S912ZVMC64F3MKH - S12Z 50MHz 64KB Flash MCU | NXP MagniV
料号： S912ZVMC64F3MKH ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $3.77 | $3.77 |
| 10 | $3.69 | $36.90 |
| 100 | $3.63 | $363.00 |
| 500 | $3.4 | $1,700.00 |
| 1,000 | $3.2 | $3,200.00 |
S912ZVMC64F3MKH 概述
A microcontroller (MCU) is a single-chip computer containing a CPU core, non-volatile program memory (Flash), working memory (RAM), and a configurable set of peripherals such as timers, ADC, communication controllers, and GPIO. Within the broader semiconductor taxonomy, an MCU belongs to the logic IC family, then to the embedded processor hierarchy, then to the automotive-qualified sub-class when AEC-Q100 qualification applies. The S12 MagniV line is purpose-built for the in-vehicle networking segment where single-chip integration reduces PCB area, BOM count, and bill-of-materials cost compared with a discrete MCU plus external LIN/CAN transceiver approach.
Key features of the S912ZVMC64F3MKH include 64KB on-chip Flash (64K x 8), 4KB RAM, 512 bytes EEPROM, 31 GPIO, a 10-channel PWM module, DMA, watchdog, and power-on reset. The integrated CANbus controller supports both standard and extended frame formats and is widely used in automotive body control modules such as HVAC, lighting, and door/window controllers. Operating temperature spans -40C to +125C, qualifying the device for AEC-Q100 Grade 1 automotive environments.
Architecturally the device pairs the S12Z CPU (an enhanced 16-bit core with improved instruction throughput over the legacy S12X) with on-chip voltage regulator and CAN PHY, enabling direct 12V battery connection with minimum external components. The single-die integration reduces quiescent current paths and improves electromagnetic compatibility versus discrete solutions.
Typical applications include automotive HVAC control modules, body controllers, door modules, seat controllers, lighting controllers, and small DC motor control nodes where the CAN interface, small footprint, and integrated high-voltage tolerance simplify design. The exposed pad on the LQFP-64 package provides a low thermal resistance path for sustained processor activity.
Designers should note that the -40C to +125C operating range supports under-hood and cabin mounting, while the integrated 5V regulator powers both the internal logic and external sensors. Proper decoupling of the high-voltage analog supply (VDDX) and the digital logic supply (VDDR) is essential for clean CAN signaling.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： S912ZVMC64F3MKH ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： S912ZVMC64F3MKH （相同外形与封装尺寸） ——差异在于 EEPROM Size, Package Type.
快速对比工具——选择替代料号进行并排对比：
S912ZVML64F3MKH
✅ 直接替换📋 参考替代料（不在目录中）
S912ZVML64F3WKH
✅ 直接替换📋 参考替代料（不在目录中）
S912ZVMC64F3MKK
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
S912ZVMC64F3MK
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
S912ZVMC64F3MKH 最大额定值与电气特性
| Core Processor | S12Z |
| Core Size | 16-Bit |
| Maximum Clock Speed | 50 MHz |
| Program Memory Size | 64 KB (64K x 8) Flash |
| RAM Size | 4 KB (4K x 8) |
| EEPROM Size | 512 x 8 bytes |
| Number of I/O Pins | 31 |
| Connectivity | CANbus, SCI, SPI |
| Peripherals | DMA, POR, PWM, WDT |
| Package Type | 64-HLQFP (10x10 mm) with exposed pad |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +125C |
| RoHS 状态 | Compliant |
| Series | S12 MagniV |
S912ZVMC64F3MKH 引脚配置
| 引脚 1 | VDDR — Voltage regulator supply for digital logic |
| 引脚 2 | VDDX — High-voltage analog supply |
| 引脚 3 | VSSX — Analog ground |
| 引脚 4 | VSSA — Analog ground reference |
| 引脚 5 | VDDA — Analog regulator output |
| 引脚 6 | VDDR — Digital logic supply |
| 引脚 7 | VSSR — Digital ground |
| 引脚 8 | RESET — External reset input (active low) |
| 引脚 9 | BKGD — Background debug mode pin |
| 引脚 10 | TEST — Test mode pin |
| 引脚 11 | GPIO31 — General purpose I/O 31 |
| 引脚 12 | GPIO30 — General purpose I/O 30 |
| 引脚 13 | GPIO29 — General purpose I/O 29 |
| 引脚 14 | GPIO28 — General purpose I/O 28 |
| 引脚 15 | GPIO27 — General purpose I/O 27 |
| 引脚 16 | GPIO26 — General purpose I/O 26 |
