PIC32MZ1024EFF144T-I/PL - 200MHz 32-bit MCU, 1MB Flash | Microchip
料号： PIC32MZ1024EFF144T-I/PL ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $13.85 | $13.85 |
| 10 | $12.46 | $124.60 |
| 100 | $11.07 | $1,107.00 |
| 500 | $9.96 | $4,980.00 |
| 1,000 | $8.88 | $8,880.00 |
PIC32MZ1024EFF144T-I/PL 概述
直接替换替代料： PIC32MZ1024EFF144T-I/PL ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MZ1024EFF144T-I/PL （相同外形与封装尺寸） ——差异在于 Core Architecture, Package, Operating Temperature, ADC, FPU.
快速对比工具——选择替代料号进行并排对比：
PIC32MZ1024EFE144-I/PL
✅ 直接替换✓ 有现货
$8.95 / 个
查看数据手册 →PIC32MZ1024EFF144-E/PL
✅ 直接替换✓ 有现货
$9.3 / 个
查看数据手册 →PIC32MZ1024EFF144-I/PH
✅ 直接替换✓ 有现货
$9.84 / 个
查看数据手册 →PIC32MZ0512EFF144-I/PL
✅ 直接替换✓ 有现货
$8.55 / 个
查看数据手册 →PIC32MZ1024ECH144T-I/PL
✅ 直接替换✓ 有现货
$9.55 / 个
查看数据手册 →PIC32MZ1024ECM144-I/PH
✅ 直接替换✓ 有现货
$8.95 / 个
查看数据手册 →PIC32MZ1024EFF144T-I/PL 最大额定值与电气特性
| Core Architecture | MIPS32 M-Class (32-bit RISC) |
| Maximum CPU Frequency | 200 MHz |
| Program Flash Memory | 1 MB (1M x 8) |
| SRAM | 256 KB |
| Operating Voltage | 2.5V / 3.3V |
| 封装 | 144-LQFP (20x20 mm) |
| 安装类型 | Surface Mount |
| 工作温度范围 | -40C to +85C (Industrial) |
| Floating Point Unit | Yes (integrated FPU) |
| Connectivity | CAN, USB, Ethernet (per datasheet) |
| ADC | 12-bit (per PIC32MZ EF family datasheet) |
| MSL 等级 | 3 (per JEDEC J-STD-020, 168 hours) |
| RoHS 状态 | Compliant |
PIC32MZ1024EFF144T-I/PL 144-lqfp (20x20 mm) 引脚配置指南
PIC32MZ1024EFF144T-I/PL（144-lqfp (20x20 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： PIC32MZ1024EFF144T-I/PL.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PIC32MZ1024EFF144T-I/PL 适用于 6 应用s: Industrial IoT Gateway Controller, High-Resolution Graphics HMI Controller, Brushless DC Motor Control (FOC), USB Audio Class Device, Medical Patient Monitoring Connect, Automotive Body and Connectivity Module.
Industrial IoT Gateway Controller
The PIC32MZ1024EFF144T-I/PL fits industrial IoT gateway designs by combining 1MB of dual-bank Flash for secure OTA update images, integrated Ethernet MAC and CAN 2.0B controllers for protocol translation, and the Floating Point Unit that accelerates encryption and signal-conditioning math. Its 200MHz MIPS32 M-class core executes TCP/IP stacks with headroom for application logic, while 256KB SRAM supports TLS session buffers without external memory. The 144-LQFP industrial-rated package (-40C to +85C) suits substation, factory-floor, and outdoor enclosure deployments where conduction-cooled PCB assemblies are common.
推荐
High-Resolution Graphics HMI Controller
The PIC32MZ1024EFF144T-I/PL is well-matched to HMI graphics controllers thanks to its 200MHz CPU, FPU-assisted rendering, and the parallel PMP/EPMP interface that drives TFT LCD panels without external memory. Designers can run Microchip's MPLAB Harmony Graphics Composer toolchain to deploy vector fonts and image assets into the 1MB Flash, while the 256KB SRAM hosts frame buffers. Industrial -40C to +85C operation supports factory HMI panels and building-automation touchscreens where temperature swings are routine.
推荐
Brushless DC Motor Control (FOC)
Field-Oriented Control (FOC) of BLDC motors benefits from the PIC32MZ1024EFF144T-I/PL's 200MHz MIPS core and integrated FPU, which execute Park/Clarke transforms and PID loops in fewer cycles than software-emulated approaches. The peripheral set includes 9 PWM channels with dead-band generators, 2 comparators for back-EMF sensing, and high-speed 12-bit ADC for current feedback. The 1MB Flash stores commutation tables and OEM tuning parameters, while the 144-LQFP exposes the full PWM/ADC/QEI pin set needed for three-phase industrial drives.
