T1024NSN7PQA - QorIQ Dual-Core 1.4GHz PowerPC MPU | NXP
料号： T1024NSN7PQA ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $111.74 | $111.74 |
| 10 | $100.57 | $1,005.70 |
| 100 | $89.39 | $8,939.00 |
| 500 | $80.95 | $40,475.00 |
| 1,000 | $73.15 | $73,150.00 |
T1024NSN7PQA 概述
A QorIQ communications processor is a system-on-chip (SoC) microprocessor built on the Power Architecture instruction set, designed for wired and wireless networking equipment. The T1024 belongs to the QorIQ T1 family, which sits in the broader NXP processor taxonomy as: PowerPC e5500 core -> QorIQ T1 communications SoC -> embedded networking MPU -> Power Architecture processor family. This hierarchy positions it between general-purpose microcontrollers (no integrated networking) and high-end multicore QorIQ T2/T4 processors.
Key differentiating specifications include the dual e5500 cores (vs. single-core T1014/T1013), 1.4 GHz frequency, hardware-accelerated packet processing via DPAA, integrated SerDes lanes supporting multiple 1 GbE and 10 GbE ports, and a compact 23x23 mm package that maintains pin compatibility with the quad-core T1042 and even the eight-core T2081 for single-PCB scalability. The 780-ball HFBGA package supports the high I/O count needed for multiple Ethernet, PCIe, and DDR interfaces.
Architecturally, the T1024NSN7PQA combines Power Architecture e5500 superscalar cores with NXP's Data Path Acceleration Architecture (DPAA), which offloads packet parsing, queue management, and buffer allocation from the cores. This hardware acceleration is critical for line-rate throughput in routers, switches, and network appliances where software-only packet processing cannot scale.
Typical applications include industrial routers and switches, network interface cards (NICs), LTE/5G small cell base stations, industrial IoT gateways, and secure networked embedded appliances requiring deterministic packet throughput. The DDR3L/DDR4 controller supports low-power memory operation for thermally constrained designs.
When designing with this processor, careful PCB layout is essential - the 780-ball BGA requires microvia or via-in-pad technology, length-matched DDR traces, and a solid ground/power plane stackup. The commercial/industrial temperature grade (0 to 105C) makes it suitable for indoor and outdoor sealed enclosures but not extended-temperature automotive deployments.
直接替换替代料： T1024NSN7PQA ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
T1024NXN7PQA
✅ 直接替换📋 参考替代料（不在目录中）
T1042NXN7PQA
✅ 直接替换📋 参考替代料（不在目录中）
T1014NSN7PQA
✅ 直接替换📋 参考替代料（不在目录中）
T1024NSE7PQA
✅ 直接替换📋 参考替代料（不在目录中）
T1022NXN7MQB
✅ 直接替换📋 参考替代料（不在目录中）
T1024NSN7PQA 最大额定值与电气特性
| Family | QorIQ T1 Communications Processor |
| Core Architecture | Power Architecture e5500 (64-bit, dual-core) |
| Number of Cores | 2 |
| Core Frequency | 1.4 GHz |
| 封装 | 780-FBGA (HFBGA) 23x23 mm |
| Number of Terminals | 780 |
| Terminal Form | Ball |
| Memory Controller | DDR3L / DDR4 |
| PCIe Support | PCI Express Gen2/Gen3 |
| Ethernet Support | 1 GbE and 10 GbE (multiple ports via SerDes) |
| Acceleration | Data Path Acceleration Architecture (DPAA) |
| 工作温度 | 0C to 105C (commercial/industrial) |
| 安装类型 | Surface Mount (BGA) |
| Temperature Grade | Other (0-105C) |
| RoHS 状态 | Compliant |
T1024NSN7PQA 780-fbga (hfbga) 23x23 mm 引脚配置指南
T1024NSN7PQA（780-fbga (hfbga) 23x23 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： T1024NSN7PQA.
请参阅 数据手册 以查看完整引脚配置。
典型应用
T1024NSN7PQA 适用于 6 应用s: Industrial Routers and Switches, Network Interface Cards (NICs) and Smart NICs, Wireless Base Station Controllers (LTE/5G Small Cells), Industrial IoT Gateways and Edge Appliances, Secure Networked Embedded Appliances, Industrial Printer and Imaging Controller Printers.
Industrial Routers and Switches
The T1024NSN7PQA fits industrial router and switch applications because its dual e5500 cores at 1.4 GHz combined with DPAA hardware acceleration sustain line-rate packet processing across multiple Ethernet ports without CPU saturation. The integrated 1 GbE and 10 GbE SerDes lanes eliminate the need for external PHY bridges for uplink ports, reducing BOM cost and PCB area. The 23x23 mm 780-FBGA package allows dense multi-port designs. Use it between the PHY/MAC layer and the network stack with DDR3L/DDR4 as packet buffer memory.
推荐
Network Interface Cards (NICs) and Smart NICs
Smart NIC designs benefit from the T1024NSN7PQA's DPAA-accelerated packet processing, which offloads parsing, classification, and queue management from the cores to dedicated hardware engines. This delivers deterministic throughput at line rate while freeing cores for control plane or offload services. The processor's PCIe Gen2/Gen3 controller connects to host systems in standard NIC form factors. The compact 780-FBGA package suits half-height, half-length card layouts.
