RTAX2000D-1CQ352B - 2M-Gate Rad-Tolerant FPGA | Microchip
料号： RTAX2000D-1CQ352B ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3980 | $39,800.00 |
| 100 | $3650 | $365,000.00 |
| 500 | $3390 | $1,695,000.00 |
| 1,000 | $3120 | $3,120,000.00 |
RTAX2000D-1CQ352B 概述
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation environment of orbital and deep-space missions. Within the power management of spacecraft avionics hierarchies, the RTAX-DSP family sits in the on-board data handling and payload processing tier, complemented by rad-hard supervisors and point-of-load converters. Unlike SRAM FPGAs, the antifuse technology is nonvolatile and live-at-power-up, requiring no external configuration device that could be a single-point radiation failure.
Key features include highly reliable nonvolatile antifuse interconnect, up to 540 kbits of embedded SRAM with optional EDAC protection, and up to 120 DSP mathblocks supporting 18-bit x 18-bit multiply-accumulate at 125 MHz. Total ionizing dose tolerance is rated at 300 krad (Si) functional and 200 krad (Si) with device operation guaranteed, per the digichip-published RTAX2000D datasheet summary.
Architecturally, the RTAX2000D is based on the commercial ProASIC/axcelerator-derived CMOS fabric and inherits system-level features from the RTAX-S/SL platform: embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and dedicated carry logic for arithmetic chains. The -1 speed grade and C commercial temperature range target standard-launch missions, while the B screening suffix denotes the specified lot qualification flow.
Typical applications include satellite on-board data processing, payload telemetry and telecommand interfaces, sensor front-end preprocessing, reconfigurable computing in space-flight avionics, and radiation environment instrumentation.
A key design consideration: the CCGA (ceramic column grid array) package demands careful PCB land-pattern design and column-attachment inspection flow, as only QA electrical and mechanical visual inspection is performed after solder column attachment per Microsemi assembly notes.
This page synthesizes verified distributor data, same-package drop-in alternatives within the RTAX family, pricing tiers, and practical space-flight design notes not found in the manufacturer datasheet alone.
直接替换替代料： RTAX2000D-1CQ352B ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： RTAX2000D-1CQ352B （相同外形与封装尺寸） ——差异在于 Package, Configuration, Technology, Embedded Memory, Family.
快速对比工具——选择替代料号进行并排对比：
RTAX2000D-1CQ352V
✅ 直接替换✓ 有现货
$3950 / 个
查看数据手册 →RTAX2000DL-1CQ352B
✅ 直接替换✓ 有现货
$3420 / 个
查看数据手册 →RTAX2000D-CQ352B
✅ 直接替换✓ 有现货
$3100 / 个
查看数据手册 →RTAX2000D-1CQ352E
✅ 直接替换✓ 有现货
$3650 / 个
查看数据手册 →RTAX2000D-CQ352V
✅ 直接替换✓ 有现货
$2560 / 个
查看数据手册 →RTAX4000D-CQ352B
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →RTAX2000D-1CQ352B 最大额定值与电气特性
| Family | RTAX-S/SL and RTAX-DSP (RTAX2000D) |
| Technology | Antifuse (nonvolatile), Digital CMOS |
| Equivalent System Gates | 2,000,000 |
| CLBs (Logic Cells) | 19,712 CLBs / 29,568 logic cells (per family organization) |
| DSP Mathblocks | Up to 120 (18-bit x 18-bit MAC) |
| DSP Performance | 125 MHz 18-bit x 18-bit multiply-accumulate |
| Embedded Memory | Up to 540 kbits SRAM with optional EDAC |
| Total Ionizing Dose | 300 krad (Si) functional / 200 krad (Si) with operation |
| Core Supply Voltage | 1.5 V nominal (1.425 V to 1.575 V) |
| Speed Grade | -1 |
| Temperature Range | Commercial (C) |
| 封装 | 352-pin Ceramic Column Grid Array (CQ352) |
| Configuration | Live at power-up, no external configuration device (antifuse) |
| Routing Features | Segmentable clocks, chip-wide highway routing, carry logic |
| Embedded SRAM Features | Built-in FIFO control logic |
| 安装类型 | Surface Mount (ceramic column grid array) |
| Application Domain | Space-flight, radiation-tolerant |
RTAX2000D-1CQ352B 352-pin ceramic column grid array (cq352) 引脚配置指南
RTAX2000D-1CQ352B（352-pin ceramic column grid array (cq352) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： RTAX2000D-1CQ352B.
