STM32F745IET6 - 216MHz Cortex-M7 512KB MCU | STMicroelectronics
料号： STM32F745IET6 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
STM32F745IET6 概述
A microcontroller is a compact embedded-computing semiconductor that integrates a processor core, Flash program memory, RAM, peripherals, and communication interfaces on one package. The STM32F7 family belongs to the broader hierarchy of 32-bit MCU, embedded processor, Arm Cortex-M, and semiconductor product categories. It is designed to execute firmware, acquire data, control peripherals, and connect to external sensors, displays, storage, and networks.
The STM32F745IET6 provides 512 KB of Flash memory and a maximum CPU frequency of 216 MHz according to the supplied manufacturer and distributor data. The Cortex-M7 core includes a single-precision floating-point unit, DSP instruction support, L1 cache, and an Art Accelerator. Its 176-LQFP package provides a large pin count suitable for systems that need substantial external peripheral connectivity and board-level signal access.
The STM32F745xx and STM32F746xx families use the same high-performance Arm Cortex-M7 architecture. The STM32F745IET6 is identified as an industrial-temperature ordering variant by the “I” package code, while “ET6” denotes the specified 176-pin LQFP commercial arrangement. The exact operating voltage, RAM capacity, peripheral inventory, pin functions, temperature limits, and package dimensions must be taken from the current STMicroelectronics datasheet because those values are not fully present in the supplied snippets.
Typical uses include industrial automation, IoT equipment, embedded instrumentation, motor-control systems, communications equipment, and connected products. The 216 MHz Cortex-M7 core is suitable for algorithms that benefit from faster execution than entry-level Cortex-M devices, while the single-precision FPU supports common real-time control and signal-processing workloads.
Designers should verify the exact pinout, power requirements, decoupling strategy, clock configuration, and peripheral routing against the manufacturer datasheet before layout or firmware bring-up. The LQFP package is not a compact low-pin-count solution, so pin budgeting and escape routing should be planned early. No verification data supplied here confirms stock quantity, lead time, or current lifecycle status beyond the fact that the manufacturer maintains a product page.
直接替换替代料： STM32F745IET6 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： STM32F745IET6 （相同外形与封装尺寸） ——差异在于 Architecture, DSP Support, Flash Memory, Package.
快速对比工具——选择替代料号进行并排对比：
STM32F746IET6
✅ 直接替换✓ 有现货
$20.5467 / 个
查看数据手册 →STM32F746IET6TR
✅ 直接替换📋 参考替代料（不在目录中）
STM32F745IET6 最大额定值与电气特性
| Product Type | 32-bit ARM Cortex-M7 microcontroller |
| Core | Arm Cortex-M7 |
| Maximum CPU Frequency | 216 MHz |
| Flash Memory | 512 KB |
| Flash Organization | 512K x 8 |
| Architecture | 32-bit RISC |
| Floating-Point Unit | Single-precision FPU |
| DSP Support | Arm DSP instruction set |
| Cache | L1 cache |
| 封装 | 176-pin LQFP, 24 mm x 24 mm |
| 安装类型 | Surface mount |
| Product Family | STM32F7 series |
| Ordering Code | STM32F745IET6 |
STM32F745IET6 176-pin lqfp, 24 mm x 24 mm 引脚配置指南
STM32F745IET6（176-pin lqfp, 24 mm x 24 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： STM32F745IET6.
请参阅 数据手册 以查看完整引脚配置。
典型应用
STM32F745IET6 适用于 6 应用s: Industrial Control Systems, Motor Control, Industrial IoT and Data Acquisition, Audio and DSP, Communications Equipment, Embedded Instrumentation.
Industrial Control Systems
The STM32F745IET6 fits industrial controller designs that need deterministic real-time execution alongside a generous external pin count. Its 216 MHz Cortex-M7 core provides computational headroom for supervisory logic, state machines, data acquisition, and communication tasks, while the 512 KB Flash stores control firmware and configuration data. The single-precision FPU and DSP instructions are useful when control calculations include filtering, transforms, or real-time numeric processing. The 176-pin LQFP can simplify access to multiple sensors, actuators, communication peripherals, and debug signals compared with a low-pin-count MCU. A production design must verify the exact peripheral assignments, supply limits, temperature range, and timing guarantees in the STMicroelectronics datasheet.
推荐
Motor Control
The STM32F745IET6 can serve as the control processor in a sophisticated motor-control platform because its Cortex-M7 core operates up to 216 MHz and includes single-precision floating-point and DSP instructions. Those capabilities support current-loop calculations, speed estimation, signal filtering, and control-law execution when the board also provides suitable power electronics and sensing. The large LQFP package exposes more pins than compact MCUs, which can help connect timers, communication transceivers, and monitoring signals. The exact timer channels, encoder interfaces, ADC characteristics, and pin multiplexing must be checked against the manufacturer documentation before committing to a motor-drive board.
