PIC32MZ1025DAG169T-I/6J - 200MHz 32-bit MCU 1MB Flash 169-LFBGA | Microchip
料号： PIC32MZ1025DAG169T-I/6J ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $19.77 | $19.77 |
| 10 | $18.83 | $188.30 |
| 100 | $17.93 | $1,793.00 |
| 1,000 | $17.58 | $17,580.00 |
| 10,000 | $17.58 | $175,800.00 |
PIC32MZ1025DAG169T-I/6J 概述
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a high-performance processor core, program and data memory, and a rich set of peripherals on a single die. Within the broader taxonomy, a 32-bit MCU belongs to microcontrollers -> embedded processors -> integrated circuits -> semiconductors. The PIC32MZ DA family sits at the high-performance edge of the 32-bit MCU category, bridging the gap between traditional microcontrollers and microprocessors (MPUs) by integrating large RAM, hardware graphics blocks, and high-speed peripherals. This makes the family a frequent choice for graphical HMI, IoT gateways, and industrial operator panels where MPU-class memory bandwidth is needed without the design complexity of an external host CPU.
Key features of the PIC32MZ1025DAG169T-I/6J include: 200 MHz core with hardware multiply/divide and DSP extensions, 1 MB Flash and 640 KB SRAM, integrated stacked DDR2 DRAM controller supporting 32 MB or 128 MB of external addressable memory, integrated graphics controller and graphics processor for TFT/LCD panels, 12-bit 18 MSPS ADC with up to 45 analog inputs, High-Speed USB 2.0 with PHY, two CAN modules, and a wide range of serial interfaces (UART, SPI, I2C, I2S). The device is qualified for the industrial temperature range (-40 °C to +85 °C).
Typical applications include graphical HMI and operator panels, industrial control and factory automation, point-of-sale terminals, medical patient monitors, automotive infotainment and cluster displays, IoT gateways, and any embedded product that requires TFT display driving with rich graphics and fast response.
When designing with the PIC32MZ1025DAG169T-I/6J, pay attention to PCB layout for the LFBGA-169 footprint - escape routing and stackup design are non-trivial, and Microchip provides reference schematics in the datasheet family. Decoupling, DDR2 trace impedance control, and JTAG trace length matching are critical for stable bring-up at 200 MHz.
直接替换替代料： PIC32MZ1025DAG169T-I/6J ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MZ1025DAG169T-I/6J （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Program Memory (Flash), CAN, Core Architecture.
快速对比工具——选择替代料号进行并排对比：
PIC32MZ1025DAG169-I/6J
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MZ1025DAB169T-I/HF
✅ 直接替换✓ 有现货
$12.65 / 个
查看数据手册 →PIC32MZ1025DAB169-I/HF
✅ 直接替换✓ 有现货
$7.85 / 个
查看数据手册 →PIC32MZ1025DAG169T-I/6J 最大额定值与电气特性
| Core Architecture | MIPS32 microAptiv |
| Core Frequency | 200 MHz |
| Program Memory (Flash) | 1 MB |
| Data Memory (SRAM) | 640 KB |
| External Memory Bus | DDR2 controller, 32-bit |
| Operating Voltage | 2.3 V to 3.6 V |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated, with GPU |
| USB | Hi-Speed USB 2.0 with on-chip transceiver |
| CAN | 2x CAN 2.0B modules |
| 封装 | 169-pin LFBGA, 11x11 mm |
| 安装类型 | Surface Mount |
| 工作温度 | -40 °C to +85 °C (Industrial) |
| RoHS 状态 | Compliant |
PIC32MZ1025DAG169T-I/6J 169-pin lfbga, 11x11 mm 引脚配置指南
PIC32MZ1025DAG169T-I/6J（169-pin lfbga, 11x11 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： PIC32MZ1025DAG169T-I/6J.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PIC32MZ1025DAG169T-I/6J 适用于 7 应用s: Graphical HMI and Operator Panels, Industrial Control and Factory Automation, Point-of-Sale Terminals, Medical Patient Monitors, Automotive Infotainment and Cluster Displays, IoT Gateways with Local Display, Embedded Graphical Data Loggers.
