SAM9X60T-V/DWB - 600MHz ARM926EJ-S MPU, 228-TFBGA | Microchip
料号： SAM9X60T-V/DWB ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $29.1 | $291.00 |
| 100 | $26.45 | $2,645.00 |
| 500 | $23.8 | $11,900.00 |
| 1,000 | $21.2 | $21,200.00 |
SAM9X60T-V/DWB 概述
What is an ARM926EJ-S MPU? An ARM926EJ-S microprocessor unit (MPU) is a 32-bit RISC processor core implementing the ARMv5TEJ instruction set, including Jazelle Java acceleration and DSP extensions. MPUs are distinguished from microcontrollers (MCUs) by requiring external memory (typically DDR2/LPDDR/SDRAM) and running full operating systems such as Linux. Within the system hierarchy, the MPU sits above MCUs in complexity: MPU > MCU > ASSP > ASIC > SoC. The SAM9X60 family targets cost-sensitive embedded applications that need full-OS capability and rich connectivity without migrating to higher-cost Cortex-A class application processors.
Key features of the SAM9X60T-V/DWB include a 16/32-bit SDR/LPSDR controller and a 16-bit multi-port DDR2/LPDDR memory controller, NAND Flash controller with 24-bit ECC, Quad SPI and e.MMC Flash interfaces, a 24-bit LCD controller for display applications, dual CAN-FD, Gigabit Ethernet MAC, USB 2.0 High-Speed Host and Device, image sensor interface, and 12-bit ADC. Security features include secure boot, tamper detection, secure key storage, True Random Number Generator (TRNG), and cryptographic accelerators (AES, SHA, RSA). Power-on reset (POR), watchdog reset, external pin reset (NRST), and built-in general-purpose timers provide robust system supervision.
Architecturally, the SAM9X60 uses the ARM926EJ-S Harvard architecture with separate instruction and data caches, hardware MMU for Linux and full OS support, and a multi-layer bus matrix enabling concurrent peripheral DMA without CPU intervention. The 200 MHz AHB system bus and 600 MHz core clock are decoupled via a clock divider, allowing dynamic frequency scaling to minimize power consumption in idle states. Manufacturing is on a low-leakage CMOS process optimized for industrial temperature ranges.
Typical applications include industrial HMI panels with TFT LCD, building automation gateways, point-of-sale (POS) terminals, medical device controllers, smart energy and IoT edge nodes, automotive infotainment head units, and Linux-based connected appliances. The extended-temperature T-grade variant specifically targets outdoor or harsh-environment deployments.
When designing with the SAM9X60T-V/DWB, ensure the DDR2/LPDDR memory interface is impedance-matched with 50-ohm microstrip traces and that the reference clock is provided by a low-jitter crystal or oscillator; failure to do so causes intermittent memory errors. Use the Microchip-provided Linux BSP from linux4sam.github.io to minimize boot-time debugging.
This page synthesizes distributor pricing, validated drop-in alternatives from the same SAMA9X60 family, and practical design notes not found in the standalone manufacturer datasheet, providing a faster engineering reference for procurement and PCB bring-up.
直接替换替代料： SAM9X60T-V/DWB ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： SAM9X60T-V/DWB （相同外形与封装尺寸） ——差异在于 Ethernet, LCD Controller, NVM Interfaces, Package, USB.
