XC3S50-4PQG208I - Spartan-3 FPGA, 50K Gates, PQFP-208 | AMD/Xilinx
料号： XC3S50-4PQG208I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $79.26 | $79.26 |
| 10 | $74.8 | $748.00 |
| 100 | $68.4 | $6,840.00 |
| 500 | $62.1 | $31,050.00 |
| 1,000 | $55.85 | $55,850.00 |
XC3S50-4PQG208I 概述
An FPGA (field-programmable gate array) is a reconfigurable integrated circuit whose logic fabric, block RAM, and I/O routing can be redefined after manufacture via a hardware description language (HDL) bitstream. FPGAs sit within the broader programmable logic category alongside CPLDs, and they are commonly chosen over ASICs for low- to mid-volume designs, prototyping, and applications requiring post-deployment firmware updates. The Spartan-3 family positioned Xilinx at the low-cost, high-volume end of the FPGA market, balancing logic density with low static power on a 90 nm process.
Key features of the XC3S50-4PQG208I include 50K system gates, 1,728 logic cells organized across four programmable function blocks (CLB rows), 12 dedicated multiplier blocks for embedded DSP (18x18 signed multipliers), distributed SelectRAM, and SelectIO technology supporting LVCMOS, LVTTL, SSTL, and HSTL signaling standards. The 208-pin PQFP provides 124 usable user I/Os once power and JTAG pins are subtracted, and is the largest PQFP offered in the Spartan-3 family.
Designers should plan for an external 50 MHz to 100 MHz clock source, a JTAG header for in-system programming via the Platform Flash or iMPACT tools, and decoupling per Xilinx application note UG110. The PQFP-208 footprint is legacy-friendly but offers less thermal performance than BGA packages; with the I-suffix industrial temperature rating the part remains viable for outdoor, automotive under-hood, and factory automation deployments.
Typical applications include industrial motor control, low-cost display controllers, glue logic consolidation, and legacy communication bridges. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical PCB-layout design notes not found in the manufacturer datasheet alone.
直接替换替代料： XC3S50-4PQG208I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC3S50-4PQG208I （相同外形与封装尺寸） ——差异在于 Package Type, Device Type, Process Technology, System Gates, Logic Cells.
快速对比工具——选择替代料号进行并排对比：
XC3S50-4PQG208C
✅ 直接替换📋 参考替代料（不在目录中）
XC3S50-5PQG208I
✅ 直接替换📋 参考替代料（不在目录中）
XC3S200-4PQG208I
✅ 直接替换📋 参考替代料（不在目录中）
XC3S1000-4PQG208I
✅ 直接替换📋 参考替代料（不在目录中）
XC3S50-4PQG208I 最大额定值与电气特性
| Family | Spartan-3 |
| Device Type | FPGA - Field Programmable Gate Array |
| System Gates | 50,000 |
| Logic Cells | 1,728 |
| Logic Blocks (CLBs) | 192 |
| Total RAM Bits | 73,728 |
| Number of User I/O | 124 |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Process Technology | 90 nm CMOS |
| Maximum Internal Frequency | 630 MHz |
| Package Type | 208-pin PQFP (BFQFP) |
| 安装类型 | Surface Mount |
| Operating Temperature (Industrial -I) | -40C to +100C junction |
| Dedicated Multipliers (DSP48-like) | 4 (18x18-bit signed) |
| Lead-Free / RoHS | Yes (G suffix indicates lead-free) |
| JTAG Support | Yes (IEEE 1149.1 boundary scan + configuration) |
XC3S50-4PQG208I 208-pin pqfp (bfqfp) 引脚配置指南
XC3S50-4PQG208I（208-pin pqfp (bfqfp) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC3S50-4PQG208I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC3S50-4PQG208I 适用于 6 应用s: Industrial Motor Control, Low-Cost Display Controller, Legacy Communication Bridge, Automotive Infotainment Auxiliary Logic, Test and Measurement Instrumentation, Glue Logic Consolidation.
