SN74AVC8T245DGVR - 8-Bit Dual-Supply Bus Transceiver | TI
料号： SN74AVC8T245DGVR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1.2 | $1.20 |
| 10 | $1.08 | $10.80 |
| 100 | $0.95 | $95.00 |
| 500 | $0.82 | $410.00 |
| 1,000 | $0.71 | $710.00 |
| 3,000 | $0.58 | $1,740.00 |
SN74AVC8T245DGVR 概述
A dual-supply bus transceiver is a logic IC that bridges two voltage domains in a digital system, allowing a microcontroller or ASIC on one rail (for example 1.8 V) to communicate with peripherals or memory on another rail (for example 3.3 V). The 'dual-supply' architecture uses two independent VCC pins (VCCA and VCCB) so each side of the transceiver references its own rail. Within the broader product taxonomy, this part belongs to the level shifter / voltage translation transceiver family, which sits under interface ICs and ultimately under integrated circuits.
Key features of the SN74AVC8T245 include Ioff partial-power-down support for live insertion and hot-swap scenarios, VCC isolation that forces all I/O into high-impedance when either supply is at GND, and bus-hold circuitry on the data I/Os to eliminate the need for external pull-up or pull-down resistors. The DIR pin controls signal direction (A-to-B or B-to-A), and OE disables the outputs when high. The wide 1.2 V to 3.6 V operating range covers all common logic standards including 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, and lower-voltage CMOS.
Architecturally, the device uses TI's AVC (Advanced Very-low-voltage CMOS) process technology, which combines low static power consumption with high drive strength and fast edge rates. The integrated bus-hold cells use weak feedback transistors to retain the last driven logic state on floating lines, eliminating external bias resistors. Ioff circuitry blocks the internal parasitic diode paths when VCC is removed, so the part can be safely inserted or removed from a powered backplane.
Typical applications include level shifting between a 1.8 V host processor and 3.3 V peripherals, I2C or general-purpose GPIO expansion, SD-card or SIM-card interfaces, and translating logic between FPGAs and DDR memory rails. The wide voltage range makes it useful in industrial, consumer, and portable battery-powered designs.
When designing with this part, place a 0.1 µF decoupling capacitor on each VCC pin and route the DIR and OE pins directly to a GPIO of the controlling host. Avoid leaving either VCC pin floating; unused VCC must be tied to its corresponding rail or to GND to ensure proper high-impedance behavior.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet, helping engineers select and source the part efficiently.
直接替换替代料： SN74AVC8T245DGVR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： SN74AVC8T245DGVR （相同外形与封装尺寸） ——差异在于 Direction Control, Function, Number of Elements, Operating Temperature, Output Enable.
快速对比工具——选择替代料号进行并排对比：
SN74AVC8T245DGVR-Q1
✅ 直接替换📋 参考替代料（不在目录中）
SN74AVC8T245PW
✅ 直接替换📋 参考替代料（不在目录中）
SN74AVCH8T245PW
✅ 直接替换📋 参考替代料（不在目录中）
SN74AXC8T245PW
✅ 直接替换📋 参考替代料（不在目录中）
SN74AVC8T245PWR
✅ 直接替换📋 参考替代料（不在目录中）
74AVC8T245PW
✅ 直接替换📋 参考替代料（不在目录中）
SN74AVC8T245DGVR 最大额定值与电气特性
| 功能 | 8-bit dual-supply bus transceiver with configurable voltage translation |
| Number of Bits | 8 |
| Number of Elements | 1 |
| 输出类型 | 3-State |
| VCCA Range | 1.2 V to 3.6 V |
| VCCB Range | 1.2 V to 3.6 V |
| Direction Control | DIR pin (A-to-B or B-to-A) |
| Output Enable | Active-low OE |
| Output Drive Strength | ±12 mA |
| Propagation Delay | 2.5 ns typical at 3.3 V |
