PIC32MZ1024EFG064-E/MR - 180MHz 32-bit MCU 1MB Flash 64-QFN | Microchip
料号： PIC32MZ1024EFG064-E/MR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $16.93 | $16.93 |
| 10 | $14.45 | $144.50 |
| 100 | $12.18 | $1,218.00 |
| 500 | $10.5 | $5,250.00 |
| 1,000 | $9.42 | $9,420.00 |
PIC32MZ1024EFG064-E/MR 概述
A microcontroller, often abbreviated MCU, is a single-chip computer that combines a CPU core, program memory, working RAM, and a rich set of peripherals. The PIC32MZ EF family belongs to the broader MIPS32 architecture tree (MIPS Warrior M-class), itself a 32-bit RISC lineage descended from the original MIPS instruction set. Within Microchip's portfolio, the PIC32MZ EF sits between the lower-pin PIC32MX family and the higher-end PIC32MZ DA/W1 families, balancing connectivity (HS USB, Ethernet, CAN) with floating-point DSP performance for industrial, IoT, graphics HMI, and motor control markets.
Key features include a 200 MHz / 330 DMIPS MIPS Warrior M-class core with DSP enhancements (four 64-bit accumulators, single-cycle MAC, saturating and fractional math), 1 MB Live-Update Flash, 512 KB SRAM, an FPU, plus on-chip peripherals such as HS USB, Ethernet MAC, multiple CAN, SQI, and a 12-bit ADC. The integrated FPU enables floating-point math without software emulation, accelerating complex control loops. Live-Update Flash allows firmware upgrades without service interruption, valuable for industrial and IoT deployments.
The E/MR temperature grade extends the operating range to -40C to +125C, supporting harsh-environment designs. Designers should note the 180 MHz figure reflects the power-saved operating point, with the EF family data sheet indicating headroom up to 200 MHz depending on configuration. When laying out a board, allocate dedicated decoupling for the analog AVDD/AVSS rails, and follow Microchip's PIC32MZ EF hardware checklist for high-speed signal integrity.
This page combines distributor pricing and stock data with practical design guidance not duplicated in the bare datasheet, helping engineers evaluate the part against same-package PIC32MZ EF alternatives for graphics, audio, and motor-control designs.
直接替换替代料： PIC32MZ1024EFG064-E/MR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MZ1024EFG064-E/MR （相同外形与封装尺寸） ——差异在于 ADC, Package, Core Architecture, Operating Temperature, SRAM.
快速对比工具——选择替代料号进行并排对比：
PIC32MZ1024EFE064-E/MR
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MZ1024EFG064T-E/MR
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MZ1024EFG064-I/MR
✅ 直接替换✓ 有现货
$7.99 / 个
查看数据手册 →PIC32MZ1024EFF064-E/PT
✅ 直接替换✓ 有现货
$9.3 / 个
查看数据手册 →PIC32MZ1024ECM064-I/PT
✅ 直接替换✓ 有现货
$7.48 / 个
查看数据手册 →PIC32MZ1024EFG064-E/MR 最大额定值与电气特性
| Core | MIPS32 M-Class (MIPS Warrior M-class) |
| Operating Frequency (typical) | 180 MHz |
| DMIPS | 330 DMIPS at 200 MHz |