Industrial Motor Control
The XC3S50-4PQG208I is well-suited for industrial motor control applications including stepper and brushless DC (BLDC) motor drive controllers. Its 1,728 logic cells provide sufficient capacity to implement encoder decoding (QEI), PWM generation (up to 6 channels at 50 kHz), PI velocity/torque loops, and safety logic in a single device. The 124 user I/Os accommodate Hall-effect sensor inputs, multi-axis encoder interfaces, fault inputs, gate-driver enable signals, and CAN/UART communication links. The industrial -40C to +100C temperature grade ensures operation in factory-floor enclosures and outdoor drive cabinets. Designers benefit from the dedicated 18x18 multipliers for field-oriented control (FOC) and space-vector modulation math. The PQFP-208 footprint, while legacy, supports hand-solderable prototyping and rework-friendly manufacturing for low-to-mid volume motor drive products.
推荐
Low-Cost Display Controller
The XC3S50-4PQG208I serves as a flexible timing controller and image-processing engine for cost-sensitive TFT-LCD and OLED display applications. With 73,728 bits of block RAM plus distributed SelectRAM, designers can implement line buffers and small frame buffers for color-space conversion, gamma correction, and on-screen display overlays. The SelectIO banks support LVCMOS, SSTL, and HSTL signaling at speeds compatible with mid-range LVDS display interfaces when LVDS pairs are routed correctly. The 124 user I/Os easily accommodate parallel RGB, 8-bit/16-bit MCU-style interfaces, and SPI/QSPI configuration to display driver ICs. The 90 nm process keeps static power low enough for embedded display modules, and the legacy PQFP package is well-suited to 2-layer and 4-layer consumer display PCBs.
推荐
Legacy Communication Bridge
The XC3S50-4PQG208I excels as a glue-logic bridge between legacy parallel buses (PC/104, ISA, VME, proprietary backplanes) and modern serial interfaces such as UART, SPI, I2C, and CAN. Its 1,728 logic cells comfortably implement bus-state machines, FIFO buffers using block RAM, and protocol converters for industrial retrofit applications. The industrial temperature grade makes the part viable for outdoor telecommunication cabinets and field-instrumentation bridging. The PQFP-208 footprint is convenient for through-hole-style retrofit boards where BGA reflow would be impractical. The 50K-gate capacity also allows modest error-correction or encryption acceleration, useful for secure field-bus gateways.
推荐
Automotive Infotainment Auxiliary Logic
The XC3S50-4PQG208I handles auxiliary video routing, button-matrix scanning, and peripheral arbitration in automotive infotainment head units where a main application processor offloads real-time I/O tasks. The dedicated 18x18 multipliers enable moderate image-scaling and blending operations without burdening the host CPU. The industrial temperature rating is well within automotive cabin environments. The PQFP package supports automotive Tier-1 manufacturing lines that have not transitioned to BGA-only assembly. Designers integrate CAN-FD, LIN, and MOST network bridges alongside the host SoC, leveraging the FPGA's flexibility for late-stage feature additions and OEM-specific customization.
推荐
Test and Measurement Instrumentation
The XC3S50-4PQG208I is ideal for low-channel-count test and measurement instruments such as benchtop logic analyzers, protocol exercisers, and arbitrary waveform generators where waveform synthesis, pattern generation, and trigger logic must run deterministically. Block RAM stores pre-loaded stimulus patterns while logic cells implement custom protocol decoders (I2C, SPI, UART, JTAG) and timing analyzers with sub-microsecond resolution. The SelectIO flexibility lets the FPGA interface directly with 3.3V or 2.5V DUT signals without level shifters. The PQFP-208 footprint is convenient for hand-prototyped instrument front-ends, and the I-suffix industrial temperature rating allows bench or rack operation in standard environments.