推荐
Wireless Base Station Controllers (LTE/5G Small Cells)
Small cell base station controllers require deterministic packet timing and high-throughput backhaul interfaces, both of which the T1024NSN7PQA delivers through its DPAA-accelerated networking and 10 GbE uplinks. The 0-105C thermal envelope supports sealed outdoor enclosures in controlled environments. The DDR3L controller supports low-power memory operation, important for fanless small cell designs where thermal dissipation is constrained.
推荐
Industrial IoT Gateways and Edge Appliances
Edge IoT gateways benefit from the T1024NSN7PQA's dual-core processing for running both real-time protocol stacks (Modbus, OPC-UA, MQTT) and edge analytics workloads concurrently. The integrated 1 GbE/10 GbE interfaces handle upstream WAN connectivity while the PCIe lanes support cellular modems and storage. The 780-FBGA package suits compact DIN-rail or panel-mount gateway enclosures. DDR3L/DDR4 support enables flexible memory sizing for analytics buffering.
推荐
Secure Networked Embedded Appliances
Secure networking appliances such as VPN concentrators, firewalls, and UTM devices leverage the T1024NSN7PQA's DPAA for hardware-accelerated encryption and packet inspection. The dual e5500 cores run control-plane management while DPAA handles data-plane throughput, ensuring security processing does not bottleneck line-rate traffic. PCIe Gen2/Gen3 lanes support cryptographic accelerator co-processors for additional security throughput.
推荐
Industrial Printer and Imaging Controller Printers
High-speed industrial printing and imaging controllers benefit from the T1024NSN7PQA's dual-core e5500 processing for handling both image data pipelines and network protocol stacks simultaneously. The integrated 10 GbE interfaces support high-bandwidth imaging data transfer from upstream servers, while PCIe lanes connect to dedicated image processing accelerators. The commercial/industrial 0-105C thermal grade suits factory floor deployments.
推荐
推荐产品汇总
工程参考数据： T1024NSN7PQA ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | T1024NXN7PQA | T1042NXN7PQA | T1014NSN7PQA | T1024NSE7PQA | T1022NXN7MQB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 780-FBGA (HFBGA) 23x23 mm | 780-FBGA (HFBGA) 23x23 mm - same | 780-FBGA (HFBGA) 23x23 mm - same | 780-FBGA (HFBGA) 23x23 mm - same | 780-FBGA (HFBGA) 23x23 mm - same | 780-FBGA (HFBGA) 23x23 mm - same |
| Core Architecture | PowerPC e5500 (dual-core, 64-bit) | PowerPC e5500 (dual-core, 64-bit) | PowerPC e5500 (quad-core, 64-bit) | PowerPC e5500 (single-core, 64-bit) | PowerPC e5500 (dual-core, 64-bit) | PowerPC e5500 (dual-core, 64-bit) |
| Number of Cores | 2 | 2 | 4 | 1 | 2 | 2 |
| Memory Controller | DDR3L / DDR4 | DDR3L / DDR4 | DDR3L / DDR4 | DDR3L / DDR4 | DDR3L / DDR4 | DDR3L / DDR4 |
| Ethernet Support | 1 GbE + 10 GbE (multi-port SerDes) | 1 GbE + 10 GbE | 1 GbE + 10 GbE | 1 GbE + 10 GbE | 1 GbE + 10 GbE | 1 GbE + 10 GbE |
| Hardware Acceleration | DPAA | DPAA | DPAA | DPAA | DPAA | DPAA |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
关键差异点
- Dual-core e5500 in 23x23 mm package with scalability to T1042 and T2081 （对比 T1042NXN7PQA)
- Higher compute throughput vs single-core T1014 （对比 T1014NSN7PQA)
- Pin-compatible with QorIQ T1 family （对比 T1024NSE7PQA)
设计说明
The 780-ball HFBGA package requires microvia or via-in-pad PCB technology. Use a high-layer-count stackup (minimum 8 layers) with dedicated ground and power planes adjacent to the BGA. Route DDR3L/DDR4 traces with length matching per byte lane (typically within 25 mil tolerance), controlled impedance (50 ohm single-ended, 100 ohm differential for PCIe/SerDes), and keep signal traces short to avoid signal integrity issues.
Estimated: at 1.4 GHz dual-core load with all SerDes active, expect approximately 8-12W typical power dissipation. A solid copper thermal pad under the BGA with thermal vias to inner ground planes is required. For sealed enclosures without airflow, design the heatsink interface for a thermal resistance below 3 C/W to keep junction temperature below 105C at worst-case load.
Do not assume T1024 and T1042 are software-compatible in all configurations - while pin-compatible, the quad-core T1042 requires initialization for additional cores and different power sequencing. Always validate boot firmware (U-Boot) and Linux BSP versions against the exact NXP ordering code (T1024NSN7PQA trailing characters encode speed grade, temperature grade, and revision). Using the wrong BSP image can result in non-functional PCIe or DDR3C links.
The T1024NSN7PQA requires multiple voltage rails: core voltage (typically 1.0V), DDR I/O voltage (1.35V for DDR3L or 1.2V for DDR4), SerDes voltage (1.0V), and auxiliary I/O voltages. Use a sequenced power controller to ensure proper rail ramp order. Decoupling capacitors must be located directly beneath or adjacent to BGA balls on the opposite PCB side, using 0402 or 0201 ceramic capacitors.
合规信息
RoHS compliant per verified distributor data (pcbelectronics.com product listing). REACH, halogen-free status, and conflict minerals declarations not present in the provided verified web data. AEC-Q100 not applicable - this is a commercial/industrial-grade communications processor, not an automotive-qualified part.