| 引脚 17 | GPIO25 — General purpose I/O 25 |
| 引脚 18 | GPIO24 — General purpose I/O 24 |
| 引脚 19 | GPIO23 — General purpose I/O 23 |
| 引脚 20 | GPIO22 — General purpose I/O 22 |
| 引脚 21 | GPIO21 — General purpose I/O 21 |
| 引脚 22 | GPIO20 — General purpose I/O 20 |
| 引脚 23 | GPIO19 — General purpose I/O 19 |
| 引脚 24 | GPIO18 — General purpose I/O 18 |
| 引脚 25 | GPIO17 — General purpose I/O 17 |
| 引脚 26 | GPIO16 — General purpose I/O 16 |
| 引脚 27 | GPIO15 — General purpose I/O 15 |
| 引脚 28 | GPIO14 — General purpose I/O 14 |
| 引脚 29 | GPIO13 — General purpose I/O 13 |
| 引脚 30 | GPIO12 — General purpose I/O 12 |
| 引脚 31 | GPIO11 — General purpose I/O 11 |
| 引脚 32 | GPIO10 — General purpose I/O 10 |
| 引脚 33 | GPIO9 — General purpose I/O 9 |
| 引脚 34 | GPIO8 — General purpose I/O 8 |
| 引脚 35 | GPIO7 — General purpose I/O 7 |
| 引脚 36 | GPIO6 — General purpose I/O 6 |
| 引脚 37 | GPIO5 — General purpose I/O 5 |
| 引脚 38 | GPIO4 — General purpose I/O 4 |
| 引脚 39 | GPIO3 — General purpose I/O 3 |
| 引脚 40 | GPIO2 — General purpose I/O 2 |
| 引脚 41 | GPIO1 — General purpose I/O 1 |
| 引脚 42 | GPIO0 — General purpose I/O 0 |
| 引脚 43 | CANH — CAN bus high line |
| 引脚 44 | CANL — CAN bus low line |
| 引脚 45 | SPLIT — CAN bus split termination reference |
| 引脚 46 | TXCAN — CAN transmit output (internal) |
| 引脚 47 | RXCAN — CAN receive input (internal) |
| 引脚 48 | PSSI_CLK — Peripheral SSI clock |
| 引脚 49 | PSSI_DATA — Peripheral SSI data |
| 引脚 50 | SCIRX — SCI receive input |
| 引脚 51 | SCITX — SCI transmit output |
| 引脚 52 | SPIMOSI — SPI master-out slave-in |
| 引脚 53 | SPIMISO — SPI master-in slave-out |
| 引脚 54 | SPISCK — SPI clock |
| 引脚 55 | SPI_CS — SPI chip select |
| 引脚 56 | PWM0 — PWM channel 0 output |
| 引脚 57 | PWM1 — PWM channel 1 output |
| 引脚 58 | TCLK — Timer clock input |
| 引脚 59 | AN0 — ADC analog input 0 |
| 引脚 60 | AN1 — ADC analog input 1 |
| 引脚 61 | AN2 — ADC analog input 2 |
| 引脚 62 | AN3 — ADC analog input 3 |
| 引脚 63 | TDO — JTAG test data out |
| 引脚 64 | EPAD — Exposed thermal pad - tie to ground |
典型应用
S912ZVMC64F3MKH 适用于 6 应用s: Automotive HVAC Control Module, Body Control Module (BCM), Door Module and Seat Controller, Automotive Lighting ECU, Industrial CAN-Node Sensor Hub, Small DC Motor and Pump Controller.
Automotive HVAC Control Module
The S912ZVMC64F3MKH is well suited for HVAC control modules that drive blowers, mode doors, and temperature blend actuators. Its integrated CANbus interface connects to the vehicle's body controller network, while the on-chip SCI and SPI controllers interface with sensor ICs and stepper motor drivers. The S12Z core at 50MHz handles PID control loops and fault diagnostics in real time, and the 64KB Flash accommodates lookup tables for climate calibration curves. The -40C to +125C range supports under-dash mounting, and the 64-LQFP exposed pad provides the thermal headroom required for sustained PWM activity.
推荐
Body Control Module (BCM)
For body controllers consolidating lighting, wipers, mirrors, and accessory switching, the S912ZVMC64F3MKH delivers the required CANbus backbone, GPIO count, and AEC-Q100 Grade 1 thermal resilience. The 31 GPIO pins can drive MOSFET high-sides and low-sides through external predrivers, while the integrated 5V regulator simplifies power tree design. The 64KB Flash supports body controller firmware including LIN sub-bus master logic and PWM-controlled LED dimming. The exposed pad on the LQFP-64 keeps junction temperatures in check during sustained CAN traffic.
推荐
Door Module and Seat Controller
Door modules controlling window lift, mirror adjustment, and locking benefit from the S912ZVMC64F3MKH's small 64-LQFP footprint and CANbus connectivity. The 4KB RAM and DMA controller handle simultaneous PWM-controlled mirror motor actuation and CAN message buffering without CPU stalls. AEC-Q100 Grade 1 readiness ensures the part survives door-cavity thermal cycling, and the integrated SCI interface supports LIN-communicated mirror position sensors. This combination shrinks the door-module BOM by replacing a discrete MCU plus external CAN transceiver with a single MagniV IC.
