S9S08DZ16F2MLC - 40MHz 16KB Flash MCU | NXP | Automotive
料号： S9S08DZ16F2MLC ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $13.34 | $13.34 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
S9S08DZ16F2MLC 概述
A microcontroller is a programmable system-on-chip that executes firmware, reads inputs, controls outputs, and manages communication protocols. The S08 belongs to the 8-bit MCU -> embedded controller -> semiconductor hierarchy. Compared with more complex application processors, this device emphasizes compact code execution, real-time peripherals, and low-pin-count integration. Its automotive qualification makes it relevant to body, chassis, comfort, and industrial controller designs where operating-temperature robustness and interface breadth matter.
Verified source snippets identify a -40°C to +125°C operating range, 16 KB Flash, 4 KB RAM in the distributor overview, an 8-bit ADC, SCI, and SPI interfaces, plus CAN, I2C, LIN, PWM, watchdog, LVD, and POR functions. The 32-LQFP package measures 7 mm by 7 mm according to distributor data. These details support compact controller layouts with external sensing, communications, and actuator interfaces.
The part uses the NXP S08 8-bit core and supports embedded automotive communication environments. CAN and LIN connectivity are especially useful for distributed vehicle networks, while SCI and SPI allow connection to sensors, transceivers, displays, and external memory or digital peripherals. The ADC provides an analog measurement path where a dedicated external converter would otherwise be required.
Typical uses include automotive body-control modules, sensor nodes, motor or actuator controllers, HVAC interfaces, lighting controllers, and industrial embedded-control boards. Because it is an 8-bit MCU with 16 KB Flash, firmware size and interrupt latency should be checked early; applications requiring extensive protocol stacks, graphics, or large data storage may need a higher-capacity MCU.
For a new PCB, preserve the verified 32-pin LQFP footprint and validate the exact pin multiplexing, voltage domains, oscillator connections, and debug interface against the manufacturer datasheet. For an existing design, verify package pin compatibility, firmware dependencies, memory map, peripheral availability, and qualification requirements before approving any substitute.
This page combines verified distributor specifications, availability references, and design-oriented selection guidance. It intentionally distinguishes confirmed data from missing parameters and does not infer unreported electrical limits, pin names, or unqualified drop-in replacements.
直接替换替代料： S9S08DZ16F2MLC ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： S9S08DZ16F2MLC （相同外形与封装尺寸） ——差异在于 Operating Temperature, RAM Size, Series, Package, Connectivity.
快速对比工具——选择替代料号进行并排对比：
MC9S08DZ16ACLC
✅ 直接替换📋 参考替代料（不在目录中）
MC9S08DV16ACLC
✅ 直接替换📋 参考替代料（不在目录中）
S9S08DZ16F1MLC
✅ 直接替换✓ 有现货
$3.65 / 个
查看数据手册 →S9S08DZ60F2MLF
✅ 直接替换✓ 有现货
$2.85 / 个
查看数据手册 →S9S08AW16AE0CLC
✅ 直接替换✓ 有现货
$1.9 / 个
查看数据手册 →S9S08DZ16F2MLC 最大额定值与电气特性
| Core | S08 8-bit core |
| 最大时钟频率 | 40 MHz |
| Program Memory | 16 KB Flash |
| RAM Memory | 4 KB |
| 工作温度 | -40°C to +125°C |
| Automotive Qualification | Automotive qualified |
| 封装 | 32-LQFP, 7 mm x 7 mm |
| 引脚数 | 32 pins |
| I/O Pins | 25 |
| ADC | 8-bit ADC |
| Communication Interfaces | CANbus, I2C, LINbus, SCI, SPI |
| Peripheral Functions | LVD, POR, PWM, WDT |
| 安装类型 | Surface mount |
| Product Status | Active |
| 电源电压 | 3.3 V / 5 V |
S9S08DZ16F2MLC 32-lqfp, 7 mm x 7 mm 引脚配置指南
S9S08DZ16F2MLC（32-lqfp, 7 mm x 7 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： S9S08DZ16F2MLC.
请参阅 数据手册 以查看完整引脚配置。
典型应用
S9S08DZ16F2MLC 适用于 6 应用s: Automotive CAN Sensor Nodes, Body-Control Module, Automotive HVAC Interface, Industrial Motor and Actuator Control, CAN-Based Distributed Control, Sensor and Signal Conditioning.
Automotive CAN Sensor Nodes
The S9S08DZ16F2MLC fits distributed vehicle sensor nodes because verified data identifies CANbus support, an 8-bit ADC, a 40 MHz S08 core, and a -40°C to +125°C operating range. Place the MCU between an external CAN transceiver and analog sensor circuitry, then use its ADC and digital I/O to acquire signals and report measurements over the vehicle network. The 16 KB Flash and 4 KB RAM support compact control and diagnostic firmware rather than complex gateway workloads. Before layout, confirm CAN timing, transceiver standby behavior, pin multiplexing, and the exact package pin assignment in the NXP datasheet.
推荐
Body-Control Module
A body-control module can use the S9S08DZ16F2MLC for input conditioning, actuator timing, diagnostic communication, and distributed vehicle I/O. Its verified PWM, watchdog, low-voltage detection, and power-on reset functions support robust control loops, while CAN, LIN, SCI, and SPI expand communication options. The MCU is appropriate for a compact 32-LQFP design where code size is modest and control timing is predictable. Use external drivers for lamps, relays, motors, or high-current loads, and validate reset, brownout, watchdog, and thermal behavior across the complete automotive environment.