推荐
Industrial IoT and Data Acquisition
The STM32F745IET6 is suitable for connected industrial equipment that combines local measurement, protocol handling, and application logic. Its 216 MHz Cortex-M7 core can process sensor data and manage communication tasks, while 512 KB of Flash provides room for a substantial firmware image. The 176-pin LQFP package is useful when a product needs several external buses, status signals, analog interfaces, or isolated communications links. Designers should separate analog and digital return paths, define power sequencing, and validate signal integrity at the selected 216 MHz operating mode. Exact communication peripheral availability, RAM capacity, and electrical characteristics require verification from the current STMicroelectronics datasheet.
推荐
Audio and DSP
The STM32F745IET6 can be evaluated for audio and DSP workloads that benefit from a fast 32-bit Cortex-M7 pipeline and single-precision floating-point unit. DSP instructions and L1 cache support the device class for filtering, mixing, signal analysis, and other real-time numeric operations. The 512 KB Flash capacity helps accommodate audio control firmware, configuration tables, and update data, although streaming buffers and external storage requirements depend on the complete memory architecture. Use the MCU with appropriately designed clocking, low-noise power, and grounding, and verify codec interface requirements separately. The supplied data confirms the FPU and DSP capability but does not specify audio converters or memory interfaces.
推荐
Communications Equipment
The STM32F745IET6 is appropriate for communications equipment requiring substantial processing performance and a high pin count for control, status, and external interface connections. At 216 MHz, the Cortex-M7 core can support protocol stacks, framing, buffering, diagnostics, and supervisory functions in a single embedded controller. The 512 KB Flash footprint can hold application firmware and protocol components, but the final design must account for RAM, buffer storage, clocking, and transceiver requirements that are not supplied in the search data. Differential interfaces, controlled impedance routing, isolation, and power-supply filtering should be designed around the specific communication PHY rather than inferred from the MCU name.
推荐
Embedded Instrumentation
The STM32F745IET6 can support embedded instrumentation platforms that combine measurement control, signal conditioning, local storage, and communications. Its 216 MHz Cortex-M7 core provides enough throughput for calibration routines, digital filtering, sampling coordination, and user-interface logic, while the 176-pin LQFP offers extensive access to external converters and control signals. The single-precision FPU is valuable for sensor compensation and numeric processing. Engineers should verify ADC performance, timer accuracy, external memory interfaces, and analog supply requirements directly from the manufacturer documentation; those specifications were not included in the supplied snippets. The large package also requires careful thermal placement and decoupling close to the device.
推荐
推荐产品汇总
工程参考数据： STM32F745IET6 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | STM32F746IET6 | STM32F746IET6TR |
|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 176-pin LQFP (24x24 mm) | 176-pin LQFP (24x24 mm) - same stated package format | 176-pin LQFP (24x24 mm) - same stated package format |
| Package Pin Count | 176 pins | 176 pins | 176 pins |
关键差异点
- High-frequency Cortex-M7 processing with DSP and single-precision FPU support （对比 STM32F746IET6)
- 512 KB Flash capacity in a 176-pin LQFP system device （对比 STM32F746IET6TR)
- Large-pin-count package supports extensive board-level connectivity （对比 STM32F746IET6)
设计说明
Plan the LQFP escape routing and land pattern from the current STMicroelectronics package drawing rather than from a generic 176-pin template. The supplied data confirms a 24 mm by 24 mm LQFP, but does not include the complete pin table. Confirm pin 1 orientation, exposed or thermal-pad details if applicable, pad dimensions, solder mask clearance, and courtyard before releasing the PCB footprint.
Do not infer the STM32F745IET6 supply voltage or decoupling requirements from the distributor snippets. Read the manufacturer datasheet for the complete operating-voltage range, power-consumption curves, startup behavior, and recommended capacitor network. Place required bulk and high-frequency decoupling capacitors close to their associated power and ground pins, and preserve a low-impedance return path beneath the device.
The 216 MHz operating rate and LQFP package require thermal validation under worst-case ambient temperature and activity. Use the manufacturer power-consumption data to estimate junction temperature, then account for PCB copper, vias, enclosure, and airflow. Avoid assuming that a large exposed copper area alone guarantees safe operation; verify the package-specific thermal characteristics and test the assembled board at the highest intended clock and I/O load.
Review clock, reset, debug, and high-speed interface routing against the datasheet timing and pin-multiplexing tables. Keep sensitive analog and communication paths away from noisy switching nodes, maintain continuous ground references, and use controlled-impedance routing where external interfaces require it. Because the supplied data does not enumerate the complete peripheral set, each signal’s function, direction, voltage domain, and timing constraints must be verified before layout.
合规信息
The supplied manufacturer and distributor snippets do not provide RoHS, REACH, lead-free, halogen-free, conflict-minerals, or automotive qualification claims. These fields must be confirmed from the current STMicroelectronics product documentation.