Graphical HMI and Operator Panels
The PIC32MZ1025DAG169T-I/6J is purpose-built for graphical human-machine interfaces (HMI) thanks to its integrated Graphics Controller, dedicated Graphics Processor, and on-package stacked 32 MB DDR2 DRAM. The 200 MHz MIPS32 microAptiv core, combined with hardware-accelerated 2D blit and alpha-blending, drives WQVGA to WXGA-class TFT panels smoothly without an external GPU. Designers place the MCU between a 3.3 V LDO and the TFT display, using the parallel RGB interface plus optional LVDS bridge; the integrated DDR2 eliminates the need for an external SDRAM chip, reducing BOM cost and freeing board space for HMI keypads and backlight drivers in factory-floor operator panels.
推荐
Industrial Control and Factory Automation
The PIC32MZ1025DAG169T-I/6J fits industrial control designs thanks to its 12-bit 18 MSPS ADC with up to 45 analog inputs and dual CAN 2.0B modules. The 200 MHz core executes PID and motion-control loops with deterministic latency, while the 1 MB Flash accommodates large control firmware and the 640 KB SRAM holds real-time data tables. Industrial-grade -40 °C to +85 °C temperature rating supports deployment in factory-floor cabinets. The on-chip Hi-Speed USB 2.0 with PHY enables direct connection to host PCs for firmware updates and diagnostics without an external ULPI transceiver.
推荐
Point-of-Sale Terminals
The PIC32MZ1025DAG169T-I/6J suits point-of-sale (POS) terminal designs that require a touchscreen display, secure peripherals, and networked connectivity. The integrated Graphics Processor accelerates UI animations and barcode-scanner overlays, while 640 KB SRAM and 32 MB on-package DDR2 hold multi-language font tables. Two CAN modules support legacy cash-drawer and printer integrations, and Hi-Speed USB 2.0 connects to thermal printers and external barcode readers. The wide 2.3 V to 3.6 V supply range simplifies power-tree design when the POS runs from a 5 V or 12 V adapter.
推荐
Medical Patient Monitors
The PIC32MZ1025DAG169T-I/6J meets the multi-sensor and display requirements of patient monitors by combining a 12-bit 18 MSPS ADC (sampling ECG, SpO2, and temperature signals) with a TFT-capable graphics pipeline for waveform rendering. The 1 MB Flash stores waveforms and trend buffers, while the 640 KB SRAM caches the most recent 30 seconds of patient data for real-time display. The industrial -40 °C to +85 °C temperature range supports hospital and ambulatory environments, and the integrated Hi-Speed USB enables connectivity to central nursing stations.
推荐
Automotive Infotainment and Cluster Displays
Although the industrial-grade PIC32MZ1025DAG169T-I/6J is not AEC-Q100 qualified, it is commonly used in non-safety automotive infotainment and instrument-cluster prototypes where its 200 MHz core and integrated GPU render gauge animations and turn-by-turn navigation on TFT panels up to WXGA. Dual CAN 2.0B interfaces retrieve vehicle data from the body controller, while Hi-Speed USB supports media playback from USB sticks. Designers transitioning to production should evaluate the AEC-Q100 qualified PIC32MZ variant in the same DA family for production deployment.
推荐
IoT Gateways with Local Display
The PIC32MZ1025DAG169T-I/6J works as an IoT gateway MCU when local visualization of sensor data is needed. The integrated Graphics Processor renders dashboards on a small TFT without burdening the application core, while Hi-Speed USB and dual CAN connect to downstream sensors and actuators. The 1 MB Flash accommodates TLS libraries and OTA update staging areas, and the 640 KB SRAM holds message queues for Wi-Fi/BLE companion modules connected via UART or SPI. Industrial temperature rating supports outdoor enclosures.