推荐
Glue Logic Consolidation
The XC3S50-4PQG208I replaces dozens of legacy 74-series logic packages by consolidating address decoding, bus arbitration, interrupt steering, and timing generation into a single reprogrammable device. Engineers migrating legacy designs from discrete TTL/CMOS logic to programmable logic appreciate the 50K-gate density, the 124 user I/Os that accommodate wide address/data buses, and the JTAG-based in-system reprogrammability for late-stage bug fixes. The PQFP-208 footprint fits onto retrofitted boards with minimal PCB rework, and the legacy ISE WebPACK toolchain remains freely available for engineers maintaining installed equipment. Power consumption stays modest thanks to the low-static-power Spartan-3 architecture.
推荐
推荐产品汇总
工程参考数据： XC3S50-4PQG208I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC3S50-4PQG208C | XC3S50-5PQG208I | XC3S200-4PQG208I | XC3S1000-4PQG208I |
|---|---|---|---|---|---|
| Brand | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) |
| Package | 208-pin PQFP (BFQFP) | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same |
| System Gates | 50,000 | 50,000 | 50,000 | 200,000 | 1,000,000 |
| Logic Cells | 1,728 | 1,728 | 1,728 | 4,320 | 17,280 |
| User I/O | 124 | 124 | 124 | 141 | 141 |
| Total RAM Bits | 73,728 | 73,728 | 73,728 | 221,184 | 442,368 |
| Dedicated Multipliers (18x18) | 4 | 4 | 4 | 12 | 24 |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C |
| Speed Grade | -4 | -4 | -5 (faster) | -4 | -4 |
关键差异点
- Lowest-cost 50K-gate Spartan-3 with industrial temperature rating in PQFP-208 （对比 XC3S50-4PQG208C)
- Faster speed grade option available in same footprint （对比 XC3S50-5PQG208I)
- PQFP-208 footprint offers hand-solderable prototype convenience over BGA packages （对比 XC3S50-4FGG256I)
设计说明
Estimated: VCCINT core supply must be regulated to 1.14V to 1.26V with a peak current of approximately 200 mA during configuration plus the dynamic current proportional to toggle rate. Use a low-noise LDO (such as a TPS7A45 set to 1.2V) or a switching regulator followed by an LDO post-filter. Each VCCO bank can draw tens of milliamps; place 100 nF X7R bypass caps adjacent to every supply pin and bulk 10 uF tantalum or ceramic on each bank rail. Spartan-3 power-on ramp must follow the monotonic sequence documented in DS099-1, with VCCINT leading VCCO by no more than the datasheet-specified window to avoid I/O buffer latch-up.
The 208-pin PQFP package has a 1.0 mm pitch; route signals on at least 4 inner layers with 0.15 mm trace width and 0.15 mm clearance. Escape via fanout should use staggered microvias or dog-bone through-vias. Provide a continuous ground plane on layer 2 directly beneath the device to minimize return-path inductance. Place configuration-mode resistors (M0, M1, M2 pull-ups/downs) within 25 mm of the package pins. Reserve a JTAG header footprint (2x5 0.1-inch header or Tag-Connect TC2030) near the device for in-system programming access. Plan thermal copper pours across all layers tied to the central GND pad to spread heat away from internal switching.
Do not confuse the Spartan-3 (XC3S) part with the Spartan-3A (XC3SxxA), Spartan-3E (XC3SxxE), or Spartan-3AN (XC3SxxAN) families - they are NOT pin-compatible even when the package code matches. Designers migrating within Spartan-3 (e.g. XC3S50 to XC3S200 in PQFP-208) must verify pin-by-pin compatibility in DS099 module 3 before committing PCB artwork. A second common pitfall is leaving the PROG_B pin floating - tie it to VCCO via a 4.7 kohm pull-up so the device does not enter spurious configuration cycles. Finally, never drive the JTAG TDI pin from an active source while the device is also configured from a Platform Flash PROM; resolve bus contention with the series resistor approach shown in Xilinx app-note UG110.
合规信息
G-suffix confirms lead-free matte-tin finish compliant with RoHS directives. Spartan-3 family FPGAs are not AEC-Q100 qualified; for automotive safety-critical applications, evaluate Spartan-6 or Artix-7 with AEC-Q100 documentation. Halogen-free status was not explicitly stated in the verified web data and is marked unknown.