| Ioff Support | Yes (partial-power-down safe) |
| VCC Isolation | Yes (high-Z when either VCC at GND) |
| Bus-Hold | Yes (on data I/Os) |
| 工作温度 | -40 C to +85 C |
| 封装 | 24-pin TVSOP (DGV) |
| 安装类型 | Surface Mount |
| MSL 等级 | 1 (unlimited) |
| RoHS 状态 | Compliant |
SN74AVC8T245DGVR 引脚配置
| 引脚 1 | DIR — Direction control (LOW = B to A, HIGH = A to B) |
| 引脚 2 | A1 — Data I/O, side A |
| 引脚 3 | A2 — Data I/O, side A |
| 引脚 4 | A3 — Data I/O, side A |
| 引脚 5 | A4 — Data I/O, side A |
| 引脚 6 | A5 — Data I/O, side A |
| 引脚 7 | A6 — Data I/O, side A |
| 引脚 8 | A7 — Data I/O, side A |
| 引脚 9 | A8 — Data I/O, side A |
| 引脚 10 | GND — Ground |
| 引脚 11 | B8 — Data I/O, side B |
| 引脚 12 | B7 — Data I/O, side B |
| 引脚 13 | B6 — Data I/O, side B |
| 引脚 14 | B5 — Data I/O, side B |
| 引脚 15 | B4 — Data I/O, side B |
| 引脚 16 | B3 — Data I/O, side B |
| 引脚 17 | B2 — Data I/O, side B |
| 引脚 18 | B1 — Data I/O, side B |
| 引脚 19 | OE — Output enable, active-low |
| 引脚 20 | VCCB — Side-B supply voltage (1.2 V to 3.6 V) |
| 引脚 21 | VCCA — Side-A supply voltage (1.2 V to 3.6 V) |
| 引脚 22 | NC — Not connected (per datasheet) |
| 引脚 23 | NC — Not connected (per datasheet) |
| 引脚 24 | NC — Not connected (per datasheet) |
典型应用
SN74AVC8T245DGVR 适用于 6 应用s: Microcontroller-to-Peripheral Voltage Translation, FPGA-to-DDR Memory Interface Bridging, SD Card / SIM Card Level Shifting, Industrial Sensor Aggregator Networks, Portable Consumer Battery-Powered Devices, Automotive Infotainment Bus Translation.
Microcontroller-to-Peripheral Voltage Translation
The SN74AVC8T245's 1.2 V to 3.6 V dual-rail design makes it ideal for bridging a 1.8 V Cortex-M host MCU to 3.3 V peripherals such as sensors, Bluetooth modules, or LCD drivers. Its 2.5 ns typical propagation delay at 3.3 V preserves timing margins on parallel GPIO buses, while ±12 mA drive strength supports long PCB traces without buffering. Place it directly between the MCU and the peripheral array; ensure both VCC pins are decoupled with 0.1 µF ceramics within 5 mm of the IC.
推荐
FPGA-to-DDR Memory Interface Bridging
FPGAs often operate at 1.5 V or 1.8 V core voltages while DDR2/DDR3 memories operate at 1.8 V or 2.5 V. The SN74AVC8T245 bridges these rails with DIR-controlled direction switching, allowing bidirectional read/write data translation through a single 8-bit bus. Its Ioff feature supports partial-power-down for hot-swap FPGA mezzanine cards, and VCC isolation guarantees high-impedance when either memory or FPGA rail is unpowered during reconfiguration.
推荐
SD Card / SIM Card Level Shifting
SD cards and SIM card interfaces require 1.8 V or 3.3 V signal translation between the host application processor and the removable card. The SN74AVC8T245 provides 8 channels of bidirectional translation in a 24-pin TVSOP that fits into the tight footprint of a phone or IoT device. Bus-hold eliminates the need for external pull-up resistors on SD card data lines, and Ioff protects the host when cards are hot-inserted or removed under power.
推荐
Industrial Sensor Aggregator Networks
Industrial 4-20 mA or digital sensor networks often mix 1.8 V digital sensors with 3.3 V PLC inputs. The SN74AVC8T245 aggregates 8 sensor lines into a single 8-bit bus routed to a PLC controller, with the wide 1.2 V to 3.6 V range accepting any mix of low-voltage sensor outputs. VCC isolation enables safe insertion into live backplanes, while the -40 C to +85 C operating range meets industrial environmental requirements.