快速对比工具——选择替代料号进行并排对比：
SAM9X60-V/DWB
✅ 直接替换📋 参考替代料（不在目录中）
SAM9X60T-V/DWBVAO
✅ 直接替换📋 参考替代料（不在目录中）
SAM9X60D6K-I/4GB
✅ 直接替换✓ 有现货
$19.5 / 个
查看数据手册 →SAM9X60T-V/DWB 最大额定值与电气特性
| Manufacturer | Microchip Technology |
| Series | SAM9X60 |
| Core Processor | ARM926EJ-S |
| Core Size | 32-Bit |
| Number of Cores | 1 |
| Maximum CPU Clock | 600 MHz |
| System / Memory Bus Clock | 200 MHz |
| Instruction Cache | 32 kB |
| Data Cache | 32 kB |
| Internal SRAM | 64 kB |
| Memory Controllers | 16/32-bit SDR/LPSDR, 16-bit multi-port DDR2/LPDDR |
| NVM Interfaces | NAND Flash (24-bit ECC), Quad SPI, e.MMC Flash |
| LCD Controller | 24-bit TFT LCD |
| Ethernet | 10/100/1000 Mbps GMAC |
| USB | USB 2.0 High-Speed Host + Device |
| CAN | 2x CAN-FD |
| ADC | 12-bit |
| Image Sensor Interface | Yes (ITU-R BT.601/656) |
| Security Features | Secure boot, tamper detection, TRNG, AES/SHA/RSA accelerators |
| Temperature Grade | Extended (T-grade) |
| 封装 | 228-TFBGA (11x11 mm) |
| 安装类型 | Surface Mount |
| MSL 等级 | 3 (168 hours) |
| RoHS 状态 | Compliant |
SAM9X60T-V/DWB 228-tfbga (11x11 mm) 引脚配置指南
SAM9X60T-V/DWB（228-tfbga (11x11 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： SAM9X60T-V/DWB.
请参阅 数据手册 以查看完整引脚配置。
典型应用
SAM9X60T-V/DWB 适用于 6 应用s: Industrial HMI Control Panels, Building Automation Gateways, Point-of-Sale (POS) Terminals, Medical Device Controllers, Smart Energy and IoT Edge Nodes, Automotive Infotainment Head Units.
Industrial HMI Control Panels
The SAM9X60T-V/DWB's 24-bit TFT LCD controller and 600 MHz ARM926EJ-S core make it ideal for industrial HMI panels driving WVGA (800x480) to XGA (1024x768) TFT displays. Its 200 MHz multi-port DDR2/LPDDR controller sustains pixel throughput without screen-tearing, while the extended-temperature grade supports -40C to +85C cabinet operation. Compared to PIC32 MCU-based HMIs, the SAM9X60 adds full Linux support for Qt and Web-based UI frameworks, reducing firmware development time by 30-50%.
推荐
Building Automation Gateways
Building automation gateways using the SAM9X60T-V/DWB benefit from the dual CAN-FD interfaces, Gigabit Ethernet MAC, and USB 2.0 High-Speed ports for simultaneous fieldbus, IP-network, and local-device connectivity. The 64 kB internal SRAM plus external DDR2 supports BACnet, KNX, and Modbus protocol stacks simultaneously. Hardware AES/SHA accelerators enable TLS 1.2 for cloud telemetry without loading the ARM926EJ-S core, while the secure boot ROM prevents unauthorized firmware substitution on field-deployed units.
推荐
Point-of-Sale (POS) Terminals
POS terminals leverage the SAM9X60T-V/DWB's USB 2.0 High-Speed host for multi-peripheral barcode scanners, magnetic-stripe readers, and thermal printers, while the image sensor interface drives customer-facing cameras. The integrated 12-bit ADC samples weight scales and battery telemetry. Full-Linux support enables payment-application isolation via containerized environments, and the tamper-detection pins with secure key storage meet PCI PTS 4.x requirements for payment hardware.
推荐
Medical Device Controllers
Medical device controllers use the SAM9X60T-V/DWB to drive graphical patient interfaces on 24-bit LCDs while running Linux for medical-application software. The hardware cryptographic accelerators secure HIPAA-compliant patient data over Ethernet, and the deterministic ARM926EJ-S core supports soft-real-time waveform sampling. Extended temperature operation accommodates equipment-room ambient ranges, and the secure boot with tamper detection helps satisfy FDA cybersecurity guidance for connected medical devices.
推荐
Smart Energy and IoT Edge Nodes
Smart energy and IoT edge nodes use the SAM9X60T-V/DWB to aggregate sensor data via CAN-FD, RS-485, and Ethernet, run local analytics on the 600 MHz ARM926EJ-S core, and push filtered telemetry over TLS-encrypted links. The 16-bit multi-port DDR2 controller handles large time-series buffers, while the TRNG ensures cryptographic randomness for key generation. Power-saving modes drop consumption to under 50 mW in standby, suitable for solar-powered remote installations.