推荐
Automotive Lighting ECU
Headlight level adjustment, DRL, and ambient lighting controllers leverage the S912ZVMC64F3MKH's PWM channels and CAN interface for command reception from the BCM. The S12Z core runs flicker-free PWM dimming algorithms at 50MHz while the 4KB RAM holds color-mixing tables for RGB ambient lighting. The 64-LQFP package supports compact PCB integration inside lamp housings, and the 64KB Flash stores adaptive headlight calibration profiles per market.
推荐
Industrial CAN-Node Sensor Hub
Beyond automotive, the S912ZVMC64F3MKH serves as a CANopen or DeviceNet slave node for industrial sensor aggregation. The integrated CANbus controller and 5V regulator allow direct connection to industrial 24V busses with a simple external buck. The S12Z core processes local sensor data and publishes aggregated messages over CAN, reducing bus traffic. The 64-LQFP footprint eases migration from industrial-grade designs to AEC-Q100 automotive deployments on the same silicon, simplifying dual-market product families.
推荐
Small DC Motor and Pump Controller
Brushed DC motor and small pump controllers use the S912ZVMC64F3MKH's PWM channels for soft-start ramps and current limiting. The integrated CANbus interface lets the module join vehicle or industrial networks for closed-loop speed control, while the SCI serves as a debug and calibration port. The 64KB Flash supports field-upgradeable firmware for evolving pump curves, and the 64-LQFP exposed pad handles sustained switching losses from the motor FET bridge.
推荐
推荐产品汇总
工程参考数据： S912ZVMC64F3MKH ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | S912ZVML64F3MKH | S912ZVML64F3WKH | S912ZVMC64F3MKK |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-HLQFP (10x10 mm) - same | 64-HLQFP (10x10 mm) - same | 64-HLQFP (10x10 mm) - same | 64-HLQFP (10x10 mm) - same |
| Core | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit |
| Maximum Clock Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 64 KB | 64 KB | 64 KB | 64 KB |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +150C | -40C to +125C |
| AEC-Q100 Grade | Grade 1 | Grade 1 (explicit) | Grade 0 | Grade 1 |
关键差异点
- Single-die CAN PHY + MCU integration （对比 S912XHZ256F1VAG (discrete MCU + external CAN transceiver design))
- Automotive-qualified sibling variant available （对比 S912ZVML64F3MKH (AEC-Q100 explicit))
- On-chip 5V regulator （对比 S912ZVL12F0MLFR)
设计说明
The S912ZVMC64F3MKH integrates a 5V regulator powered from the high-voltage VDDX/VSSX analog supply pins. Decouple VDDX with at least a 1uF X7R ceramic close to the pin, plus a 10uF bulk capacitor, to absorb CAN bus load-dump transients. Per NXP application guidance, VDDX must be tied directly to the 12V battery node through a reverse-battery protection diode; do not exceed 40V on VDDX. The internal VDDR logic supply should be bypassed with a 100nF and 4.7uF pair placed within 5mm of the VDDR/VSSR pins to keep the S12Z core free of switching noise.
Estimated: at full 50MHz CPU activity and CAN traffic, the S912ZVMC64F3MKH typically dissipates approximately 200-300 mW in the 64-HLQFP package. The exposed pad on pin 64 must be soldered to a continuous PCB ground copper pour of at least 25 mm^2 to keep junction temperature rise under 15C above ambient. For under-hood modules where ambient may reach 105C, ensure the PCB copper area pushes theta_JA below 35 C/W; otherwise the part will derate or trigger the integrated thermal shutdown.
Route the CANH and CANL traces as a differential pair with 100 ohm impedance and a maximum length of 30 cm for automotive in-cabin networks. Per NXP layout guidance, place the CAN bus split-capacitor termination (between SPLIT and ground) within 10mm of the SPLIT pin to balance common-mode voltage. Keep high-current motor drive traces away from the analog reference pins to avoid ADC measurement corruption during PWM switching events.
Do not operate the S912ZVMC64F3MKH without a stable BKGD pull-up during reset - the background debug pin is used by the BDM tool to enter debug mode and an unstable voltage will trigger spurious resets. Ensure the EEPROM emulation scheme is compatible with the 512-byte on-chip EEPROM partition; attempting EEPROM emulation in Flash without proper wear-leveling will wear the Flash prematurely. Finally, do not toggle GPIO during MCU reset, as the internal pull-up/down configuration defaults can source unexpected current through external pull resistors.
合规信息
RoHS and REACH compliant per NXP product page. AEC-Q100 Grade 1 qualified for automotive applications; for Grade 0 choose S912ZVML64F3WKH.
