core Architecture | MIPS32 M4K |
| Maximum CPU Frequency | 50 MHz / 83 DMIPS |
| Program Flash Memory | 256 KB (256K x 8) |
| SRAM | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| ADC | 10-bit, up to 1 Msps |
| USB | USB 2.0 full-speed device/host/OTG |
| I2S/SPI Modules | 2 |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes |
| mTouch Capacitive Touch | Yes |
| Capture Module Resolution | 1 ns |
| Active Current (typical) | 0.5 mA/MHz |
| 工作温度 | -40C to +85C (industrial) |
| 封装 | 44-pin QFN (8x8 mm) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Speed Grade | -50I (50 MHz, Industrial) |
PIC32MX270F256D-50I/ML 44-pin qfn (8x8 mm) 引脚配置指南
PIC32MX270F256D-50I/ML（44-pin qfn (8x8 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： PIC32MX270F256D-50I/ML.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PIC32MX270F256D-50I/ML 适用于 6 应用s: Bluetooth Audio Docks and Headsets, USB Audio Class Devices, HMI Panels with PMP-Driven LCDs, Capacitive Touch User Interfaces, Industrial Control with USB Diagnostics, IoT Edge Sensor Hubs.
Bluetooth Audio Docks and Headsets
The PIC32MX270F256D-50I/ML is the supported MCU on Microchip's Bluetooth Audio Development Kit, with two I2S modules for direct CODEC connection and USB 2.0 full-speed OTG for wired audio class. The 50 MHz MIPS32 M4K core handles SBC/AAC decode and Bluetooth stack simultaneously, while 64 KB SRAM double-buffers audio samples. The on-chip USB PHY eliminates external transceiver cost.
推荐
USB Audio Class Devices
Integrated USB 2.0 full-speed OTG with on-chip PHY and 1.5 KB dedicated USB RAM make the PIC32MX270F256D-50I/ML ideal for USB speakers, USB headsets, and USB microphones. The 50 MHz core runs the USB stack and audio class driver while I2S feeds the external DAC. PPS allows flexible pinout for compact enclosures with limited I/O.
推荐
HMI Panels with PMP-Driven LCDs
The Parallel Master Port (PMP) on the PIC32MX270F256D-50I/ML streams data directly to parallel-interface TFT and OLED panels up to 8-bit bus width, eliminating external display controllers. The 50 MHz MIPS32 M4K core refreshes small QVGA panels at 30 fps from internal Flash, while USB enables firmware updates. 64 KB RAM accommodates 8-bit color framebuffers for 320x240 panels.
推荐
Capacitive Touch User Interfaces
The PIC32MX270F256D-50I/ML supports Microchip's mTouch library with up to 16 capacitive touch channels via the on-chip 10-bit ADC and hardware CVD (Charge-Voltage Discharge). This is ideal for appliances, industrial controls, and consumer products requiring sealed touch panels with sliders and buttons. The 256 KB Flash accommodates the full mTouch plus UI library.
推荐
Industrial Control with USB Diagnostics
Industrial controllers use the PIC32MX270F256D-50I/ML's USB 2.0 full-speed for diagnostics, firmware update, and configuration without external PHYs. The -40C to +85C industrial operating range, PPS for flexible routing of UART/SPI/I2C to industrial peripherals, and 5-stage pipeline deterministic interrupt response suit PLC, motor drive, and process control applications.
推荐
IoT Edge Sensor Hubs
The PIC32MX270F256D-50I/ML aggregates sensors via I2S/SPI/UART and reports over USB or serial, with 256 KB Flash for protocol stacks and 64 KB SRAM for sensor data buffers. The 50 MHz MIPS core runs lightweight RTOS (FreeRTOS port, Harmony), and the 0.5 mA/MHz active current consumption supports battery-backed operation in remote sensor hubs.
推荐
推荐产品汇总
工程参考数据： PIC32MX270F256D-50I/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MX270F256DT-50I/ML | PIC32MX270F256D-50I/PT | PIC32MX230F256D-50I/ML | PIC32MX270F256D-I/ML | PIC32MX250F256H-50I/MR |
|---|---|---|---|---|---|---|
| Package | 44-pin QFN (8x8 mm) | 44-pin QFN (8x8 mm) - same | 44-pin TQFP (10x10 mm) - different | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same | 64-pin QFN (9x9 mm) - different |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Maximum CPU Frequency | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 40 MHz / 66 DMIPS (-20%) | 50 MHz / 83 DMIPS |
| Program Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| USB 2.0 Full-Speed | Yes (device/host/OTG) | Yes | Yes | No | Yes | Yes |
| Parallel Master Port (PMP) | Yes | Yes | Yes | No | Yes | Yes |
| Peripheral Pin Select (PPS) | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
关键差异点
- Integrated USB 2.0 full-speed OTG with on-chip PHY （对比 PIC32MX230F256D-50I/ML)
- Parallel Master Port (PMP) for direct LCD drive （对比 PIC32MX230F256D-50I/ML)
- Higher 50 MHz CPU speed vs 40 MHz alternative （对比 PIC32MX270F256D-I/ML)
- Compact QFN-44 (8x8 mm) for space-constrained designs （对比 PIC32MX270F256D-50I/PT)
设计说明
Expose the QFN-44 thermal pad with a 4x4 via array (0.3 mm drill, 0.5 mm pitch) to an internal ground plane for low thermal resistance. Place the 0.1 uF + 10 uF VDD decoupling network within 3 mm of the VDD pins; USB VUSB requires a 0.1 uF + 4.7 uF network placed within 2 mm to meet USB 2.0 full-speed impedance. The 44-pin QFN (8x8 mm) requires careful escape routing - place at least two vias in the central pad region to keep power plane continuous.
At 50 MHz active current is approximately 0.5 mA/MHz typical, or 25 mA for the core. Plus I/O and USB load, total current can reach 40-60 mA. The QFN-44 thermal pad has theta_JA around 28-32 C/W on a 4-layer JEDEC test board. Estimated: at 60 mA total and 3.3 V, junction temperature rise above ambient is approximately (0.06 A * 3.3 V * 30 C/W) = 5.9 C, well within limits. Add 1 square inch of copper pour if running at extended temperature or sealed enclosures.
Do not omit the 1.5 kohm pull-up on D+ or D- for USB device mode - USB enumeration will fail. Configure PPS before enabling peripherals, otherwise the I/O remains in default high-impedance and peripherals will not function. The 'T' suffix (PIC32MX270F256DT-50I/ML) is packaging only, not a different die; firmware is identical. JTAG and Trace pins are multiplexed on this package - if you need Trace, plan for that during PCB layout since trace pins are shared with I/O.
合规信息
RoHS compliant and REACH compliant per Microchip product page and Abacus Technologies listing. Not AEC-Q100 qualified - choose a PIC32MX automotive-grade variant for automotive applications.