SAK-TC277TP-64F200N - AURIX TC27xT 200MHz Tri-Core MCU | Infineon
料号： SAK-TC277TP-64F200N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $35.2 | $352.00 |
| 100 | $31.8 | $3,180.00 |
| 500 | $28.4 | $14,200.00 |
| 1,000 | $25.9 | $25,900.00 |
SAK-TC277TP-64F200N 概述
An AURIX TriCore microcontroller is a 32-bit MCU family that fuses a RISC-style microcontroller, a DSP, and a microcontroller load/store unit into one deterministic architecture. The AURIX TC2xx family sits within the broader category of automotive MCUs and is positioned for safety-critical powertrain, chassis, ADAS, and body-domain applications where lockstep cores, hardware security modules, and ASIL-D support are mandatory. SAK-TC277TP-64F200N specifically belongs to the TC27xT sub-family, which extends the TC27x line with the GTM for advanced timer/PWM workloads.
Key features include a triple-core lockstep TriCore configuration at 200 MHz, 4 MB program memory, 472 KB SRAM, four CAN nodes, GTM timers, hardware security module (HSM), and ISO 26262 ASIL-D readiness. The PG-LFBGA-292 package provides high integration density while supporting automotive temperature ranges, making it suitable for under-hood and safety controller placement.
Typical applications include automotive powertrain ECUs, electric vehicle inverter control, advanced driver-assistance systems (ADAS), chassis and braking controllers, and body domain controllers. Wide peripheral integration (CAN, LIN, SPI, ASCLIN, GTM timers, ADC) replaces several discrete ICs, reducing BOM cost and PCB area. Internal voltage domains of 1.3 V core and 5 V I/O simplify interfaces to analog sensors and bus transceivers.
When designing with this MCU, ensure PCB layout uses microvia stacks for the PG-LFBGA-292 footprint, allocate sufficient decoupling across all 1.3 V and 5 V rails, and validate lockstep configuration against the latest Infineon AURIX safety manual. This page synthesizes distributor availability, AURIX-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： SAK-TC277TP-64F200N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
SAK-TC277TP-64F200N DC
✅ 直接替换📋 参考替代料（不在目录中）
TC277TP64F200NDCKXUMA1
✅ 直接替换📋 参考替代料（不在目录中）
TC277TP64F200NDCKXUMA3
✅ 直接替换📋 参考替代料（不在目录中）
SAK-TC277T-64F200N DC
✅ 直接替换📋 参考替代料（不在目录中）
SAK-TC277TP-64F200S
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
SAK-TC277TP-64F200N 最大额定值与电气特性
| Core Architecture | TriCore (3x 32-bit TriCore CPUs) |
| 最大时钟频率 | 200 MHz |
| Program Memory (Flash) | 4 MB (4M x 8) |
| SRAM (including Cache) | 472 KB |
| CAN Nodes | 4 |
| Core Voltage | 1.3 V |
| I/O Voltage | 5 V |
| 封装 | PG-LFBGA-292 (LFBGA-292-6) |
| 安装类型 | Surface Mount |
| Generic Timer Module (GTM) | Yes |
| Hardware Security Module (HSM) | Yes |
| Functional Safety | ISO 26262 ASIL-D capable |
| Family | AURIX TC2xx / TC27xT |
| RoHS 状态 | Compliant |
SAK-TC277TP-64F200N pg-lfbga-292 (lfbga-292-6) 引脚配置指南
SAK-TC277TP-64F200N（pg-lfbga-292 (lfbga-292-6) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： SAK-TC277TP-64F200N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
SAK-TC277TP-64F200N 适用于 6 应用s: Automotive Powertrain ECU, Electric Vehicle Traction Inverter Control, ADAS Domain Controller, Chassis and Braking Controller (ESC/EPS), Body Domain Controller, Industrial Safety PLC.
Automotive Powertrain ECU
Used in engine management and transmission ECUs where ISO 26262 ASIL-D safety integrity is mandatory. The SAK-TC277TP-64F200N's three 200 MHz TriCore cores deliver enough compute headroom to run real-time combustion or torque control plus diagnostics, while 4 MB Flash stores calibration tables and ASIL-D software. The integrated GTM generates precise fuel-injection and spark-advance PWMs without an external timer IC. Four CAN nodes allow simultaneous gateway, powertrain, and diagnostics buses. Lower BOM cost and improved EMI immunity versus two-MCU lockstep designs make this part well suited for engine and e-axle control units.
推荐
Electric Vehicle Traction Inverter Control
Drives the main traction inverter in battery EVs and hybrid powertrains. The SAK-TC277TP-64F200N's ASIL-D readiness, GTM-assisted PWM, and lockstep TriCore pair enable functional-safe field-oriented control of a 3-phase motor with torque-accuracy better than 5%. Wide I/O voltage tolerance up to 5 V interfaces directly to gate-driver ICs such as the Infineon EiceDRIVER family, while four CAN nodes support the vehicle CAN-FD backbone. The part's PG-LFBGA-292 footprint is consistent with high-density automotive inverter PCBs and lets designers co-locate safety, motor-control, and DC-DC control firmware on a single MCU.
推荐
ADAS Domain Controller
Acts as the safety host controller for ADAS sensor fusion and decision logic in Level 2 to Level 3 driver-assistance systems. The SAK-TC277TP-64F200N's three-core architecture dedicates one CPU to sensor data acquisition, one to fusion/decision, and one to lockstep safety monitoring, with the integrated HSM securing V2X and OTA key material. ASIL-D capability is essential when the controller drives braking or steering interventions. The 4 MB Flash accommodates complex perception stacks and the hardware security module accelerates crypto for authenticated firmware updates.