请参阅 数据手册 以查看完整引脚配置。
典型应用
RTAX2000D-1CQ352B 适用于 6 应用s: Satellite On-Board Data Processing, Payload DSP Signal Processing, Telemetry and Telecommand Interfaces, Reconfigurable Space Avionics Glue Logic, Instrumentation and Sensor Front Ends, Launch Vehicle and Avionics Control.
Satellite On-Board Data Processing
The RTAX2000D-1CQ352B fits satellite on-board computer and data-handling roles because its antifuse fabric is immune to configuration memory upset and the device is live at power-up, eliminating external configuration PROMs that are vulnerable single points of failure in orbit. With 2,000,000 equivalent gates in 19,712 CLBs, it implements housekeeping processors, memory controllers, and bus interfaces (MIL-STD-1553, SpaceWire glue logic) in a single 1.5 V chip. The CQ352 ceramic column grid array provides the hermetic packaging required for launch and vacuum environments. Designers should budget for the 300 krad (Si) functional TID rating when planning mission duration and orbit profile.
推荐
Payload DSP Signal Processing
The RTAX-DSP variant provides up to 120 DSP mathblocks performing 18-bit x 18-bit multiply-accumulate operations at 125 MHz, making the RTAX2000D-1CQ352B suitable for payload front-end tasks such as digital filtering, FFT preprocessing, and telemetry conditioning. The embedded 540 kbits of SRAM with optional EDAC protection supports coefficient storage and buffering in a radiation environment where single-event upsets would corrupt unprotected memory. Because the fabric is antifuse-based, the DSP datapath configuration cannot be disturbed by SEUs, preserving algorithm integrity. Designs should use the carry-logic and highway routing resources to pipeline MAC chains for maximum throughput.
推荐
Telemetry and Telecommand Interfaces
The RTAX2000D-1CQ352B implements TM/TC framing, CCSDS-style packetization glue logic, and interface bridging between spacecraft avionics buses and payload electronics. Its segmentable clock structure supports multiple independent clock domains typical of telemetry subsystems, while chip-wide highway routing distributes control signals with predictable timing. Live-at-power-up behavior ensures the telecommand interface is operational immediately after spacecraft power application, which is critical for recovery sequencing after safe-mode events. The 1.5 V core with 1.425 V to 1.575 V tolerance accommodates spacecraft regulated bus variations through local point-of-load regulation.
推荐
Reconfigurable Space Avionics Glue Logic
Space avionics frequently require custom glue logic to marry legacy, one-off payloads to standard spacecraft buses. The RTAX2000D-1CQ352B's 2,000,000 gates absorb address decoders, interrupt controllers, memory arbiters, and protocol converters in a single hermetic package, reducing parts count and board area versus discrete 54-series radiation-hardened logic. Because antifuse programming is one-time and nonvolatile, the logic is verified before launch and cannot be altered by radiation, simplifying mission assurance review. Embedded FIFO control logic in the SRAM blocks handles rate buffering between asynchronous subsystems without external FIFO components.