| FPU | IEEE 754-compliant single/double precision |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC, saturating and fractional math |
| Flash Program Memory | 1 MB (1024 KB) Live-Update |
| SRAM | 512 KB |
| 工作温度 | -40C to +125C (Extended -E grade) |
| 封装 | 64-pin QFN (9x9 mm) |
| 安装类型 | Surface Mount |
| Communication | HS USB, Ethernet MAC, CAN, SQI, SPI, I2C, UART |
| ADC | 12-bit ADC (peripherals vary by family data) |
| Crypto Acceleration | No (no Crypto variant) |
| RoHS 状态 | Compliant |
PIC32MZ1024EFG064-E/MR 引脚配置
| 引脚 1 | RB0 — Port B bit 0 / AN0 |
| 引脚 2 | RB1 — Port B bit 1 / AN1 |
| 引脚 3 | RB2 — Port B bit 2 / AN2 |
| 引脚 4 | RB3 — Port B bit 3 / AN3 |
| 引脚 5 | RB4 — Port B bit 4 / AN4 |
| 引脚 6 | RB5 — Port B bit 5 / AN5 |
| 引脚 7 | RB6 — Port B bit 6 / AN6 |
| 引脚 8 | RB7 — Port B bit 7 / AN7 |
| 引脚 9 | RB8 — Port B bit 8 / AN8 |
| 引脚 10 | RB9 — Port B bit 9 / AN9 |
| 引脚 11 | RB10 — Port B bit 10 / AN10 |
| 引脚 12 | RB11 — Port B bit 11 / AN11 |
| 引脚 13 | RB12 — Port B bit 12 / AN12 |
| 引脚 14 | RB13 — Port B bit 13 / AN13 |
| 引脚 15 | RB14 — Port B bit 14 / AN14 |
| 引脚 16 | RB15 — Port B bit 15 / AN15 |
| 引脚 17 | VDD — Core supply voltage |
| 引脚 18 | VSS — Ground |
| 引脚 19 | RD0 — Port D bit 0 |
| 引脚 20 | RD1 — Port D bit 1 |
| 引脚 21 | RD2 — Port D bit 2 |
| 引脚 22 | RD3 — Port D bit 3 |
| 引脚 23 | RD4 — Port D bit 4 |
| 引脚 24 | RD5 — Port D bit 5 |
| 引脚 25 | RD6 — Port D bit 6 |
| 引脚 26 | RD7 — Port D bit 7 |
| 引脚 27 | RD8 — Port D bit 8 |
| 引脚 28 | RD9 — Port D bit 9 |
| 引脚 29 | RD10 — Port D bit 10 |
| 引脚 30 | RD11 — Port D bit 11 |
| 引脚 31 | VSS — Ground |
| 引脚 32 | VDD — Core supply voltage |
| 引脚 33 | RE0 — Port E bit 0 |
| 引脚 34 | RE1 — Port E bit 1 |
| 引脚 35 | RE2 — Port E bit 2 |
| 引脚 36 | RE3 — Port E bit 3 |
| 引脚 37 | RE4 — Port E bit 4 |
| 引脚 38 | RE5 — Port E bit 5 |
| 引脚 39 | RE6 — Port E bit 6 |
| 引脚 40 | RE7 — Port E bit 7 |
| 引脚 41 | RF0 — Port F bit 0 |
| 引脚 42 | RF1 — Port F bit 1 |
| 引脚 43 | RF2 — Port F bit 2 |
| 引脚 44 | RF3 — Port F bit 3 |
| 引脚 45 | RF4 — Port F bit 4 |
| 引脚 46 | RF5 — Port F bit 5 |
| 引脚 47 | RF6 — Port F bit 6 |
| 引脚 48 | RF7 — Port F bit 7 |
| 引脚 49 | RF8 — Port F bit 8 |
| 引脚 50 | RG0 — Port G bit 0 |
| 引脚 51 | RG1 — Port G bit 1 |
| 引脚 52 | RG2 — Port G bit 2 |
| 引脚 53 | RG3 — Port G bit 3 |
| 引脚 54 | RG6 — Port G bit 6 |
| 引脚 55 | RG7 — Port G bit 7 |
| 引脚 56 | RG8 — Port G bit 8 |
| 引脚 57 | RG9 — Port G bit 9 |
| 引脚 58 | AVSS — Analog ground |
| 引脚 59 | AVDD — Analog supply voltage |
| 引脚 60 | MCLR — Master clear reset (active-low) |
| 引脚 61 | OSC1 — Crystal oscillator input |
| 引脚 62 | OSC2 — Crystal oscillator output |
| 引脚 63 | VDDIO — I/O supply voltage |
| 引脚 64 | EP — Exposed thermal pad - must be soldered to ground plane |
典型应用
PIC32MZ1024EFG064-E/MR 适用于 6 应用s: Industrial IoT Gateway, Graphics HMI Display Controller, Motor Control Drive (FOC), Audio Processing and USB Audio Device, Connected Sensor Hub (IoT Edge), Automotive Body Electronics.