推荐
Chassis and Braking Controller (ESC/EPS)
Suited for electronic stability control, electric power steering, and brake-by-wire chassis ECUs. The SAK-TC277TP-64F200N's lockstep cores and ASIL-D qualification are required for braking and steering safety functions, where a single-point fault could be life-critical. The GTM provides synchronized wheel-speed sampling and motor-command PWMs with deterministic latency, while the four CAN-FD nodes connect to wheel-speed sensors, the hydraulic modulator, and the vehicle bus. Hardware security module integration guards steering-angle authentication against tampering.
推荐
Body Domain Controller
Replaces distributed body control modules with a centralized body domain controller consolidating lighting, gateway, and BCM functions. The SAK-TC277TP-64F200N's 472 KB SRAM plus 4 MB Flash are sufficient for body-domain firmware stacks and routing tables, while four CAN nodes and multiple ASCLIN/LIN interfaces handle legacy body bus traffic. ASIL-B capable partitioning in the same device allows mixed-criticality firmware - body functions at QM/ASIL-A and gateway security at ASIL-B - on a single MCU, reducing part count and wiring.
推荐
Industrial Safety PLC
Although automotive-focused, the SAK-TC277TP-64F200N is equally applicable in industrial safety PLCs where IEC 61508 SIL-3 / SIL-4 certification is required. Three independent TriCore cores plus lockstep mode let designers run a safety logic solver, non-safety application logic, and diagnostics in parallel with hardware-level separation. The PG-LFBGA-292 footprint accommodates high-density industrial controller PCBs. Wide 5 V I/O tolerance simplifies interfacing to legacy 24 V industrial sensor inputs via external level shifters.
推荐
推荐产品汇总
工程参考数据： SAK-TC277TP-64F200N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | SAK-TC277TP-64F200N DC | TC277TP64F200NDCKXUMA1 | TC277TP64F200NDCKXUMA3 | SAK-TC277T-64F200N DC |
|---|---|---|---|---|---|
| Package | PG-LFBGA-292 | PG-LFBGA-292 | PG-LFBGA-292 | PG-LFBGA-292 | PG-LFBGA-292 |
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon |
| Core Count / Architecture | 3x TriCore @ 200 MHz | 3x TriCore @ 200 MHz | 3x TriCore @ 200 MHz | 3x TriCore @ 200 MHz | 3x TriCore @ 200 MHz |
| Program Flash | 4 MB | 4 MB | 4 MB | 4 MB | 4 MB |
| SRAM (incl. cache) | 472 KB | 472 KB | 472 KB | 472 KB | 472 KB |
| CAN Nodes | 4 | 4 | 4 | 4 | 4 |
| Generic Timer Module (GTM) | Yes | Yes | Yes | Yes | Reduced |
| Functional Safety (ISO 26262) | ASIL-D capable | ASIL-D capable | ASIL-D capable | ASIL-D capable | ASIL-D capable |
关键差异点
- Complete peripheral set on the same die （对比 SAK-TC277T-64F200N DC)
- Triple-core lockstep compute headroom （对比 Single-core AURIX TC21x)
- ISO 26262 ASIL-D ready out of the box （对比 General-purpose industrial MCUs)
设计说明
The PG-LFBGA-292 package requires microvia stack-up (laser-drilled microvias from outer layers to inner pad layers) on the PCB. Use at least 1 oz copper on outer layers with 0.5 oz on inner layers for adequate current handling on the 1.3 V core and 5 V I/O power planes. Place 100 nF decoupling capacitors within 1 mm of each power pin and add 4.7 uF bulk capacitors on each supply rail within 5 mm. Match trace lengths for high-speed interfaces such as QSPI and ASC to avoid timing skew.
Estimated: at maximum 200 MHz tri-core load with 1.3 V core supply, core power dissipation is approximately 1.5 W; add I/O and analog power for a typical total of 2-3 W. With the PG-LFBGA-292 thermal pad soldered to a 10 mm x 10 mm copper pour on the top layer, thermal resistance theta_JA is approximately 25 C/W, yielding a 50-75 C junction-temperature rise at full load. Use thermal vias under the exposed die pad and provide adequate airflow for under-hood ECU placement.
Do not route the 1.3 V core supply or the 5 V I/O analog supply on the same plane; use split power planes to avoid core noise coupling into sensitive ADC inputs. Always assert the ESR pin configuration correctly during power-on; incorrect ESR latching will leave the MCU in a non-functional state. Validate the lockstep configuration against the latest Infineon AURIX safety manual before deploying firmware in an ASIL-D context - lockstep disable voids ASIL-D claims.
Series-terminate high-speed QSPI flash interfaces with 33 ohm resistors placed within 5 mm of the MCU ball. For CAN-FD bus runs above 1 m, use twisted-pair cable with 120 ohm termination at each end and place a common-mode choke near the connector. The GTM clock output pins are particularly sensitive to capacitive loading; keep stubs under 3 mm to preserve PWM edge fidelity.
合规信息
RoHS compliant per Infineon and JLCPCB listings. AEC-Q100 qualified as automotive-grade MCU. ISO 26262 ASIL-D capable per Infineon product page.