推荐
Instrumentation and Sensor Front Ends
Scientific instruments on orbital platforms use the RTAX2000D-1CQ352B to time-stamp, deserializer, and pre-condition sensor data before downlink. The 18x18 MAC mathblocks enable on-board calibration arithmetic such as offset correction and gain scaling, while the 125 MHz fabric timing supports high-rate ADC interfaces. The radiation tolerance ratings of 200 krad (Si) with guaranteed operation cover typical LEO and MEO mission doses with margin, and the antifuse configuration ensures instrument logic behavior is identical to ground test after launch vibration and thermal cycling. Designers should verify ICCA current limits against the screening flow chosen (D or DL).
推荐
Launch Vehicle and Avionics Control
Launch-vehicle avionics benefit from the RTAX2000D-1CQ352B's deterministic, live-at-power-up behavior and immunity to configuration upset during the high-vibration, high-radiation-belt transit of ascent. The CCGA package withstands thermal and mechanical stress better than plastic-packaged FPGAs, and QA electrical plus mechanical visual inspection after solder column attachment aligns with high-reliability assembly flows. With 19,712 CLBs, the device implements redundant voting logic, fail-safe controllers, and telemetry multiplexing. Mission planners should correlate the 300 krad (Si) functional TID rating with trajectory radiation models during design review.
推荐
推荐产品汇总
工程参考数据： RTAX2000D-1CQ352B ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | RTAX2000D-1CQ352V | RTAX2000DL-1CQ352B | RTAX2000D-CQ352B | RTAX4000D-CQ352B |
|---|---|---|---|---|---|
| Package | 352-pin CCGA (CQ352) | 352-pin CCGA (CQ352) - same | 352-pin CCGA (CQ352) - same | 352-pin CCGA (CQ352) - same | 352-pin CCGA (CQ352) - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 | 4,000,000 |
| Speed Grade | -1 | -1 | -1 | Standard | Standard |
| Screening Flow | B | V (Class V-equivalent) | B with 125C ICCA screening | B | B |
| Core Supply Voltage | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) |
| Total Ionizing Dose | 300 krad (Si) functional / 200 krad (Si) with operation | 300 krad (Si) functional / 200 krad (Si) with operation | 300 krad (Si) functional / 200 krad (Si) with operation | 300 krad (Si) functional / 200 krad (Si) with operation | 300 krad (Si) functional / 200 krad (Si) with operation |
关键差异点
- Faster speed grade in same footprint （对比 RTAX2000D-CQ352B)
- Non-upset configuration fabric （对比 RTAX2000S-1CG1152V)
- Current-screened variant available pin-to-pin （对比 RTAX2000DL-1CQ352B)
- Cost-optimized density point （对比 RTAX4000D-CQ352B)
设计说明
The CQ352 is a ceramic column grid array using solder columns, not BGA balls. Per Microsemi assembly notes, only QA electrical and mechanical visual inspection is performed after solder column attachment, so the PCB land pattern must follow the CCGA column geometry exactly and assembly flow must include column-attachment verification. Avoid plastic-BGA rework assumptions: column replacement is more constrained, and inspection access under the hermetic lid differs from molded packages.
Power the 1.5 V core from a regulated point-of-load converter holding 1.425 V to 1.575 V under all load transients. Per Microsemi documentation, RTAX-D and RTAX-DL devices share the same silicon but DL parts screen ICCA current limits at 125C final electrical test; if your power budget assumes tight static current, order the DL variant (e.g., RTAX2000DL-1CQ352B) rather than relying on B-flow limits.
Antifuse FPGAs are one-time programmable - there is no post-launch reconfiguration. Verify timing closure, TID margin (300 krad Si functional), and SEU mitigation strategy (triple-mode redundancy on critical logic, EDAC on embedded SRAM) before committing the design to programming. The -1 speed grade on the B part must be confirmed against your timing analysis; slower CQ352B standard-grade parts in the same footprint are not performance-identical.
合规信息
Space-grade ceramic hermetic package; RoHS/REACH status not stated in the provided web data. Qualified per Mil Prf 38535 flows exist for Microchip FPGA parts with DLA drawing numbers (per DLA Cross Reference Guide); specific qualification status of this exact MPN should be confirmed with Microchip.