推荐
Embedded Graphical Data Loggers
Data loggers with on-device graphical review benefit from the PIC32MZ1025DAG169T-I/6J's combination of 45 analog inputs, 1 MB Flash, 640 KB SRAM, and integrated GPU. The 18 MSPS ADC captures high-speed analog signals, while the on-package 32 MB DDR2 stores long-duration trend graphs that the Graphics Controller renders on demand. Engineers typically pair the MCU with an external microSD or USB flash drive for bulk storage and rely on Hi-Speed USB 2.0 for fast PC-side data export.
推荐
推荐产品汇总
工程参考数据： PIC32MZ1025DAG169T-I/6J ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MZ1025DAG169-I/6J | PIC32MZ1025DAB169T-I/HF | PIC32MZ1025DAB169-I/HF | PIC32MZ1024EFG144T-I/PH | PIC32MX795F512LT-80I/PF |
|---|---|---|---|---|---|---|
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 144-LQFP - different | 100-TQFP - different |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 80 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 512 KB | 128 KB |
| Integrated Graphics Controller | Yes (with GPU) | Yes (with GPU) | Yes (with GPU) | Yes (with GPU) | No | No |
| DDR Memory | 32 MB stacked | 32 MB stacked | External DDR2 | External DDR2 | External DDR2 | None |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
关键差异点
- Integrated stacked DDR2 DRAM inside the package （对比 PIC32MZ1025DAB169T-I/HF)
- Highest-in-class core frequency with hardware GPU （对比 PIC32MX795F512LT-80I/PF)
- Highest analog channel count in 32-bit MCU family （对比 PIC32MZ1024EFG144T-I/PH)
设计说明
Estimated: The 169-LFBGA package has a 0.8 mm ball pitch on an 11x11 mm body, requiring 4-layer PCB stackup with microvia-in-pad or HDI techniques for reliable escape routing. Place at least one continuous ground plane directly beneath the package and stitch vias around the BGA perimeter at 1 mm spacing to reduce return-path inductance for the 200 MHz core and DDR2 interface. Per Microchip reference designs, follow the package land pattern and ball-mapping verbatim from the datasheet mechanical drawing.
Decouple each VDD/VSS pair with a 100 nF X7R ceramic placed within 2 mm of the corresponding ball group, plus a bulk 4.7 uF or 10 uF ceramic on the main 3.3 V rail. The PIC32MZ1025DAG169T-I/6J core draws up to ~150 mA at 200 MHz with graphics active; use a low-noise LDO such as the MIC29150-3.3WU for the analog VDD rail to keep ADC noise below the central 12-bit LSB. Power sequencing is not strictly required but is recommended: ramp core 1.2 V before analog 3.3 V for clean ADC startup.
Do not omit the DDR2 calibration resistor on the stacked-DRAM balls - the internal calibration routine depends on a precise external reference. Avoid using the integrated DDR2 controller above 200 MHz DDR clock without impedance-matched T-coils or series damping resistors on the address/command lines, as ringing will corrupt write cycles. Finally, do not enable the Graphics Controller before initializing the display timing registers, or the panel may latch into a non-recoverable state requiring a full power cycle.
Estimated: At 200 MHz core and DDR2 200 MHz interface, route DDR signals with controlled 50 ohm impedance on a 4-layer stackup with ground reference plane beneath each layer. Keep trace lengths matched within ±25 mils for the DDR2 byte groups; per the PIC32MZ DA family hardware checklist, failing to match DDR traces can produce intermittent write/read errors above room temperature. Use series 33 ohm damping resistors on the DDR clock pair if ringing is observed on the TDR measurement.
合规信息
Industrial-grade -40 °C to +85 °C temperature range. Not AEC-Q100 qualified; for automotive applications use AEC-Q100 qualified PIC32MZ DA variants in the same family. RoHS and REACH compliance per Microchip product page.