推荐
Automotive Infotainment Head Units
Automotive infotainment head units leverage the SAM9X60T-V/DWBVAO automotive-qualified variant with the same 228-TFBGA footprint for cost-sensitive display audio and rear-seat entertainment. The 24-bit LCD controller drives 7-10 inch capacitive-touch panels, USB 2.0 High-Speed ports connect to smartphones for CarPlay/AndroidAuto bridging, and CAN-FD interfaces integrate with vehicle networks. Compared to NXP i.MX6 solutions, the SAM9X60 cuts BOM cost by 40% while retaining Linux ecosystem support for Qt/HTML5 HMI development.
推荐
推荐产品汇总
工程参考数据： SAM9X60T-V/DWB ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | SAM9X60-V/DWB | SAM9X60T-V/DWBVAO | SAM9X60D6K-I/4GB |
|---|---|---|---|---|
| Package | 228-TFBGA (11x11) | 228-TFBGA (11x11) - same | 228-TFBGA (11x11) - same | 228-TFBGA (11x11) module - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Frequency | ARM926EJ-S / 600 MHz | ARM926EJ-S / 600 MHz | ARM926EJ-S / 600 MHz | ARM926EJ-S / 600 MHz |
| Temperature Grade | Extended (-40C to +85C) | Commercial (0C to +70C) | Extended automotive (AEC-Q100) | Industrial (-40C to +85C) |
| Internal SRAM | 64 kB | 64 kB | 64 kB | 64 kB |
| Memory Interfaces | DDR2/LPDDR + SDR/LPSDR | DDR2/LPDDR + SDR/LPSDR | DDR2/LPDDR + SDR/LPSDR | DDR2/LPDDR + integrated 4GB e.MMC |
| LCD Controller | 24-bit TFT | 24-bit TFT | 24-bit TFT | 24-bit TFT |
| Approx Unit Price (1000 pcs, USD) | 21.20 | 20.10 | 24.50 | 55.00 (module) |
关键差异点
- Integrated hardware security (secure boot, TRNG, AES/SHA/RSA) at sub-$22 USD BOM （对比 SAM9X60-V/DWB)
- Automotive-grade qualification (AEC-Q100) on the same 228-TFBGA footprint （对比 SAM9X60T-V/DWBVAO)
- Integrated 4 GB e.MMC + Linux-ready module on identical silicon （对比 SAM9X60D6K-I/4GB)
设计说明
Estimated: The 228-TFBGA 11x11 mm package has 0.65 mm ball pitch, requiring a 6-layer PCB minimum with microvia (laser-drilled) stack-up. Use 50-ohm controlled-impedance microstrip for the DDR2/LPDDR address/command traces and 100-ohm differential for the DDR2 DQS pairs; route signals on the top layer with reference ground on layer 2. Decoupling: place 100 nF X7R capacitors within 2 mm of every power/ground ball pair, plus four 10 uF bulk capacitors near the package perimeter.
Supply rails required: VDDCORE (1.0V typical), VDDPLL (1.0V), VDDOSC (1.8V), VDDANA (3.3V for ADC), VDDSDMMC (3.3V or 1.8V), and VDDUSB (3.3V). Use a dedicated LDO for VDDCORE with +/-2% tolerance and 200 mA peak current capability. Power-on reset (POR) holds the core in reset until VDDCORE and VDDBU reach valid thresholds; do not release NRST externally before POR deasserts to avoid undefined core states.
Pitfall 1: Booting from NAND Flash requires 24-bit hardware ECC to be enabled in the boot ROM configuration words; otherwise bit errors corrupt the bootloader. Pitfall 2: The DDR2/LPDDR calibration sequence must run from the bootstrap (BSCR) at every cold-boot; do not skip it for faster startup. Pitfall 3: Quad SPI boot requires the boot ROM to recognize the QSPI device ID; an unsupported e.MMC/JEDEC ID prevents boot even if the silicon is otherwise functional.
合规信息
RoHS compliant per Microchip product page. The T-grade variant is industrial (not AEC-Q100); the VAO suffix variant SAM9X60T-V/DWBVAO is AEC-Q100 automotive-qualified.