推荐
Portable Consumer Battery-Powered Devices
Battery-powered wearables and IoT devices typically run from a 1.2 V to 1.5 V bucked rail, while accessories and chargers operate at 3.3 V. The SN74AVC8T245's 1.2 V minimum VCC makes it ideal for direct connection to a discharged Li-ion cell, while its 12 mA drive supports charging IC signaling at 3.3 V. The low static current and bus-hold minimize battery drain when peripherals are idle.
推荐
Automotive Infotainment Bus Translation
Automotive infotainment systems must translate between 1.8 V or 2.5 V application processors and 3.3 V CAN, LIN, or display backplane peripherals. The SN74AVC8T245DGVR-Q1 variant is AEC-Q100 qualified for -40 C to +125 C automotive operation, and shares the same die as the standard part for design reuse. Bus-hold prevents floating lines on unplugged connectors, and Ioff protects against back-feeding during vehicle cranking transients.
推荐
推荐产品汇总
工程参考数据： SN74AVC8T245DGVR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | SN74AVC8T245DGVR-Q1 | SN74AVC8T245PW | SN74AVCH8T245PW | SN74AXC8T245PW | SN74AVC8T245PWR | 74AVC8T245PW |
|---|---|---|---|---|---|---|---|
| Package | TVSOP-24 (DGV) | TVSOP-24 (DGV) - same | TSSOP-24 - same pinout | TSSOP-24 - same pinout | TSSOP-24 - same pinout | TSSOP-24 - same pinout | TSSOP-24 - same pinout |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Nexperia |
| Bits / Direction | 8-bit bidirectional (DIR-controlled) | 8-bit bidirectional | 8-bit bidirectional | 8-bit bidirectional | 8-bit bidirectional | 8-bit bidirectional | 8-bit bidirectional |
| VCCA Range | 1.2 V to 3.6 V | 1.2 V to 3.6 V | 1.2 V to 3.6 V | 1.2 V to 3.6 V | 0.9 V to 3.6 V (wider) | 1.2 V to 3.6 V | 1.2 V to 3.6 V |
| VCCB Range | 1.2 V to 3.6 V | 1.2 V to 3.6 V | 1.2 V to 3.6 V | 1.2 V to 3.6 V | 0.9 V to 3.6 V (wider) | 1.2 V to 3.6 V | 1.2 V to 3.6 V |
| Output Drive | ±12 mA | ±12 mA | ±12 mA | ±12 mA | ±24 mA (higher) | ±12 mA | ±12 mA |
| Automotive Grade | No (commercial -40 to +85 C) | Yes (AEC-Q100 -40 to +125 C) | No | No | No | No | No |
| Ioff / VCC Isolation | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
关键差异点
- 1.2 V minimum VCC supports sub-1.8 V logic rails （对比 SN74LVC8T245)
- Bus-hold eliminates external pull-up resistors （对比 SN74AXC8T245)
- Ioff and VCC isolation enable live-insertion designs （对比 74AVC8T245PW (Nexperia))
设计说明
Decouple both VCCA (pin 21) and VCCB (pin 20) with a 0.1 µF X7R ceramic capacitor placed within 5 mm of each pin. For designs with high-speed edge rates (>50 MHz), add a 10 µF bulk capacitor near the supply pins to handle transient current spikes. Do not leave either VCC pin floating; if a rail is unused, tie it to its referenced logic rail or to GND to guarantee high-impedance behavior via VCC isolation.
Route the DIR and OE control traces as short as possible and directly from the controlling host GPIO to minimize capacitive coupling. Keep data traces matched in length (within 5 mm) on side A and side B to preserve propagation delay symmetry. For buses above 50 MHz, consider 33 Ω series-termination resistors near the driver output to dampen reflections caused by the TVSOP-24 package lead inductance.
Never apply a signal to side A when VCCA is below 1.2 V or unpowered, as this can back-power the IC through internal ESD diodes and cause latch-up. The DIR pin must be held at a valid logic level (do not float it) or the direction is undefined and both sides may drive simultaneously. OE must be tied to GND via a 10 kΩ resistor if unused, to ensure outputs are enabled by default at power-up.
合规信息
RoHS and REACH compliant per TI product page. Not AEC-Q100 qualified - choose SN74AVC8T245DGVR-Q1 for automotive. Halogen-free per TI green-product standards.