推荐
USB Audio Class Device
USB Audio Class 1.0 devices such as USB headsets, microphones, and DAC/ADC bridges leverage the PIC32MZ1024EFF144T-I/PL's integrated USB 2.0 Full-Speed controller and the FPU for sample-rate conversion and EQ processing. The 256KB SRAM holds ping-pong audio buffers, while 1MB Flash stores firmware-upgradeable codec personalities. The 144-LQFP exposes both USB D+/D- and I2S/SSP audio interfaces needed for consumer audio peripherals.
推荐
Medical Patient Monitoring Connect
Patient monitoring peripherals benefit from the PIC32MZ1024EFF144T-I/PL's deterministic 200MHz performance for real-time SpO2, ECG, and temperature signal chains. The integrated 12-bit ADC and DSP-capable FPU execute filtering and feature extraction on DSP cores, and 1MB Flash stores calibration tables per patient-profile class. Note that final medical certification is system-level; the MCU itself is rated for industrial -40C to +85C, so additional thermal management is required for body-temperature environments.
推荐
Automotive Body and Connectivity Module
Automotive body controllers and connectivity modules use the PIC32MZ1024EFF144T-I/PL for body-domain features such as CAN gateway, LIN bus, and telematics aggregation. The PIC32MZ EF family includes AEC-Q100 qualified variants (e.g. the -250I/PL speed bins), and the -I/PL industrial variant fits non-safety body modules. The 1MB Flash and 256KB SRAM support multi-protocol stacks and OTA update images, while the 144-LQFP 20x20 footprint offers generous routing for high-current motor control outputs.
推荐
推荐产品汇总
工程参考数据： PIC32MZ1024EFF144T-I/PL ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MZ1024EFE144-I/PL | PIC32MZ1024EFF144-E/PL | PIC32MZ1024EFF144-I/PH | PIC32MZ0512EFF144-I/PL | PIC32MZ1024ECH144T-I/PL | PIC32MZ1024ECM144-I/PH |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (16x16 mm) - footprint variant | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB (-50%) | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Floating Point Unit | Yes | No | Yes | Yes | Yes | No | No |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Operating Voltage | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V |
关键差异点
- FPU-equipped PIC32MZ EF variant （对比 PIC32MZ1024EFE144-I/PL)
- 1MB dual-bank Flash for OTA firmware updates （对比 PIC32MZ0512EFF144-I/PL)
- Industrial temperature rating standard （对比 PIC32MZ1024EFF144-E/PL)
设计说明
Place a 10uF bulk capacitor within 5mm of each VDDCORE pin and a 0.1uF ceramic within 2mm of each VDD pin. The PIC32MZ1024EFF144T-I/PL's internal LDO regulator derives core voltage from the external 3.3V rail, and inadequate decoupling causes brown-out resets under heavy DMA/USB activity. A common-mode ferrite bead on VDD pairs with a 1uF cap to suppress switching noise from the internal regulator. Refer to the PIC32MZ EF family datasheet power-supply section for the exact capacitor count (multiple VDD pins share planes).
Route the 50MHz Ethernet RMII signals first, before the 12-bit ADC analog traces. The 144-LQFP package exposes dedicated RMII pins that should be length-matched within 50 mils on the PCB. Use a separate analog ground island under the AVDD/AVSS pins connected back to the main ground at a single point, typically near the regulator. Avoid routing high-speed digital signals (PWM, USB) under the analog ground island to prevent switching-noise coupling into the ADC inputs.
Do not skip the external 12 MHz primary oscillator capacitor values. The PIC32MZ1024EFF144T-I/PL's PLL locks from the primary oscillator, and using crystal-load capacitors that are too large prevents lock at the target 200MHz. Start-up failures are the most common customer-return root cause on PIC32MZ EF designs; verify crystal load capacitance matches the crystal manufacturer's datasheet. Also: do not leave the BOR (Brown-Out Reset) fuse in disabled state in production firmware; the BOR provides critical protection during power-down transients.
Estimated: at 200MHz full-load CPU activity with both Ethernet and USB enabled, internal dissipation reaches approximately 0.5W. With the 144-LQFP thermal resistance of approximately 35 C/W (junction-to-ambient on a 2-layer JEDEC test board), this yields a 17.5C junction temperature rise. Industrial designs at +85C ambient must budget this rise against the 125C maximum junction, leaving 22.5C margin. Adding a 4-layer PCB with continuous ground plane reduces theta_JA to roughly 20 C/W, doubling the thermal budget.
合规信息
RoHS and REACH compliant per Microchip product page. Standard -I/PL Industrial grade is NOT AEC-Q100 qualified; choose -Q variants for automotive applications. Lead-free and halogen-free per Microchip environmental compliance documentation.