推荐
Automotive HVAC Interface
The S9S08DZ16F2MLC is suitable for an HVAC interface that combines temperature or pressure sensing with actuator control. Its verified 8-bit ADC supports analog measurements, and its PWM capability can drive fan or valve commands when paired with suitable external transistors and protection circuitry. SCI, SPI, CAN, and LIN allow connection to cabin modules, sensors, or a central vehicle controller. The -40°C to +125°C listed range is relevant to the vehicle environment, but the final design must also verify sensor accuracy, output drive current, EMI, and thermal conditions for the complete actuator board.
推荐
Industrial Motor and Actuator Control
For compact industrial actuator controllers, the S9S08DZ16F2MLC can execute deterministic control logic using its verified 40 MHz S08 core, PWM, ADC, watchdog, and serial interfaces. The ADC can monitor current, position, temperature, or analog feedback, while external power transistors should handle motor loads and electrical isolation. CAN, LIN, SCI, and SPI provide options for supervisory control and sensor networking. Because this is an 8-bit MCU with 16 KB Flash and 4 KB RAM, use it where the control loop and protocol stack fit comfortably; move to a larger MCU when logging, graphics, or heavy networking dominates.
推荐
CAN-Based Distributed Control
The S9S08DZ16F2MLC can serve as a low-to-medium complexity distributed controller when a board needs local I/O, analog conversion, and vehicle-network communication. Verified CANbus, LINbus, SCI, and SPI interfaces allow the design to combine a local sensor node with external transceivers or service interfaces. Its 32-LQFP 7 mm by 7 mm package supports compact controller placement, while the watchdog and low-voltage detection help supervise reliable operation. The exact communication clocking, baud-rate range, filter resources, and pin assignments must be taken from the manufacturer documentation before the network design is frozen.
推荐
Sensor and Signal Conditioning
The verified 8-bit ADC makes the S9S08DZ16F2MLC suitable for embedded signal-conditioning tasks such as monitoring resistive, current, temperature, or position-related sensors. The MCU can sample analog inputs, apply calibration and filtering in firmware, report results through SCI or SPI, and supervise the process with its watchdog and low-voltage detection. Its 40 MHz clock provides control-loop headroom, while the 16 KB Flash and 4 KB RAM impose a clear firmware budget. Validate ADC resolution, sampling timing, input impedance, reference accuracy, noise performance, and sensor protection against the complete NXP datasheet.
推荐
推荐产品汇总
工程参考数据： S9S08DZ16F2MLC ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MC9S08DZ16ACLC | MC9S08DV16ACLC | S9S08DZ16F1MLC | S9S08DZ60F2MLF | S9S08AW16AE0CLC |
|---|---|---|---|---|---|---|
| Package | 32-LQFP, 7 mm x 7 mm | 32-LQFP | 32-LQFP | 32-LQFP | 32-LQFP | 32-LQFP |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
关键差异点
- Verified automotive-oriented feature set （对比 MC9S08DV16ACLC)
- Broad verified connectivity （对比 MC9S08DZ16ACLC)
- Compact 32-LQFP integration （对比 S9S08DZ16F1MLC)
- Mixed-signal and network-ready control （对比 S9S08AW16AE0CLC)
设计说明
Create the land pattern from the official NXP 32-LQFP package drawing rather than from a generic 32-pin library. Confirm the 7 mm by 7 mm body, lead pitch, pin numbering, courtyard, solder-mask clearance, and any thermal or exposed-pad requirement. The verified data identifies the package but does not provide a complete pin table, so no pin names or footprint geometry should be inferred. Review all power, ground, clock, reset, programming, and unused pins against the manufacturer datasheet before releasing the PCB.
The verified data confirms 3.3 V/5 V operation in comparison snippets but does not provide complete absolute maximum ratings, regulator sequencing, or decoupling values. Follow the NXP datasheet for the exact supply range, core and I/O voltage relationships, startup behavior, and capacitor requirements. Do not power external CAN, LIN, or actuator circuitry from MCU pins without checking current limits and adding appropriate protection. Validate brownout behavior because the part includes power-on reset and low-voltage detection functions.
Separate analog and digital return paths carefully around the verified 8-bit ADC. Place decoupling, clock, and reset components according to the manufacturer reference layout, and keep high-current switching nodes and communication transceivers physically separated from sensitive sensor inputs. A CAN or LIN transceiver is an external component; its supply, termination, protection, and signal routing must be designed independently of the MCU. Use the NXP datasheet and application guidance for final EMI and signal-integrity review.
Do not substitute a similarly named S08 device solely because both parts are described as 8-bit, 40 MHz, 16 KB Flash, and 32-LQFP. Verify the complete pinout, alternate-function mapping, memory organization, ADC channels, communication peripherals, clock options, reset polarity, electrical limits, temperature range, and automotive qualification. Firmware built for the DZ device may depend on register addresses, interrupt vectors, or peripheral resources that are not documented in the supplied comparison snippets.
The verified data provides a -40°C to +125°C operating range but no power dissipation, thermal resistance, or maximum junction-temperature specification. Use the NXP datasheet for electrical limits and thermal parameters, then estimate board temperature from actual switching and regulator losses rather than from the MCU label alone. Account for the temperature rise of the PCB, enclosure, external drivers, and power supply in automotive or industrial installations. Validate the assembled system at the highest expected ambient temperature and worst-case I/O activity.
合规信息
The verified data identifies S9S08DZ16F2MLC as automotive qualified and operating from -40°C to +125°C, but does not provide exact RoHS, REACH, AEC-Q100 grade, lead-free, halogen-free, or conflict-minerals documentation.