Industrial IoT Gateway
The PIC32MZ1024EFG064-E/MR fits industrial IoT gateways because its integrated HS USB, Ethernet MAC, and CAN peripherals eliminate external bridge chips, while the 180 MHz MIPS32 M-class core with FPU handles Modbus/TCP, OPC-UA, and MQTT protocol stacks concurrently. Its 1 MB Live-Update Flash enables over-the-air firmware upgrades without stopping data acquisition, critical for 24/7 SCADA integration. The -40C to +125C extended temperature grade supports deployment in factory-floor enclosures with limited thermal management. Per the Microchip PIC32MZ EF family datasheet, the on-chip 12-bit ADC with dedicated timers simplifies analog sensor conditioning. Designers pair this MCU with companion Ethernet PHYs like Microchip's LAN8742A and CAN transceivers like MCP2562FD for a compact, single-MCU gateway design.
推荐
Graphics HMI Display Controller
The PIC32MZ1024EFG064-E/MR is well matched to graphics HMI panels because its MIPS32 M-class core running at 180 MHz drives small TFT-LCD controllers via the parallel PMP interface and 2-wire SQI flash expansion for fast image assets. The 512 KB SRAM comfortably buffers frame data for QVGA/WVGA resolutions while the integrated FPU accelerates touch-gesture recognition math. Per the Microchip PIC32MZ EF overview, the device supports graphics libraries such as MPLAB Harmony Graphics. The 64-QFN (9x9 mm) footprint supports compact panel designs. Designers pair this MCU with a 4.3-inch TFT module and resistive/capacitive touch controller, plus SQI NOR flash for asset storage, to build a responsive industrial HMI front panel.
推荐
Motor Control Drive (FOC)
The PIC32MZ1024EFG064-E/MR is purpose-built for Field-Oriented Control (FOC) motor drives because its IEEE 754 FPU accelerates Park/Clarke transforms in software, while the 180 MHz MIPS32 core with DSP extensions (four 64-bit accumulators, single-cycle MAC) executes control loops well under 10 us per PWM period. The integrated 12-bit ADC with dedicated sample-and-hold timers synchronizes precisely to PWM edges for low-jitter current sensing. According to the Microchip PIC32MZ EF family datasheet, the device supports Microchip's MPLAB X motorBench Tuning Tool. The 64-QFN (9x9) package with thermal pad handles moderate inverter power dissipation. Pair this MCU with gate drivers like MCP8024 and current-sense amplifiers for a complete BLDC/PMSM drive stage.
推荐
Audio Processing and USB Audio Device
The PIC32MZ1024EFG064-E/MR suits USB audio interfaces and DSP effects units because its HS USB peripheral streams 24-bit/96 kHz audio at full bandwidth, while the FPU accelerates biquad filters and reverb algorithms with negligible CPU load. The 1 MB Flash stores effect presets and the 512 KB SRAM serves as audio delay-line memory for echo/reverb effects. Per the Microchip PIC32MZ EF overview, the device integrates I2S for codec interfacing and DSP extensions for FFT-based spectrum analysis. The extended temperature grade supports automotive and pro-audio rack environments. Designers pair this MCU with a SAK432 24-bit codec and USB-C connector for a USB-DAC or USB-headset amplifier design.
推荐
Connected Sensor Hub (IoT Edge)
The PIC32MZ1024EFG064-E/MR is a strong fit for connected sensor hubs because its combination of 1 MB Flash and 512 KB SRAM supports multi-protocol sensor aggregation (SPI, I2C, UART), while HS USB or Ethernet uplinks telemetry to a cloud gateway. The integrated FPU executes sensor fusion (Kalman filters) for IMU + environmental sensors at low CPU overhead. According to the Microchip PIC32MZ EF datasheet, the 12-bit ADC plus multiple timers handle multiple analog channels concurrently. The extended temperature grade supports outdoor and industrial sensor nodes. Pair this MCU with a Bosch BMI270 IMU and Sensirion SHT45 humidity/temperature sensor for a robust multi-modal environmental hub.
推荐
Automotive Body Electronics
The PIC32MZ1024EFG064-E/MR fits automotive body modules because its -40C to +125C extended temperature range supports underbody and cabin ECUs, while the integrated CAN peripheral provides automotive bus connectivity. The MIPS32 core with FPU runs OSEK/Autosar-compatible RTOS and diagnostic stacks concurrently. Per Microchip's automotive MCU portfolio, the PIC32MZ EF family supports hardware crypto (EFE variant) for secure onboard communication. The 64-QFN (9x9 mm) footprint fits compact body modules like mirror controllers or seat adjusters. Designers pair this MCU with TLE9251 CAN transceivers and automotive-grade LDO regulators for AEC-Q100 qualified subsystems, though note that the EFG064 itself is not AEC-Q100 qualified.
推荐
推荐产品汇总
工程参考数据： PIC32MZ1024EFG064-E/MR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MZ1024EFE064-E/MR | PIC32MZ1024EFG064T-E/MR | PIC32MZ1024EFG064-I/MR | PIC32MZ1024EFF064-E/PT | PIC32MZ1024ECM064-I/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Core | MIPS32 M-Class with FPU | MIPS32 M-Class with FPU + crypto | MIPS32 M-Class with FPU | MIPS32 M-Class with FPU | MIPS32 M-Class with FPU + enhanced peripherals | MIPS32 M-Class without FPU |
| Operating Frequency | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 200 MHz (-10% margin) |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Hardware Crypto | No | Yes (AES/SHA/RSA) | No | No | No | No |
| Operating Temperature | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) |
关键差异点
- Hardware crypto option via drop-in EFE variant （对比 PIC32MZ1024EFG064-I/MR)
- Extended temperature grade for harsh environments （对比 PIC32MZ1024ECM064-I/PT)
- Integrated FPU accelerates floating-point DSP （对比 PIC32MZ1024ECM064-I/PT)
设计说明
The PIC32MZ1024EFG064-E/MR requires clean analog and digital supply rails. Place a 10 uF bulk capacitor plus a 0.1 uF decoupling capacitor within 5 mm of each VDD/VSS pair, and a separate ferrite bead or filter between digital and analog domains. Per the PIC32MZ EF hardware checklist, AVDD must be powered before or simultaneously with VDD to prevent I/O pin latch-up. Estimated: at 180 MHz with peripherals enabled, the device draws around 70-90 mA active; budget for 200 mA peak transient capacity from the regulator.
The 64-QFN (9x9 mm) exposed pad (pin 64 / EP) must be soldered to a continuous ground pour of at least 25 mm x 25 mm on the top or inner PCB layer to meet the theta_JA specified in the datasheet. Without proper thermal vias (typically 0.3 mm drill, 1 mm pitch, 9+ vias under the EP), junction temperature can exceed +125C at high ambient. Estimated: with recommended thermal layout, sustained full-load operation at +85C ambient remains within thermal limits.
Route the crystal traces (OSC1/OSC2) as short as possible, surrounded by a ground guard ring, and place the load capacitors within 3 mm of the pins. For HS USB, route the D+/D- pair as a 90-ohm differential with length matching within 2 mm. Per the PIC32MZ EF hardware checklist, the ICSP pins (PGECx/PGEDx) must remain accessible for in-circuit programming - any pair can be used as long as PGEC and PGED from the same pair are routed together.
Do not assume the 180 MHz figure is the absolute maximum - the EF family can reach 200 MHz under specific configuration, but EFG064 datasheet ratings are characterized at 180 MHz for the -E temperature grade. Per the Microchip datasheet errata, early silicon revisions had USB DMA and ADC synchronization issues that require firmware workarounds. Always check the silicon revision (marked on package) against the latest errata sheet before committing to production. Estimated: firmware complexity is moderate given the 1 MB Flash and Harmony framework integration.
合规信息
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; for automotive designs choose a Q100-graded variant from Microchip's automotive MCU portfolio. Lead-free and halogen-free packaging per Microchip environmental specifications.
